18 Telephone Line ICs 76

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Repertory	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	Crystal Frequency (MHz)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Make-break Ratio	Length
TC35218P	Toshiba	TELEPHONE DIALER CIRCUIT		THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1						IN-LINE			2.54 mm				TIN LEAD	DUAL	R-PDIP-T18	4.5 mm	7.62 mm	Not Qualified			e0				22 mm
TCM5091J	Texas Instruments		INDUSTRIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	CERAMIC	NO		CMOS					IN-LINE	DIP18,.3	Telephone Circuits	2.54 mm	85 Cel		-40 Cel		DUAL	R-XDIP-T18			Not Qualified
TCM5091N	Texas Instruments		INDUSTRIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS					IN-LINE	DIP18,.3	Telephone Circuits	2.54 mm	85 Cel		-40 Cel		DUAL	R-PDIP-T18			Not Qualified
MM53130N	Texas Instruments		OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS					IN-LINE	DIP18,.3	Telephone Circuits	2.54 mm	70 Cel		-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T18			Not Qualified			e0
M3561B	STMicroelectronics		OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		.5 mA		1.5/5.5	IN-LINE	DIP18,.3	Telephone Circuits	2.54 mm	70 Cel		-25 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T18			Not Qualified			e0
MK53732A	STMicroelectronics		OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		.0006 mA		3/5	IN-LINE	DIP18,.3	Telephone Circuits	2.54 mm	60 Cel		-30 Cel	TIN LEAD	DUAL	R-PDIP-T18			Not Qualified		3.58	e0
M761EB1	STMicroelectronics		OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		1.8 mA	3 V	3	IN-LINE	DIP18,.3	Telephone Circuits	2.54 mm	70 Cel		-25 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T18			Not Qualified		4.43	e0
LB1021AD	STMicroelectronics	SPEAKER PHONE CIRCUIT		THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO			-6 V	34 mA	6 V	+-6	IN-LINE	DIP18,.3	Telephone Circuits	2.54 mm					DUAL	R-PDIP-T18			Not Qualified
MK53732B	STMicroelectronics		OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		.0006 mA		3/5	IN-LINE	DIP18,.3	Telephone Circuits	2.54 mm	60 Cel		-30 Cel	TIN LEAD	DUAL	R-PDIP-T18			Not Qualified		3.58	e0
MK5370N00	STMicroelectronics		OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		.6 mA	2.5 V	2.5	IN-LINE	DIP18,.3	Telephone Circuits	2.54 mm	60 Cel		-30 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T18			Not Qualified		3.58	e0
MK53761N00	STMicroelectronics	TELEPHONE DIALER CIRCUIT	COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		.6 mA	5 V	3/5	IN-LINE	DIP18,.3	Telephone Circuits	2.54 mm	60 Cel	REPERTORY	-20 Cel	TIN LEAD	DUAL	R-PDIP-T18	5.1 mm	7.62 mm	Not Qualified		3.58	e0			1:1.5
MK5375N00	STMicroelectronics		OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		1 mA		3/5	IN-LINE	DIP18,.3	Telephone Circuits	2.54 mm	60 Cel	REPERTORY	-30 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T18			Not Qualified		3.58	e0
MK53732E	STMicroelectronics		OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		.0006 mA		3/5	IN-LINE	DIP18,.3	Telephone Circuits	2.54 mm	60 Cel		-30 Cel	TIN LEAD	DUAL	R-PDIP-T18			Not Qualified		3.58	e0
MK53731N00	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		.6 mA		3/5	IN-LINE	DIP18,.3	Telephone Circuits	2.54 mm	60 Cel		-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T18			Not Qualified		3.58	e0
MK5371N00	STMicroelectronics		OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		.6 mA	2.5 V	2.5	IN-LINE	DIP18,.3	Telephone Circuits	2.54 mm	60 Cel		-30 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T18			Not Qualified		3.58	e0
MK53761N01	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		.6 mA		3/5	IN-LINE	DIP18,.3	Telephone Circuits	2.54 mm	60 Cel	REPERTORY	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T18			Not Qualified		3.58	e0
