Onsemi Other Function Telecom Interface ICs 241

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AMIS-52100-I	Onsemi		COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES				25 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Other Telecom ICs	.635 mm	50 Cel	0 Cel		DUAL		R-PDSO-G20				Not Qualified
TCP-4168UB-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM		R-PBGA-B4	1	.345 mm	.609 mm		e4		260	1.009 mm
TCP-3039H-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1						CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD		R-XQCC-N6		1 mm	1.2 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
AMIS-52150	Onsemi		COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES				25 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Other Telecom ICs	.635 mm	50 Cel	0 Cel		DUAL		R-PDSO-G20				Not Qualified
TCP-3039NQT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1						CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD		R-XQCC-N6		1 mm	1.2 mm					1.6 mm
LC72708E	Onsemi		INDUSTRIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS		25 mA	5 V	5	FLATPACK	QFP44,.5SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G44				Not Qualified
19608-003-XTP	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS					FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32		1.6 mm	7 mm	Not Qualified				7 mm
AX-SFAZ-1-01-TB05	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2X.27,20		.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	.0006 Mbps	R-PQCC-N40		1 mm	5 mm		e4			7 mm
SX042T	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK				70 Cel	0 Cel		QUAD		R-PQFP-G64				Not Qualified
LV72715PLG	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	BUTT	68	VFLGA	SQUARE	UNSPECIFIED	YES	1	CMOS			3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		S-XBGA-B68		.85 mm	6 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm
TCP-4112UB-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM		R-PBGA-B4	1	.345 mm	.609 mm		e4		260	.626 mm
NB7VQ1006MMNG	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			.2 mA	1.8 V	1.8/2.5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N24	1	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
NL3HS644BFCTAG	Onsemi	TELECOM CIRCUIT		BALL	36	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm				BOTTOM		S-PBGA-B36		.54 mm	2.34 mm			NOT SPECIFIED	NOT SPECIFIED	2.34 mm
LV2257PTT	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		.5 mm	85 Cel	-40 Cel		DUAL		S-PDSO-G10		1.1 mm	3 mm					3 mm
TCP-3039H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	10	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B10		.611 mm	.722 mm					1.029 mm
TCP-3056H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B12		.611 mm	.722 mm					1.179 mm
19293-001-XTP	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	50 Cel	0 Cel		DUAL		R-PDSO-G20		2 mm	5.3 mm	Not Qualified				7.2 mm
LV2282VA	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3.3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP24,.25		.2 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G24		1.5 mm	4.4 mm					6.5 mm
LC898212XD-SH	Onsemi	TELECOM CIRCUIT		BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm			TIN SILVER COPPER	BOTTOM		R-PBGA-B12	1	.69 mm	1.37 mm		e1	30	260	1.77 mm
19608-002-XTP	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS					FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQFP-G32		1.6 mm	7 mm	Not Qualified	e0			7 mm
N24RF64DTPT3G	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.25		.65 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.02648 Mbps	R-PDSO-G8	1	1.2 mm	3 mm		e4	30	260	6.4 mm
TCP-3056N-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B12		.611 mm	.722 mm					1.179 mm
TCP-3068H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B12		.611 mm	.722 mm					1.179 mm
LC72711W	Onsemi		INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS		25 mA	5 V	5	FLATPACK	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G64				Not Qualified
19637-002-XTP	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS					FLATPACK			.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32			7 mm	Not Qualified				7 mm
19608-002-XTD	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS					FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQFP-G32		1.6 mm	7 mm	Not Qualified	e0			7 mm
FUSB15101MNTWG	Onsemi	TELECOM CIRCUIT
MC33169DTB-4R2	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				4.8 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G14	1	1.2 mm	4.4 mm	Not Qualified	e4			5 mm
MC33170DTBR2	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14		1.2 mm	4.4 mm	Not Qualified	e4		260	5 mm
MC33169DTB-004	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				4.8 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G14		1.2 mm	4.4 mm	Not Qualified				5 mm
MC33169DTB-4.0	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				4.8 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G14		1.2 mm	4.4 mm		e0			5 mm
MC33170DTB	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14		1.2 mm	4.4 mm	Not Qualified	e4		260	5 mm
NCV7428D1L3R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100		12 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	2	1.72 mm	3.937 mm		e3	30	260	4.927 mm
NCH-RSL10-01S51-ACG	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	BUTT	51	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.25 V		CHIP CARRIER			.7 mm	85 Cel	-40 Cel		BOTTOM	4 Mbps	R-PBCC-B51		1.56 mm	6 mm			NOT SPECIFIED	NOT SPECIFIED	8 mm
NCH-RSL10-101WC51-ABG	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	BALL	51	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.25 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA51,11X11,10		.252 mm	85 Cel	-40 Cel	TIN SILVER	BOTTOM	2 Mbps	R-PBGA-B51	1	.381 mm	2.325 mm		e2	30	260	2.364 mm
NCV7425DW5R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				12 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G16	2	2.65 mm	7.5 mm		e3	30	260	10.3 mm
LA72910V-TLM-E	Onsemi		OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES					5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	-30 Cel	TIN BISMUTH	DUAL		R-PDSO-G16	3			Not Qualified	e6	30	260
NCV7428MW3R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	1 mm	3 mm		e3	30	260	3 mm
LA72910V-MPB-E	Onsemi		OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES					5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	-30 Cel	TIN BISMUTH	DUAL		R-PDSO-G16	3			Not Qualified	e6	30	260
LA72914V-MPB-H	Onsemi		COMMERCIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR		.04 mA	5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	-20 Cel	TIN BISMUTH	DUAL		R-PDSO-G16	3			Not Qualified	e6	30	260
NCV7425DW0G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				12 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	TIN	DUAL		R-PDSO-G16		2.65 mm	7.5 mm		e3			10.3 mm
NCV7428MWL5R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	1 mm	3 mm		e3	30	260	3 mm
NCV7425DW0R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				12 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	TIN	DUAL		R-PDSO-G16	2	2.65 mm	7.5 mm		e3		260	10.3 mm
NCV7428MWL3R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	1 mm	3 mm		e3	30	260	3 mm
NCV7425DW5G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				12 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	TIN	DUAL		R-PDSO-G16		2.65 mm	7.5 mm		e3			10.3 mm
LA72910V-MPB-H	Onsemi		OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES					5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	-30 Cel	TIN BISMUTH	DUAL		R-PDSO-G16	3			Not Qualified	e6	30	260
NCV7428D1L5R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100		12 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	2	1.72 mm	3.937 mm		e3	30	260	4.927 mm
NCH-RSL15-512-101Q40-ACG	Onsemi	TELECOM CIRCUIT																													NOT SPECIFIED	NOT SPECIFIED

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.