Onsemi Other Function Telecom Interface ICs 241

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AMIS-5300-A	Onsemi		INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS		70 mA		2.2/3.3	FLATPACK	QFP32,.35SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32				Not Qualified
SX073	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				3.3 V		IN-LINE				85 Cel	-40 Cel		DUAL		R-PDIP-T8				Not Qualified
FIN210ACGFX	Onsemi	TELECOM CIRCUIT	OTHER	BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	70 Cel	-30 Cel		BOTTOM		R-PBGA-B42		1 mm	3.5 mm						4.5 mm
AMIS-53000-M	Onsemi		INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS		70 mA		2.2/3.3	FLATPACK	QFP32,.35SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32				Not Qualified
TCP-3027H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B8		.611 mm	.722 mm						.879 mm
TCP-3047H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B12		.611 mm	.722 mm						1.179 mm
TCP-4139UB-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM		R-PBGA-B4	1	.345 mm	.609 mm			e4		260	.862 mm
TCP-5118UA-DT	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	BALL	3	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA3(UNSPEC)		.55 mm	85 Cel	-30 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM		R-PBGA-B3		.375 mm	.772 mm			e1	5	260	.993 mm
AX5043	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N28		.9 mm	5 mm				NOT SPECIFIED	NOT SPECIFIED	5 mm
AX5042-1-TW30	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			2.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20		.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	.25 Mbps	S-XQCC-N28		1 mm	5 mm			e4			5 mm
TCP-3082H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B12		.611 mm	.722 mm						1.179 mm
LC72709E	Onsemi		INDUSTRIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS		25 mA	5 V	5	FLATPACK	QFP44,.5SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G44				Not Qualified
19293-002-XTP	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	50 Cel	0 Cel		DUAL		R-PDSO-G20		2 mm	5.3 mm	Not Qualified					7.2 mm
AX-SFAZ-API	Onsemi	TELECOM CIRCUIT
AMIS49587C5871G	Onsemi	TELECOM CIRCUIT	OTHER	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			.08 mA	3.3 V	3.3	CHIP CARRIER	LDCC28,.5SQ	Modems	1.27 mm	80 Cel	-40 Cel	TIN	QUAD		S-PQCC-J28	3	4.572 mm	11.506 mm	Not Qualified		e3	30	260	11.506 mm
SX041Q	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	52	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK				70 Cel	0 Cel		QUAD		R-PQFP-G52				Not Qualified
AMIS49587C5872RG	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	52	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.08 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC52,.31SQ,20	Modems	.5 mm	80 Cel	-40 Cel		QUAD		S-XQCC-N52		1 mm	8 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	8 mm
AMIS49587C5872G	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	52	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.08 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC52,.31SQ,20	Modems	.5 mm	80 Cel	-40 Cel		QUAD		S-XQCC-N52		1 mm	8 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	8 mm
SX042J	Onsemi	TELECOM CIRCUIT	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel		QUAD		S-PQCC-J68		4.57 mm	24.1808 mm	Not Qualified					24.1808 mm
19637-001-XTP	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS					FLATPACK			.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32			7 mm	Not Qualified					7 mm
TCP-3056N-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1						CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD		R-XQCC-N6		1 mm	1.2 mm						1.6 mm
AMIS-52100	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	70 Cel	0 Cel		DUAL		R-PDSO-G20		2 mm	5.3 mm	Not Qualified					7.2 mm
NB7NPQ1204MMTTWG	Onsemi	TELECOM CIRCUIT		NO LEAD	42	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC42,.14X.35,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	10000 Mbps	R-XQCC-N42	1	.8 mm	3.5 mm				30	260	9 mm
SX042HT	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK				70 Cel	0 Cel		QUAD		R-PQFP-G64				Not Qualified
FSA9480UCX	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				3.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B25		.625 mm	2.1 mm						2.1 mm
LC72725KV	Onsemi	TELECOM CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	70 Cel	-20 Cel		DUAL		R-PDSO-G16		1.5 mm	4.4 mm						5.2 mm
N24RF64DTET3G	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES					2.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.25		.65 mm	105 Cel	-40 Cel		DUAL	.053 Mbps	R-PDSO-G8		1.2 mm	3 mm				NOT SPECIFIED	NOT SPECIFIED	4.4 mm
TCP-3039N-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	10	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B10		.611 mm	.722 mm						1.029 mm
AMIS-53050-I/A-XTD	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					FLATPACK	QFP32(UNSPEC)			85 Cel	-40 Cel		QUAD	.128 Mbps	R-PQFP-G32
LC72714W	Onsemi		INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS		20 mA		3/3.3	FLATPACK	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G64				Not Qualified
N24RF64DWET3G	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES					2.5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	105 Cel	-40 Cel		DUAL	.053 Mbps	R-PDSO-G8		1.75 mm	3.9 mm				NOT SPECIFIED	NOT SPECIFIED	4.9 mm
NCV-RSL10-101Q48-AVG	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100		1.25 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	2 Mbps	S-XQCC-N48	1	.9 mm	7 mm			e3	30	260	7 mm
AMIS-52000	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	50 Cel	0 Cel		DUAL		R-PDSO-G20		2 mm	5.3 mm	Not Qualified					7.2 mm
TCP-3033N-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	10	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B10		.611 mm	.722 mm						1.029 mm
FIN212ACGFX	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	-30 Cel		QUAD		S-XQCC-N32		.8 mm	5 mm						5 mm
AX50311-1-WD1	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1	CMOS			3 V		UNCASED CHIP	DIE OR CHIP			85 Cel	-40 Cel		UPPER	2 Mbps	X-XUUC-N					DATA RATE 350 KBPS FOR FSK,MODULATION		NOT SPECIFIED	NOT SPECIFIED
BK-3708	Onsemi
MDC5001T1	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			2.75 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G6	1	1.1 mm	1.25 mm	Not Qualified		e0		235	2 mm
TCP-3082N-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1						CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD		R-XQCC-N6		1 mm	1.2 mm						1.6 mm
TCP-5156UA-DT	Onsemi	TELECOM CIRCUIT	COMMERCIAL EXTENDED	BALL	3	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA3(UNSPEC)		.55 mm	85 Cel	-30 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM		R-PBGA-B3		.375 mm	.772 mm			e1	5	260	.993 mm
TCP-4147UB-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM		R-PBGA-B4	1	.345 mm	.609 mm			e4		260	.964 mm
N24RF64EDTPT3G	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.25		.65 mm	105 Cel	-40 Cel		DUAL	.053 Mbps	R-PDSO-G8	1	1.2 mm	3 mm				NOT SPECIFIED	260	4.4 mm
SX042HJ	Onsemi	TELECOM CIRCUIT	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel		QUAD		S-PQCC-J68		4.57 mm	24.1808 mm	Not Qualified					24.1808 mm
S3526B-P	Onsemi	TELECOM CIRCUIT	COMMERCIAL							1	CMOS			10 V						70 Cel	0 Cel								Not Qualified
LA7161BM	Onsemi		COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES				48 mA	5 V	5	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	70 Cel	-20 Cel		DUAL		R-PDSO-G16				Not Qualified
LV2283VB	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3.3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP24,.25		.5 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G24		1.5 mm	4.4 mm						6.5 mm
TCP-3027N-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B8		.611 mm	.722 mm						.879 mm
FSA9280AUMX	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1						CHIP CARRIER			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		R-XQCC-N20	1	.55 mm	3 mm	Not Qualified		e4	30	260	4 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.