MK53732F	STMicroelectronics		OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		.0006 mA		3/5	IN-LINE	DIP18,.3	Telephone Circuits	2.54 mm	60 Cel		-30 Cel	TIN LEAD	DUAL	R-PDIP-T18			Not Qualified		3.58	e0
PCD3327U	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	NO LEAD	18	DIE	UNSPECIFIED	UNSPECIFIED	YES	1			.4 mA	3 V		UNCASED CHIP				70 Cel		-25 Cel		UPPER	X-XUUC-N18			Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2					1:1.5
PCD3320CP	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			.4 mA	3 V		IN-LINE			2.54 mm	70 Cel		-25 Cel		DUAL	R-PDIP-T18	4.7 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2					1:1.5	21.6 mm
PCD3320CD	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1			.4 mA	3 V		IN-LINE			2.54 mm	70 Cel		-25 Cel		DUAL	R-GDIP-T18	5.08 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2					1:1.5
PCD3321CD	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1			.4 mA	3 V		IN-LINE			2.54 mm	70 Cel		-25 Cel		DUAL	R-GDIP-T18	5.08 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2					1:1.5
PCD3321CP	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			.4 mA	3 V		IN-LINE			2.54 mm	70 Cel		-25 Cel		DUAL	R-PDIP-T18	4.7 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2					1:1.5	21.6 mm
933821300112	NXP Semiconductors	TELEPHONE SPEECH CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR			2.8 V		IN-LINE			2.54 mm	75 Cel		-25 Cel		DUAL	R-PDIP-T18	4.7 mm	7.62 mm	Not Qualified				40	245		21.6 mm
PCD3325CP	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			.4 mA	3 V		IN-LINE			2.54 mm	70 Cel		-25 Cel		DUAL	R-PDIP-T18	4.7 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2					1:1.5	21.6 mm
PCD3327CU	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	NO LEAD	18	DIE	RECTANGULAR	UNSPECIFIED	YES	1						UNCASED CHIP				70 Cel		-25 Cel		UPPER	R-XUUC-N18			Not Qualified	SELECTABLE MAKE/BREAK RATIO 2:1					3:2
PCD3324CP	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			.4 mA	3 V		IN-LINE			2.54 mm	70 Cel		-25 Cel		DUAL	R-PDIP-T18	4.7 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2					1:1.5	21.6 mm
PCD4415PN	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			.9 mA	5 V		IN-LINE			2.54 mm	70 Cel		-25 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T18	4.7 mm	7.62 mm	Not Qualified			e3/e4			1:2
PCD4415APN	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			.9 mA	5 V		IN-LINE			2.54 mm	70 Cel		-25 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T18	4.7 mm	7.62 mm	Not Qualified			e3/e4			1:1.5
PCD3322CP	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			.4 mA	3 V		IN-LINE			2.54 mm	70 Cel		-25 Cel		DUAL	R-PDIP-T18	4.7 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2					1:1.5	21.6 mm
PCD3320CD-T	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1			.4 mA	3 V		IN-LINE			2.54 mm	70 Cel		-25 Cel		DUAL	R-GDIP-T18	5.08 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2					1:1.5
PCD3326CP	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			.4 mA	3 V		IN-LINE			2.54 mm	70 Cel		-25 Cel		DUAL	R-PDIP-T18	4.7 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2					1:1.5	21.6 mm
PCD3327CP	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			.4 mA	3 V		IN-LINE			2.54 mm	70 Cel		-25 Cel		DUAL	R-PDIP-T18	4.7 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2					1:1.5	21.6 mm
PCD3321CD-T	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1			.4 mA	3 V		IN-LINE			2.54 mm	70 Cel		-25 Cel		DUAL	R-GDIP-T18	5.08 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2					1:1.5
