Silicon Labs Other Function Telecom Interface ICs 338

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Supply Voltage	Package Style (Meter)	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SI32919-A-FSR	Silicon Labs
WF111-N-V1	Silicon Labs	TELECOM CIRCUIT
ETRX2-PA	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	38		RECTANGULAR	UNSPECIFIED	YES	1		3 V	MICROELECTRONIC ASSEMBLY	2.54 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N38			20.5 mm						37.5 mm
MGM12P32F1024GA-V2	Silicon Labs	TELECOM CIRCUIT
RS9116N-SB00-AA1-X00	Silicon Labs	TELECOM CIRCUIT
BGM240PA32VNA3R	Silicon Labs	TELECOM CIRCUIT
BGM240PA32VNN3R	Silicon Labs	TELECOM CIRCUIT
ZM5101A-CME3R	Silicon Labs	TELECOM CIRCUIT
BGM121N256V2	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56		SQUARE	UNSPECIFIED	YES	1		3.3 V	MICROELECTRONIC ASSEMBLY		85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N56	3	1.4 mm	6.5 mm				40	260	6.5 mm
BT111-A-HCI	Silicon Labs	TELECOM CIRCUIT	OTHER	NO LEAD	21		RECTANGULAR	UNSPECIFIED	YES	1			MICROELECTRONIC ASSEMBLY	1.1 mm	85 Cel	-30 Cel		UNSPECIFIED		R-XXMA-N21		2.31 mm	9.3 mm						13.05 mm
MGM111A256V2R	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31	XMA	RECTANGULAR	UNSPECIFIED	YES	1		3.3 V	MICROELECTRONIC ASSEMBLY	1.2 mm	85 Cel	-40 Cel		UNSPECIFIED	.25 Mbps	R-XXMA-N31		2.1 mm	12.9 mm						15 mm
RS9113-NB0-D1C	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	79	XMA	RECTANGULAR	UNSPECIFIED	YES	1		3.3 V	MICROELECTRONIC ASSEMBLY		85 Cel	-40 Cel		UNSPECIFIED	54 Mbps	R-XXMA-N79		3.3 mm	16 mm		ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps				27 mm
SI4455-C2A-GMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1		3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	3 mm						3 mm
BLE112-E-V1	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31		RECTANGULAR	UNSPECIFIED	YES	1			MICROELECTRONIC ASSEMBLY	1.25 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N31		2.3 mm	12.05 mm						18.1 mm
SI2166-B20-GM	Silicon Labs	TELECOM CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	1.2 V	CHIP CARRIER		75 Cel	-10 Cel	MATTE TIN	QUAD		S-XQCC-N48	2					e3	40	260
SI3471A-A01-IMR	Silicon Labs
BGX220S22HNA21R	Silicon Labs	TELECOM CIRCUIT		NO LEAD	44	XMA	SQUARE	UNSPECIFIED	YES	1		3 V	MICROELECTRONIC ASSEMBLY	.5 mm	105 Cel	-40 Cel		UNSPECIFIED	2 Mbps	S-XXMA-N44		1.28 mm	6 mm						6 mm
SI2166-D60-GM	Silicon Labs	TELECOM CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	48	HQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	1.2 V	CHIP CARRIER, HEAT SINK/SLUG		75 Cel	-10 Cel		QUAD		S-XQCC-N48
SI3471A-A01-IM	Silicon Labs
BGM111E256V2	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	BUTT	31		RECTANGULAR	UNSPECIFIED	YES	1		3.3 V	MICROELECTRONIC ASSEMBLY	1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-B31		2.15 mm	12.9 mm						15 mm
BGX13P22GA-V31R	Silicon Labs	TELECOM CIRCUIT
BLE121LR-A-M256K	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	YES	1		3 V	MICROELECTRONIC ASSEMBLY	.9 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N36		1.8 mm	13 mm						14.7 mm
SI32391-B-GM	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N48		.9 mm	7 mm				NOT SPECIFIED	NOT SPECIFIED	7 mm
SI4010-C2-GS	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	3.3 V	SMALL OUTLINE	1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G14	3	2 mm	3.9 mm	Not Qualified		e3	40	260	8.65 mm
BGM121A256V1	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56		SQUARE	UNSPECIFIED	YES	1		3.3 V	MICROELECTRONIC ASSEMBLY		85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N56		1.4 mm	6.5 mm						6.5 mm
