Silicon Labs Other Function Telecom Interface ICs 338

Reset All
Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

SI4313-B1-FM

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N20

1

.9 mm

4 mm

Not Qualified

e3

40

260

4 mm

SI4362-C2A-GMR

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N20

.9 mm

4 mm

4 mm

MGM12P22F1024GA-V4R

Silicon Labs

TELECOM CIRCUIT

UNSPECIFIED

XMA

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

SPECIAL SHAPE

85 Cel

-40 Cel

UNSPECIFIED

1 Mbps

R-XXMA-X

12.9 mm

17.8 mm

BGM210PA32JIA2

Silicon Labs

BGM210PA32JIA2R

Silicon Labs

SI4431-B1-FM

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N20

.9 mm

4 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

4 mm

WGM110A1MV2

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.25 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N40

2.1 mm

14.4 mm

21 mm

BGM13S32F512GA-V2

Silicon Labs

TELECOM CIRCUIT

BGM210PB22JIA2

Silicon Labs

EFR32BG1B132F256GM32-C0R

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn)

QUAD

S-XQCC-N32

2

.9 mm

5 mm

e3

NOT SPECIFIED

260

5 mm

MGM12P22F1024GA-V4

Silicon Labs

TELECOM CIRCUIT

UNSPECIFIED

XMA

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

SPECIAL SHAPE

85 Cel

-40 Cel

UNSPECIFIED

1 Mbps

R-XXMA-X

12.9 mm

17.8 mm

SI4012-C1001GT

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

10

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.0198 mA

3.3 V

2/3.3

SMALL OUTLINE

TSSOP10,.19,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

DUAL

S-PDSO-G10

1.1 mm

3 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

3 mm

SI4355-B1A-FM

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

QCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N20

2

e3

40

260

BGM210PB22JIA2R

Silicon Labs

EFR32BG13P532F512GM32-D

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N32

3

.9 mm

5 mm

40

260

5 mm

EFR32BG21A020F768IM32-B

Silicon Labs

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.16SQ,16

.4 mm

125 Cel

-40 Cel

MATTE TIN

QUAD

2 Mbps

S-XQCC-N32

2

.9 mm

4 mm

e3

40

260

4 mm

EFR32FG25A121F1152IM56-B

Silicon Labs

TELECOM CIRCUIT

MGM13P12F512GE-V2

Silicon Labs

RS9113-NB0-S1C-X78

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

79

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

54 Mbps

R-XXMA-N79

3.3 mm

16 mm

ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C

27 mm

SI4732-A10-GSR

Silicon Labs

TELECOM CIRCUIT

MATTE TIN

3

40

260

WFM200S022XNN3

Silicon Labs

TELECOM CIRCUIT

3

40

260

WFM200SS22XNN3

Silicon Labs

TELECOM CIRCUIT

3

40

260

BGM11S12F256GA-V2

Silicon Labs

TELECOM CIRCUIT

BGX13S22GA-V31

Silicon Labs

TELECOM CIRCUIT

3

40

260

EFR32BG1B132F256GM32-C0

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

2

.9 mm

5 mm

e3

40

260

5 mm

EFR32BG1V132F256GM32-C0

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

2

.9 mm

5 mm

e3

40

260

5 mm

EFR32FG25B111F1152IM56-B

Silicon Labs

TELECOM CIRCUIT

EFR32FG25B121F1152IM56-B

Silicon Labs

TELECOM CIRCUIT

IA3222B-F-FTR

Silicon Labs

TELECOM CIRCUIT

OTHER

GULL WING

10

VSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

.508 mm

85 Cel

-25 Cel

DUAL

S-PDSO-G10

.9652 mm

3.048 mm

NOT SPECIFIED

NOT SPECIFIED

3.048 mm

MGM12P02F1024GA-V4R

Silicon Labs

TELECOM CIRCUIT

UNSPECIFIED

XMA

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

SPECIAL SHAPE

85 Cel

-40 Cel

UNSPECIFIED

1 Mbps

R-XXMA-X

12.9 mm

17.8 mm

MGM13S12F512GA-V3R

Silicon Labs

TELECOM CIRCUIT

RS9113-N00-S0N-X00

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

101

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

54 Mbps

R-XXMA-N101

2.3 mm

14 mm

ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C

15 mm

RS9116W-SB00-AA0-X2A

Silicon Labs

TELECOM CIRCUIT

SI3462-E01-GMR

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

11

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N11

1 mm

3 mm

3 mm

SI4010-C2-ATR

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

10

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

SMALL OUTLINE

.5 mm

85 Cel

-40 Cel

DUAL

S-PDSO-G10

1.1 mm

3 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

3 mm

SI4012-C1001GTR

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

10

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.0198 mA

3.3 V

2/3.3

SMALL OUTLINE

TSSOP10,.19,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

DUAL

S-PDSO-G10

1.1 mm

3 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

3 mm

SI4063-B1B-FMR

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N20

.9 mm

4 mm

NOT SPECIFIED

NOT SPECIFIED

4 mm

SI4063-C2A-GMR

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N20

.9 mm

4 mm

4 mm

SI4355-B1A-FMR

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

QCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N20

2

e3

40

260

SI4455-B1A-FM

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N20

2

.9 mm

3 mm

e3

40

260

3 mm

SI4737-C40-GM

Silicon Labs

TELECOM CIRCUIT

OTHER

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-20 Cel

MATTE TIN

QUAD

S-XQCC-N20

3

.6 mm

3 mm

e3

40

260

3 mm

SI4737-C40-GU

Silicon Labs

TELECOM CIRCUIT

OTHER

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

SMALL OUTLINE, SHRINK PITCH

.635 mm

85 Cel

-20 Cel

MATTE TIN

DUAL

R-PDSO-G24

3

2 mm

3.9 mm

e3

40

260

8.65 mm

SI4743-C10-GM

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

2

.9 mm

4 mm

e3

40

260

4 mm

WFM200SS22XNA3R

Silicon Labs

TELECOM CIRCUIT

3

40

260

WT11I-A-AI4

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

28

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.5 mm

85 Cel

-40 Cel

DUAL

R-XDMA-N28

2.86 mm

14.5 mm

35.75 mm

WT41-A-AI4

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

59

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.5 mm

85 Cel

-40 Cel

QUAD

R-XQMA-N59

5.65 mm

14.5 mm

NOT SPECIFIED

NOT SPECIFIED

35.55 mm

ZM3102AU-CME1R

Silicon Labs

TELECOM CIRCUIT

NO LEAD

18

XMA

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

UNSPECIFIED

.04 Mbps

R-XXMA-N18

BGM210LA22JIF2

Silicon Labs

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.