Infineon Technologies Other Function Telecom Interface ICs 1,022

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-2	Carrier Type-1	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
PBA31301/3S	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL EXTENDED	BALL	34	LBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			2.8 V		GRID ARRAY, LOW PROFILE			1.27 mm	75 Cel	-10 Cel		BOTTOM	R-PBGA-B34		1.6 mm			10.2 mm	Not Qualified				14 mm
PEF2256HV2.2-G	Infineon Technologies		INDUSTRIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS		145 mA		1.8,3.3	FLATPACK	QFP80,.68SQ	Other Telecom ICs	.635 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G80			T-1(DS1)	CEPT PCM-30/E-1		Not Qualified
BGA771N16	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	S-PQCC-N16		.625 mm			2.3 mm			NOT SPECIFIED	NOT SPECIFIED	2.3 mm
PSB21383	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3/5	FLATPACK	QFP44,.5SQ,32	Other Telecom ICs	.8 mm	70 Cel	0 Cel		QUAD	S-PQFP-G44		2.45 mm			10 mm	Not Qualified				10 mm
V23845-M1322	Infineon Technologies
PSB2115FV1.1	Infineon Technologies	TELECOM CIRCUIT		GULL WING	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	1						FLATPACK, LOW PROFILE			.6 mm				QUAD	S-PQFP-G64		1.6 mm			10 mm	Not Qualified				10 mm
BCM20713A1KUFBXG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	50	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100		1.22 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B50	3	.6 mm			4 mm		e1		260	4.5 mm
NAC1080	Infineon Technologies	TELECOM CIRCUIT
IFW56810-00	Infineon Technologies	TELECOM CIRCUIT
CYSBSYS-RP01	Infineon Technologies	TELECOM CIRCUIT
BCM20715A1KUBXG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1.22 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B42		.6 mm			2.509 mm					3.019 mm
BCM4330XKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM	S-PBGA-B144		1 mm			6.5 mm					6.5 mm
BCM43241FKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	208	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B208		1.05 mm			7 mm					9 mm
CG8883AMT	Infineon Technologies	TELECOM CIRCUIT
BCM43455HKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	140	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B140		.6 mm			4.47 mm					5.27 mm
CG8883AM	Infineon Technologies	TELECOM CIRCUIT
BCM43241XKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	208	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B208		1.05 mm			7 mm					9 mm
BCM4334XKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	109	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B109		.55 mm			4.08 mm					4.48 mm
BCM4329GKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	182	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B182		.55 mm			5.62 mm					6.57 mm
BCM4334WKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	109	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B109		.55 mm			4.08 mm					4.48 mm
BCM43241DKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	208	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B208		1.05 mm			7 mm					9 mm
BCM4354XKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	395	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B395		.33 mm			4.87 mm					7.67 mm
BCM43438KUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	63	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	70 Cel	-30 Cel		BOTTOM	R-PBGA-B63		.55 mm			2.87 mm					4.87 mm
BCM4330GKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	225	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B225		.41 mm			4.89 mm					5.33 mm
BCM43241ZKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	208	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B208		1.05 mm			7 mm					9 mm
BCM20733A3KFB2G	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	121	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B121		1.1 mm			9 mm					9 mm
BCM4343WKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	74	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	70 Cel	-30 Cel		BOTTOM	S-PBGA-B74		.55 mm			2.87 mm					4.87 mm
BCM20710A1KUFBXG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	50	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1.22 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B50		.6 mm			4 mm					4.5 mm
BCM4325GKFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.25 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM	S-PBGA-B196		1.05 mm			7.5 mm					7.5 mm
BCM4329EKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	182	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B182		.55 mm			5.62 mm					6.57 mm
BCM43236BKMLG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	88	VQCCN	SQUARE	UNSPECIFIED	YES	1				1.2 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	65 Cel	0 Cel		QUAD	S-XQCC-N88		.9 mm			10 mm					10 mm
WM72016-6-DG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES				.025 mA	2.5 V	2.5	SMALL OUTLINE	SOLCC8,.12,25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N8						Not Qualified
BCM4354XKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	192	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B192		.55 mm			4.87 mm					7.67 mm
BCM4325FKFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.25 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM	S-PBGA-B196		1.05 mm			7.5 mm					7.5 mm
BCM88335L2CUBG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	145	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100		1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B145		.55 mm			4.87 mm					5.413 mm
CYW89035CWMLG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	60	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	AEC-Q100		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N60		.9 mm			7 mm					7 mm
BCM43340HKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	141	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B141		.55 mm			4.47 mm					5.67 mm
BCM43903KUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	151	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B151		.55 mm			4.91 mm					5.85 mm
BCM4330FKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	133	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B133		.55 mm			4.89 mm					5.33 mm
BCM20705A1KWFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	50	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1.22 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B50		.8 mm			4 mm					4.5 mm
BCM43241GKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	208	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B208		1.05 mm			7 mm					9 mm
BCM4325FKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	339	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.25 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B339		.42 mm			5.81 mm					6.51 mm
BCM43303KUBG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	133	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B133		.55 mm			4.89 mm					5.33 mm
BCM4339XKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	286	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B286		.41 mm			4.87 mm					5.413 mm
CG8674BAT	Infineon Technologies
BCM43236KMLG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	65 Cel	0 Cel		QUAD	S-XQCC-N88		.9 mm			10 mm					10 mm
CYW89820BWMLG	Infineon Technologies	TELECOM CIRCUIT
BCM4330FKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	225	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B225		.41 mm			4.89 mm					5.33 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.