Onsemi Other Function Telecom Interface ICs 241

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
NCH-RSL10-101Q48-ABG	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.25 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	2 Mbps	S-XQCC-N48	3	1 mm	6 mm		e3	30	260	6 mm
AX5043-1-TW30	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20		.5 mm	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	.125 Mbps	S-XQCC-N28	1	1 mm	5 mm			30	260	5 mm
NCH-RSL10-101S51-ACG	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	BUTT	51	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					1.25 V		GRID ARRAY, LOW PROFILE, FINE PITCH	MODULE,51LEAD(UNSPEC)		.7 mm	85 Cel	-40 Cel		UNSPECIFIED	4 Mbps	R-PBGA-B51	3	1.56 mm	6 mm			NOT SPECIFIED	260	8 mm
FUSB340TMX	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD		R-PQCC-N18	1	.45 mm	2 mm		e4	30	260	2.8 mm
AX5243-1-TW30	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	1 mm	4 mm		e3	30	260	4 mm
AX-SFEU-1-01-TB05	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2X.27,20		.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		R-PQCC-N40	1	1 mm	5 mm		e4		260	7 mm
AX5243-1-TA05	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	QUAD		S-XQCC-N20	1	1 mm	4 mm		e3		260	4 mm
AX-SFEU-1-03-TX30	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2X.27,20		.5 mm	85 Cel	-40 Cel		QUAD		R-PQCC-N40		1 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	7 mm
AX-SFAZ-API-1-01-TB05	Onsemi	TELECOM CIRCUIT																					Nickel/Palladium/Gold (Ni/Pd/Au)								e4
NCV7428D13R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100			12 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	2	1.72 mm	3.937 mm		e3	30	260	4.927 mm
LA72910V-TLM-H	Onsemi		OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES						5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	-30 Cel	TIN BISMUTH	DUAL		R-PDSO-G16	3			Not Qualified	e6	30	260
MC100SX1230FN	Onsemi	TELECOM CIRCUIT	OTHER	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR				5 V	-4.2/-5.46	CHIP CARRIER	LDCC28,.5SQ	Network Interfaces	1.27 mm	85 Cel	0 Cel	TIN LEAD	QUAD		S-PQCC-J28		4.57 mm	11.505 mm	Not Qualified	e0		235	11.505 mm
NCV7428MW5R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1					12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	1 mm	3 mm		e3	30	260	3 mm
LA72912V-MPB-H	Onsemi		OTHER	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR			.032 mA	5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP24,.3	Other Telecom ICs	.635 mm	70 Cel	-30 Cel	TIN BISMUTH	DUAL		R-PDSO-G24	3			Not Qualified	e6	30	260
LA72914V-TLM-H	Onsemi		COMMERCIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR			.04 mA	5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	-20 Cel	TIN BISMUTH	DUAL		R-PDSO-G16	3			Not Qualified	e6	30	260
LC72710LW	Onsemi		INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS			20 mA		3/3.3	FLATPACK	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G64				Not Qualified
AX5051-1-TA05	Onsemi	TELECOM CIRCUIT																					NICKEL PALLADIUM GOLD				1				e4	30	260
19637-001-XTD	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK			.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32			7 mm	Not Qualified				7 mm
NMF3506FCT1G	Onsemi	TELECOM CIRCUIT
19637-002-XTD	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK			.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32			7 mm	Not Qualified				7 mm
TCP-3082N-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1							GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B12		.611 mm	.722 mm					1.179 mm
NL3HS644FCTAG	Onsemi	TELECOM CIRCUIT		BALL	36	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm				BOTTOM		S-PBGA-B36		.54 mm	2.34 mm			NOT SPECIFIED	NOT SPECIFIED	2.34 mm
SX072	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					3.3 V		IN-LINE				85 Cel	-40 Cel		DUAL		R-PDIP-T8				Not Qualified
AMIS-49200-XTP	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1			1	.0008 mA	3 V	3,5	FLATPACK	QFP44,.47SQ,32	Network Interfaces	.8 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	.03125 Mbps	S-PQFP-G44	3	1.6 mm	10 mm	Not Qualified	e3	30	260	10 mm
SX043HJ	Onsemi	TELECOM CIRCUIT	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel		QUAD		S-PQCC-J68		4.57 mm	24.1808 mm	Not Qualified				24.1808 mm
NLHVQ001USG	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100			10 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G8		.9 mm	2 mm			NOT SPECIFIED	NOT SPECIFIED	2.3 mm
TCP-4133UB-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1							GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM		R-PBGA-B4	1	.345 mm	.609 mm		e4		260	.626 mm
TCP-4118UB-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1							GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM		R-PBGA-B4	1	.345 mm	.609 mm		e4		260	.626 mm
AMIS-52100-M	Onsemi		COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES					25 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Other Telecom ICs	.635 mm	50 Cel	0 Cel		DUAL		R-PDSO-G20				Not Qualified
SX071	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					3.3 V		IN-LINE				85 Cel	-40 Cel		DUAL		R-PDIP-T8				Not Qualified
AX5045-1-TW30	Onsemi	TELECOM CIRCUIT
SX048	Onsemi	TELECOM CIRCUIT		GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES	1					5 V		FLATPACK							QUAD		S-PQFP-G48				Not Qualified
TCP-3068N-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1							GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B12		.611 mm	.722 mm					1.179 mm
19608-003-XTD	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel	TIN	QUAD		S-PQFP-G32	3	1.6 mm	7 mm	Not Qualified	e3			7 mm
19293-002-XTD	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	50 Cel	0 Cel		DUAL		R-PDSO-G20		2 mm	5.3 mm	Not Qualified				7.2 mm
TCC-106B-RT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B20		.65 mm	2.23 mm					2.58 mm
19293-001-XTD	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	50 Cel	0 Cel		DUAL		R-PDSO-G20		2 mm	5.3 mm	Not Qualified				7.2 mm
TCP-3033H-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1							CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD		R-XQCC-N6		1 mm	1.2 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
SX043Q	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		FLATPACK				70 Cel	0 Cel		QUAD		R-PQFP-G64				Not Qualified
SSTAR-01	Onsemi	TELECOM CIRCUIT	COMMERCIAL							1	CMOS				3 V						60 Cel	-20 Cel								Not Qualified
LA77000V	Onsemi		COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES					53 mA	5 V	5	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	70 Cel	-20 Cel		DUAL		R-PDSO-G16				Not Qualified
AMIS49587C5871R	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel		QUAD		S-PQCC-J28		4.572 mm	12.446 mm	Not Qualified				12.446 mm
TCP-5118XA-DT	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	BALL	3	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1							GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA3(UNSPEC)		.55 mm	85 Cel	-30 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM		R-PBGA-B3		.375 mm	.772 mm		e1	5	260	.94 mm
TCP-4133UA-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1							GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM		R-PBGA-B4	1	.345 mm	.609 mm		e4		260	.862 mm
AMIS-52050	Onsemi	TELECOM CIRCUIT		GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm				DUAL		R-PDSO-G20		2 mm	5.3 mm	Not Qualified				7.2 mm
19608-001-XTD	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQFP-G32		1.6 mm	7 mm	Not Qualified	e0			7 mm
TCP-3156H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1							GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.15 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B12		.32 mm	.652 mm			NOT SPECIFIED	NOT SPECIFIED	1.134 mm
MTK-40130	Onsemi	TELECOM CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS						SMALL OUTLINE				85 Cel	-30 Cel		DUAL		R-PDSO-G28				Not Qualified

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.