Onsemi Other Function Telecom Interface ICs 241

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AMIS-53050-I/A-XTP	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					FLATPACK	QFP32(UNSPEC)			85 Cel	-40 Cel		QUAD	.128 Mbps	R-PQFP-G32
19699-002-XTP	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G44		1.6 mm	10 mm	Not Qualified				10 mm
TCP-5112UA-DT	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	BALL	3	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA3(UNSPEC)		.55 mm	85 Cel	-30 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM		R-PBGA-B3		.375 mm	.772 mm		e1	5	260	.993 mm
MTK-40130-I	Onsemi	TELECOM CIRCUIT	INDUSTRIAL							1				3.3 V						85 Cel	-40 Cel								Not Qualified
NLAS7242MUTBG	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		R-XQCC-N10	1	.6 mm	1.4 mm		e4	30	260	1.8 mm
LV2258PV	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP24,.3		.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G24		1.5 mm	5.6 mm					7.8 mm
TCP-4127UB-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM		R-PBGA-B4	1	.345 mm	.609 mm		e4		260	.626 mm
NLHVQ011USG	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				20 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G8	1	.9 mm	2 mm		e3	30	260	2.3 mm
N24RF16DWPT3G	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.5 V		SMALL OUTLINE			1.27 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm		e4	30	260	4.9 mm
19608-004-XTP	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS					FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32		1.6 mm	7 mm	Not Qualified				7 mm
LV2285VB	Onsemi	TELECOM CIRCUIT	OTHER	GULL WING	24	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3.3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.5 mm	85 Cel	-10 Cel		DUAL		R-PDSO-G24		1.5 mm	4.4 mm					6.5 mm
AX-SFEU-API-1-01-TB05	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2X.27,20		.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		R-PQCC-N40	1	1 mm	5 mm		e4		260	7 mm
TCP-5127XA-DT	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	BALL	3	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA3(UNSPEC)		.55 mm	85 Cel	-30 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM		R-PBGA-B3		.375 mm	.772 mm		e1	5	260	.94 mm
LA8580W	Onsemi		COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES		BIPOLAR		21 mA	5 V	5	FLATPACK	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	70 Cel	-20 Cel		QUAD		S-PQFP-G64				Not Qualified
19293-004-DIE	Onsemi	TELECOM CIRCUIT	COMMERCIAL	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1				3 V		UNCASED CHIP				50 Cel	0 Cel		UPPER		X-XUUC-N				Not Qualified
SX043HT	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK				70 Cel	0 Cel		QUAD		R-PQFP-G64				Not Qualified
19608-004-XTD	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS					FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32		1.6 mm	7 mm	Not Qualified				7 mm
TCP-4182UB-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM		R-PBGA-B4	1	.345 mm	.609 mm		e4		260	1.009 mm
LC898214XD-MH	Onsemi	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			2.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	70 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B8	1	.33 mm	1.15 mm		e1	30	260	2.37 mm
LC898214XC-MH	Onsemi	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			2.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	70 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B8	1	.45 mm	1.15 mm		e1	30	260	2.37 mm
SX042HQ	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK				70 Cel	0 Cel		QUAD		R-PQFP-G64				Not Qualified
AX5031-1-TW30	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	1 mm	4 mm		e3	30	260	4 mm
TCP-3047N-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B12		.611 mm	.722 mm					1.179 mm
TCP-3056H-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1						CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD		R-XQCC-N6		1 mm	1.2 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
SX043T	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK				70 Cel	0 Cel		QUAD		R-PQFP-G64				Not Qualified
AMIS-52150-XTP	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.025 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	ATM/SONET/SDH ICs	.65 mm	50 Cel	0 Cel		DUAL		R-PDSO-G20		2 mm	5.3 mm	Not Qualified				7.2 mm
TCP-4127UA-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM		R-PBGA-B4	1	.345 mm	.609 mm		e4		260	.862 mm
AX5031-1-TA05	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20		.5 mm	85 Cel	-40 Cel	TIN	QUAD		S-XQCC-N20	1	1 mm	4 mm		e3		260	4 mm
LC72710W	Onsemi		INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS		25 mA	5 V	5	FLATPACK	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G64				Not Qualified
AMIS-49200	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1		1		3 V	3,5	FLATPACK	QFP44,.5SQ,32	Network Interfaces	.8 mm	85 Cel	-40 Cel		QUAD	.03125 Mbps	S-PQFP-G44				Not Qualified
AMIS49587C5871RG	Onsemi	TELECOM CIRCUIT	OTHER	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			.08 mA	3.3 V	3.3	CHIP CARRIER	LDCC28,.5SQ	Modems	1.27 mm	80 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-PQCC-J28	3	4.572 mm	11.506 mm	Not Qualified	e3	30	260	11.506 mm
TCP-3012H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B8		.639 mm	.722 mm					.879 mm
AX-SFAZ	Onsemi	TELECOM CIRCUIT
LC72720YV-TLM-E	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	30	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN BISMUTH	DUAL		R-PDSO-G30	4	1.5 mm	5.6 mm		e6	30	260	9.75 mm
LC72725KVS	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G16		1.5 mm	4.4 mm					5.2 mm
NB7VQ1006MMNHTBG	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			.2 mA	1.8 V	1.8/2.5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	4 mm	Not Qualified				4 mm
LC72725KMA	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G16		1.75 mm	3.9 mm					9.9 mm
NB7VQ1006MMNTXG	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			.2 mA	1.8 V	1.8/2.5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N24	1	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
TCP-3012H-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VSON	RECTANGULAR	UNSPECIFIED	YES	1						SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		DUAL		R-XDSO-N6		1 mm	1.2 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
SX042Q	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK				70 Cel	0 Cel		QUAD		R-PQFP-G64				Not Qualified
AX5051-1-TW30	Onsemi	TELECOM CIRCUIT																				NICKEL GOLD PALLADIUM				1					30	260
TCP-3027HA-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1						CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD		R-XQCC-N6		1 mm	1.2 mm					1.6 mm
AX-SF10-ANT21-868	Onsemi	TELECOM CIRCUIT
AX-SFEU-API-1-01-TX30	Onsemi	TELECOM CIRCUIT																				NICKEL GOLD PALLADIUM				1					30	260
19699-002-XTD	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G44		1.6 mm	10 mm	Not Qualified				10 mm
LC72709W	Onsemi		INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS		25 mA	5 V	5	FLATPACK	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G64				Not Qualified
N24RF16EDTPT3G	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.25		.65 mm	105 Cel	-40 Cel		DUAL		R-PDSO-G8	1	1.2 mm	3 mm			NOT SPECIFIED	260	4.4 mm
AX5044-1-TW30	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	.2 Mbps	S-PQCC-N28		1 mm	5 mm					5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.