Infineon Technologies Other Function Telecom Interface ICs 1,022

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TDA5660X	Infineon Technologies		COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR		40 mA	11 V	11	SMALL OUTLINE	SOP20,.4	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G20				Not Qualified	e0
TDA5235	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.015 mA	3.3 V	3.3,5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified	e4		260	9.7 mm
BGS14BN14	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-30 Cel	MATTE TIN	QUAD		S-XQCC-N14		.77 mm	1.6 mm		e3			1.6 mm
BGM15LA12	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1				2.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel	GOLD NICKEL	BOTTOM		R-XBCC-B12	1	.65 mm	1.1 mm		e4			1.9 mm
BGSA143ML10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT																								1
TDK5116F	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		.021 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel		DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified			260	3 mm
TDA7200XT	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	-20 Cel		DUAL		R-PDSO-G28		1.2 mm	4.4 mm	Not Qualified				9.7 mm
TDA5201XT	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G28		1.2 mm	4.4 mm			NOT SPECIFIED	NOT SPECIFIED	9.7 mm
TDA5212XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified				9.7 mm
BGS17GA14	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	14		SQUARE	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel		QUAD		S-XQMA-B14	1	.65 mm	2 mm					2 mm
BGS12AL76E6327XTMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1				2.8 V		CHIP CARRIER			.48 mm	85 Cel	-30 Cel	GOLD	BOTTOM		R-XBCC-B6	1	.4 mm	1.4 mm		e4			1.26 mm
BGS15MA12E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	12	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1	CMOS			2.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-30 Cel		QUAD		R-XQCC-N12	1	.65 mm	1.1 mm					1.9 mm
BGS12AL7-4	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1				2.8 V		CHIP CARRIER			.55 mm	85 Cel	-30 Cel		BOTTOM		R-XBCC-B6	1	.5 mm	1.5 mm					2.3 mm
TDA5252G2	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	38	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3 V	2.5/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP38,.25,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G38		1.2 mm	4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	9.7 mm
BGS15MA12	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	12	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1	CMOS			2.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-30 Cel		QUAD		R-XQCC-N12	1	.65 mm	1.1 mm					1.9 mm
BGM15HA12	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1				2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD		R-XQCC-N12	1	.65 mm	1.1 mm					1.9 mm
TDA5221XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	105 Cel	-40 Cel	TIN	DUAL		R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified	e3			9.7 mm
TDA5220	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.0079 mA	5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	105 Cel	-40 Cel		DUAL		R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified			260	9.7 mm
BGM15MA12E6327	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1				2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD		R-XQCC-N12		.65 mm	1.1 mm			NOT SPECIFIED	NOT SPECIFIED	1.9 mm
TDA5211	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.0075 mA	5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	105 Cel	-40 Cel		DUAL		R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified			260	9.7 mm
TDA7100	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		.0046 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	70 Cel	-20 Cel	MATTE TIN	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3		260	3 mm
TDA5102	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.0095 mA	3 V	2.1/4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	85 Cel	-25 Cel		DUAL		R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified			260	5 mm
TDA5255	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	38	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G38	3	1.2 mm	4.4 mm				260	9.7 mm
BGS12SL6	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1				3 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM		R-XBCC-B6		.32 mm	.7 mm					1.1 mm
TDA5255XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	38	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G38	3	1.2 mm	4.4 mm					9.7 mm
CYBT-413061-02	Infineon Technologies	TELECOM CIRCUIT																								3
CYBLE-333073-02	Infineon Technologies	TELECOM CIRCUIT
CYW20733A3KML1G	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	70 Cel	0 Cel		QUAD		S-XQCC-N56		1 mm	7 mm					7 mm
CYW43353LIUBG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	145	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949		1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA145,12X12,16		.4 mm	85 Cel	-40 Cel		BOTTOM	433.3 Mbps	R-PBGA-B145		.55 mm	4.87 mm					5.413 mm
CYW20736S	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	48		SQUARE	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	TIN SILVER COPPER	UNSPECIFIED		S-XXMA-B48	3	1.18 mm	6.5 mm		e1			6.5 mm
CYW4356XKWBGT	Infineon Technologies																									1
CYBT-343151-02	Infineon Technologies	TELECOM CIRCUIT																								3
CYW4356XKUBGT	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	192	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B192	1	.55 mm	4.87 mm					7.67 mm
CYW4339XKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	286	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B286		.41 mm	4.87 mm					5.413 mm
CYW4343SKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	74	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	70 Cel	-30 Cel		BOTTOM		R-PBGA-B74		.55 mm	2.87 mm					4.87 mm
CYW43362SKUBGT	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	69	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B69	1	.55 mm	2.92 mm		e1			4.52 mm
CYBL21571-56LQXI	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N56		.6 mm	7 mm					7 mm
CYW20735KFBG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	111	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B111		.97 mm	9 mm					9 mm
CY7C9537-BLC	Infineon Technologies
CYW20719B2KUMLG	Infineon Technologies	TELECOM CIRCUIT
CYBT-333047-02	Infineon Technologies	TELECOM CIRCUIT																								3
CYW20745A0KMLG	Infineon Technologies	TELECOM CIRCUIT
CYBL21171-56LQXI	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N56		.6 mm	7 mm					7 mm
CY7C9537B	Infineon Technologies
CYW43362KUBGT	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	69	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B69	1	.55 mm	2.92 mm		e1			4.52 mm
CYW4339NKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	160	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B160		1 mm	8 mm					8 mm
CYW43362KUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	69	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B69		.55 mm	2.92 mm					4.52 mm
CY7B933-SXCT	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		.155 mA	5 V	5	SMALL OUTLINE	SOP28,.4	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL	400 Mbps	R-PDSO-G28	3	2.67 mm	7.505 mm	Not Qualified	e4	30	260	17.905 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.