Silicon Labs Other Function Telecom Interface ICs 338

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

BGM210LA22JNF2

Silicon Labs

BGX13S22GA-V31R

Silicon Labs

TELECOM CIRCUIT

3

40

260

BT121-A-V1

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

33

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N33

2.1 mm

11 mm

13.9 mm

EFR32BG13P532F512GM48-D

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N48

2

.9 mm

7 mm

e3

40

260

7 mm

EFR32BG13P632F512GM32-D

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N32

3

.9 mm

5 mm

40

260

5 mm

EFR32FG25A211F1920IM56-B

Silicon Labs

TELECOM CIRCUIT

EFR32FG25A221F1920IM56-B

Silicon Labs

TELECOM CIRCUIT

EFR32FG25B222F1920IM56-B

Silicon Labs

TELECOM CIRCUIT

MGM111A256V1

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

31

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.2 mm

85 Cel

-40 Cel

UNSPECIFIED

.25 Mbps

R-XXMA-N31

2.1 mm

12.9 mm

15 mm

MGM12P02F1024GA-V2R

Silicon Labs

TELECOM CIRCUIT

MGM12P02F1024GE-V4

Silicon Labs

TELECOM CIRCUIT

UNSPECIFIED

XMA

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

SPECIAL SHAPE

85 Cel

-40 Cel

UNSPECIFIED

1 Mbps

R-XXMA-X

12.9 mm

17.8 mm

MGM12P22F1024GE-V2

Silicon Labs

TELECOM CIRCUIT

MGM13S02F512GA-V3

Silicon Labs

TELECOM CIRCUIT

3

40

260

MGM13S02F512GN-V3

Silicon Labs

TELECOM CIRCUIT

3

40

260

MGM210LA22JIF2

Silicon Labs

TELECOM CIRCUIT

MGM210LA22JNF2R

Silicon Labs

TELECOM CIRCUIT

RS9113-N00-S1C-X68

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

79

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

54 Mbps

R-XXMA-N79

3.3 mm

16 mm

ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C

27 mm

RS9116N-SB00-QMS-B00

Silicon Labs

TELECOM CIRCUIT

MATTE TIN

3

e3

40

260

SI2166-B22-GM

Silicon Labs

TELECOM CIRCUIT

COMMERCIAL EXTENDED

NO LEAD

48

HQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER, HEAT SINK/SLUG

75 Cel

-10 Cel

QUAD

S-XQCC-N48

NOT SPECIFIED

NOT SPECIFIED

SI2167-D60-GM

Silicon Labs

TELECOM CIRCUIT

COMMERCIAL EXTENDED

NO LEAD

48

HQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER, HEAT SINK/SLUG

75 Cel

-10 Cel

QUAD

S-XQCC-N48

SI2169-B40-GM

Silicon Labs

TELECOM CIRCUIT

COMMERCIAL EXTENDED

NO LEAD

48

QCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER

75 Cel

-10 Cel

MATTE TIN

QUAD

S-XQCC-N48

2

e3

40

260

SI21822-B60-GM/R

Silicon Labs

TELECOM CIRCUIT

COMMERCIAL EXTENDED

NO LEAD

68

HQCCN

SQUARE

UNSPECIFIED

YES

1

1.2 V

CHIP CARRIER, HEAT SINK/SLUG

75 Cel

-10 Cel

QUAD

S-XQCC-N68

SI2183-B60-GM

Silicon Labs

TELECOM CIRCUIT

COMMERCIAL EXTENDED

NO LEAD

48

HQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER, HEAT SINK/SLUG

75 Cel

-10 Cel

QUAD

S-XQCC-N48

NOT SPECIFIED

NOT SPECIFIED

SI32170-C-FM1

Silicon Labs

TELECOM CIRCUIT

COMMERCIAL

BUTT

42

HVBCC

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

70 Cel

0 Cel

BOTTOM

R-XBCC-B42

.9 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

SI32392-B-GM

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N48

.9 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

SI4060-B1B-FM

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N20

1

.9 mm

4 mm

e3

40

260

4 mm

SI4063-C2A-GM

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.15SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N20

1

.9 mm

4 mm

e3

40

260

4 mm

SI4355-C2A-GMR

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N20

.9 mm

3 mm

NOT SPECIFIED

NOT SPECIFIED

3 mm

SI4438-C2A-GM

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N20

.9 mm

4 mm

4 mm

SI4737-C40-GMR

Silicon Labs

TELECOM CIRCUIT

OTHER

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-20 Cel

MATTE TIN

QUAD

S-XQCC-N20

3

.6 mm

3 mm

e3

40

260

3 mm

WFM200SS22XNA3

Silicon Labs

TELECOM CIRCUIT

3

40

260

WGM110A1MV2R

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.25 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N40

2.1 mm

14.4 mm

21 mm

WGM160PX22KGA2R

Silicon Labs

WT12-A-HCI21

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

31

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.5 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N31

2.6 mm

14 mm

NOT SPECIFIED

NOT SPECIFIED

25.6 mm

WT41-E-AI4

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

57

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.5 mm

85 Cel

-40 Cel

QUAD

R-XQMA-N57

3.35 mm

14.5 mm

NOT SPECIFIED

NOT SPECIFIED

35.55 mm

BT121-A-V1-IAP

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

33

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N33

2.1 mm

11 mm

13.9 mm

EFR32BG13P632F512GM48-DR

Silicon Labs

TELECOM CIRCUIT

MATTE TIN

2

e3

40

260

EFR32BG13P632F512IM32-DR

Silicon Labs

TELECOM CIRCUIT

3

40

260

EFR32BG13P733F512GM48-D

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N48

2

.9 mm

7 mm

e3

40

260

7 mm

EFR32BG1B232F256GM48-C0

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N48

.9 mm

7 mm

7 mm

EM351-RTR

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.25 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N48

1 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

ETRX2

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

38

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

2.54 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N38

20.5 mm

37.5 mm

SI4060-B1B-FMR

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N20

.9 mm

4 mm

NOT SPECIFIED

NOT SPECIFIED

4 mm

SI4060-C2A-GMR

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N20

.9 mm

4 mm

4 mm

SI4330-B1-FMR

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N20

1

.9 mm

4 mm

Not Qualified

e3

40

260

4 mm

SI4431-B1-FMR

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N20

.9 mm

4 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

4 mm

SI4455-C2A-GM

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N20

.9 mm

3 mm

3 mm

WF121-E

Silicon Labs

TELECOM CIRCUIT

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.