Silicon Labs Other Function Telecom Interface ICs 338

Reset All
Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

MGM240PA32VNA3R

Silicon Labs

TELECOM CIRCUIT

BGM240PB32VNA3R

Silicon Labs

TELECOM CIRCUIT

RS9113-N00-D1W

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

79

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

54 Mbps

R-XXMA-N79

3.3 mm

16 mm

ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps

27 mm

WF111-E-V1

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

33

QMA

RECTANGULAR

UNSPECIFIED

YES

1

1.5 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

QUAD

72.2 Mbps

R-XQMA-N33

3

2.3 mm

12 mm

40

260

19 mm

MGM240PB32VNA3R

Silicon Labs

TELECOM CIRCUIT

RS9116N-SB00-B00-B00

Silicon Labs

TELECOM CIRCUIT

EFR32BG13P632F512GM48-B

Silicon Labs

TELECOM CIRCUIT

BGM240PA22VNA3R

Silicon Labs

TELECOM CIRCUIT

MGM12P32F1024GA-V4R

Silicon Labs

TELECOM CIRCUIT

UNSPECIFIED

XMA

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

SPECIAL SHAPE

85 Cel

-40 Cel

UNSPECIFIED

1 Mbps

R-XXMA-X

12.9 mm

17.8 mm

BGM240PB32VNN3R

Silicon Labs

TELECOM CIRCUIT

MGM240SD22VNA2R

Silicon Labs

TELECOM CIRCUIT

SI32170-C-GM1R

Silicon Labs

TELECOM CIRCUIT

SI4461-C2A-GM

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

WF111-A-V1-ETSI

Silicon Labs

TELECOM CIRCUIT

BGM240PB22VNA3R

Silicon Labs

TELECOM CIRCUIT

EFR32BG13P732F512GM48-B

Silicon Labs

TELECOM CIRCUIT

SI4010-C2-GTR

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

10

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

SMALL OUTLINE

.5 mm

85 Cel

-40 Cel

DUAL

S-PDSO-G10

1.1 mm

3 mm

Not Qualified

3 mm

EFR32BG12P432F1024GM48-B

Silicon Labs

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

MGM240PA22VNA3R

Silicon Labs

TELECOM CIRCUIT

MGM240SA22VNA2

Silicon Labs

TELECOM CIRCUIT

SI4455-B1A-FMR

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N20

2

.9 mm

3 mm

e3

40

260

3 mm

WGM160PX22KGA3

Silicon Labs

TELECOM CIRCUIT

BGM13P22F512GE-V2R

Silicon Labs

TELECOM CIRCUIT

BGX220P22HNA21

Silicon Labs

TELECOM CIRCUIT

SI4010-C2-GSR

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G14

2 mm

3.9 mm

Not Qualified

40

260

8.65 mm

BGM123A256V2

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

SQUARE

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

S-XXMA-N56

3

1.4 mm

6.5 mm

40

260

6.5 mm

MGM240PB22VNA3R

Silicon Labs

TELECOM CIRCUIT

WT11U-E-AI56

Silicon Labs

EFR32BG1P332F256GJ43-C0

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

BALL

43

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B43

1

.54 mm

3.143 mm

e1

40

260

3.295 mm

SI32170-C-GM1

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

BUTT

42

HVBCC

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

BOTTOM

R-XBCC-B42

.9 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

BGM210PA22JIA2R

Silicon Labs

EFR32BG21A010F1024IM32-B

Silicon Labs

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.16SQ,16

.4 mm

125 Cel

-40 Cel

QUAD

2 Mbps

S-XQCC-N32

2

.9 mm

4 mm

40

260

4 mm

MGM12P02F1024GE-V2

Silicon Labs

TELECOM CIRCUIT

RS9116N-DB00-CC1

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

107

LGA

RECTANGULAR

UNSPECIFIED

YES

1

1.85 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

R-XBGA-N107

SI4311-B21-GM

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

HVQCCN

1

CMOS

3.3 V

.5 mm

85 Cel

-40 Cel

.9 mm

3 mm

3 mm

WGM160PX22KGA3R

Silicon Labs

TELECOM CIRCUIT

BGX13P22GA-V21R

Silicon Labs

TELECOM CIRCUIT

SI4432-B1-FM

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N20

.9 mm

4 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

4 mm

SI4732-A10-GS

Silicon Labs

TELECOM CIRCUIT

MATTE TIN

3

40

260

BGM11S22F256GA-V2R

Silicon Labs

TELECOM CIRCUIT

NICKEL GOLD

3

e4

40

260

EFR32BG1V132F256GJ43-C0

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

BALL

43

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B43

.54 mm

3.143 mm

3.295 mm

MGM12P22F1024GA-V2

Silicon Labs

TELECOM CIRCUIT

WGM110E1MV2R

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.25 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N40

2.1 mm

14.4 mm

21 mm

WT11U-A-AI4

Silicon Labs

TELECOM CIRCUIT

NO LEAD

28

DMA

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

3.3 V

MICROELECTRONIC ASSEMBLY

1.5 mm

85 Cel

-40 Cel

DUAL

3 Mbps

R-XDMA-N28

2.7 mm

14.5 mm

35.75 mm

ZGM130S037HGN2

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

64

QCCN

SQUARE

YES

1.8 V

CHIP CARRIER

LCC64,.35SQ,20

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N64

3

1.3 mm

9 mm

40

260

9 mm

BGM113A256V1

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

.8 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N36

2.09 mm

9.15 mm

15.73 mm

EFR32BG13P532F512GM48-B

Silicon Labs

TELECOM CIRCUIT

EFR32BG21A010F512IM32-B

Silicon Labs

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.16SQ,16

.4 mm

125 Cel

-40 Cel

MATTE TIN

QUAD

2 Mbps

S-XQCC-N32

2

.9 mm

4 mm

e3

40

260

4 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.