BGM121A256V1R	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56		SQUARE	UNSPECIFIED	YES	1		3.3 V	MICROELECTRONIC ASSEMBLY		85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N56		1.4 mm	6.5 mm						6.5 mm
BGM13S22F512GA-V2	Silicon Labs	TELECOM CIRCUIT
BGX13P22GA-V21	Silicon Labs	TELECOM CIRCUIT
BGX13P22GA-V31	Silicon Labs	TELECOM CIRCUIT
EFR32BG12P432F1024GL125-B	Silicon Labs	TELECOM CIRCUIT																									NOT SPECIFIED	NOT SPECIFIED
RS9113-N00-D1W-X78	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	79	XMA	RECTANGULAR	UNSPECIFIED	YES	1		3.3 V	MICROELECTRONIC ASSEMBLY		85 Cel	-40 Cel		UNSPECIFIED	54 Mbps	R-XXMA-N79		3.3 mm	16 mm		ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C				27 mm
SI32391-B-FM	Silicon Labs	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	70 Cel	0 Cel		QUAD		S-XQCC-N48		.9 mm	7 mm				NOT SPECIFIED	NOT SPECIFIED	7 mm
BGX220S22HNA21	Silicon Labs	TELECOM CIRCUIT
RS9113-N00-D1W-X68	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	79	XMA	RECTANGULAR	UNSPECIFIED	YES	1		3.3 V	MICROELECTRONIC ASSEMBLY		85 Cel	-40 Cel		UNSPECIFIED	54 Mbps	R-XXMA-N79		3.3 mm	16 mm		ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C				27 mm
RS9113-N00-D1W-X72	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	79	XMA	RECTANGULAR	UNSPECIFIED	YES	1		3.3 V	MICROELECTRONIC ASSEMBLY		85 Cel	-40 Cel		UNSPECIFIED	54 Mbps	R-XXMA-N79		3.3 mm	16 mm		ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C				27 mm
RS9113-N00-D1W-X74	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	79	XMA	RECTANGULAR	UNSPECIFIED	YES	1		3.3 V	MICROELECTRONIC ASSEMBLY		85 Cel	-40 Cel		UNSPECIFIED	54 Mbps	R-XXMA-N79		3.3 mm	16 mm		ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C				27 mm
SI4313-B1-FMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1		3.3 V	CHIP CARRIER	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	.9 mm	4 mm	Not Qualified		e3	40	260	4 mm
SI4362-B1B-FMR	Silicon Labs	TELECOM CIRCUIT																									NOT SPECIFIED	NOT SPECIFIED
IA3223-C-FUR	Silicon Labs	TELECOM CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.3 V	SMALL OUTLINE, SHRINK PITCH	.635 mm	85 Cel	-25 Cel		DUAL		R-PDSO-G16		1.7272 mm	3.8989 mm				NOT SPECIFIED	NOT SPECIFIED	4.8895 mm
MGM12P32F1024GE-V4	Silicon Labs	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1		3.3 V	SPECIAL SHAPE		85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X			12.9 mm						17.8 mm
RS9113-N00-S0W-X78	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	101	XMA	RECTANGULAR	UNSPECIFIED	YES	1		3.3 V	MICROELECTRONIC ASSEMBLY		85 Cel	-40 Cel		UNSPECIFIED	54 Mbps	R-XXMA-N101		2.3 mm	14 mm		ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C				15 mm
SI4438-B1C-FMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1		3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	.9 mm	4 mm			e3	40	260	4 mm
SI4744-C10-GMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	2	.9 mm	4 mm			e3	40	260	4 mm
SI4777-A20-GMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N40		.9 mm	6 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm
WT32I-E-AI61IAP	Silicon Labs
AMW037	Silicon Labs	TELECOM CIRCUIT		NO LEAD	44	QMA	RECTANGULAR	UNSPECIFIED	YES	1		3.3 V	MICROELECTRONIC ASSEMBLY	1.27 mm	85 Cel	-40 Cel		UNSPECIFIED	54 Mbps	R-XQMA-N44		2.72 mm	16.51 mm						24.77 mm
BGM210PA22JIA2	Silicon Labs
BGM240SB22VNA2	Silicon Labs	TELECOM CIRCUIT

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.