TEA1067N	NXP Semiconductors	TELEPHONE SPEECH CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR			2.8 V		IN-LINE			2.54 mm	75 Cel		-25 Cel		DUAL	R-PDIP-T18	4.7 mm	7.62 mm	Not Qualified	AVAILABLE ONLY IN NORTH AMERICA						21.6 mm
TEA1067/C2	NXP Semiconductors	TELEPHONE SPEECH CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR			2.8 V		IN-LINE			2.54 mm	75 Cel		-25 Cel		DUAL	R-PDIP-T18	4.7 mm	7.62 mm	Not Qualified							21.6 mm
TEA1068	NXP Semiconductors	TELEPHONE SPEECH CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR		.0013 mA		3.95/7.5	IN-LINE	DIP18,.3	Telephone Circuits	2.54 mm	75 Cel		-25 Cel		DUAL	R-PDIP-T18	4.7 mm	7.62 mm	Not Qualified							21.6 mm
TEA1061PN	NXP Semiconductors	TELEPHONE SPEECH CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1						IN-LINE			2.54 mm	70 Cel		-25 Cel		DUAL	R-PDIP-T18	4.7 mm	7.62 mm	Not Qualified
TEA1060PN	NXP Semiconductors	TELEPHONE SPEECH CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1						IN-LINE			2.54 mm	70 Cel		-25 Cel		DUAL	R-PDIP-T18	4.7 mm	7.62 mm	Not Qualified
TEA1061	NXP Semiconductors	TELEPHONE SPEECH CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1						IN-LINE			2.54 mm	75 Cel		-25 Cel		DUAL	R-PDIP-T18	4.7 mm	7.62 mm	Not Qualified							21.6 mm
TEA1067PN	NXP Semiconductors	TELEPHONE SPEECH CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1						IN-LINE				70 Cel		-25 Cel		DUAL	R-PDIP-T18			Not Qualified
TEA1060	NXP Semiconductors	TELEPHONE SPEECH CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1						IN-LINE			2.54 mm	75 Cel		-25 Cel		DUAL	R-PDIP-T18	4.7 mm	7.62 mm	Not Qualified							21.6 mm
TEA1067	NXP Semiconductors	TELEPHONE SPEECH CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR			2.8 V		IN-LINE			2.54 mm	75 Cel		-25 Cel		DUAL	R-PDIP-T18	4.7 mm	7.62 mm	Not Qualified							21.6 mm
TA31032P	Toshiba	TELEPHONE SPEECH CIRCUIT	INDUSTRIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1						IN-LINE			2.54 mm	85 Cel		-40 Cel		DUAL	R-PDIP-T18	4.45 mm	7.62 mm	Not Qualified							24.6 mm
ICS1660NLF	Renesas Electronics	TELEPHONE CALLING NO IDENTIFICATION CIRCUIT	COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS			5 V		IN-LINE			2.54 mm	70 Cel		0 Cel	MATTE TIN	DUAL	R-PDIP-T18	5.33 mm	7.62 mm	Not Qualified			e3				22.86 mm
HD61825A	Renesas Electronics	TELEPHONE DIALER CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				5 V		IN-LINE			2.54 mm	75 Cel		-20 Cel		DUAL	R-PDIP-T18	5.08 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2					1:1.5	22 mm
HD61825B	Renesas Electronics	TELEPHONE DIALER CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				5 V		IN-LINE			2.54 mm	75 Cel		-20 Cel		DUAL	R-PDIP-T18	5.08 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2					1:1.5	22 mm
ICS1660N	Renesas Electronics	TELEPHONE CALLING NO IDENTIFICATION CIRCUIT	COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS			5 V		IN-LINE			2.54 mm	70 Cel		0 Cel	TIN LEAD	DUAL	R-PDIP-T18	5.33 mm	7.62 mm	Not Qualified			e0				22.86 mm
KS58C05N	Samsung		COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		.15 mA	3.5 V	3.5	IN-LINE	DIP18,.3	Telephone Circuits	2.54 mm	70 Cel		-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T18			Not Qualified			e0

Telephone Line ICs

Telephone Line ICs are electronic components used in telephone systems to interface with the telephone line and provide necessary functionality for telephone communication. These ICs are designed to provide reliable and efficient operation of the telephone line, allowing for clear and uninterrupted communication between two devices.

Telephone Line ICs use various techniques to interface with the telephone line, including pulse dialing, dual-tone multi-frequency (DTMF) signaling, and loop current sensing. Pulse dialing is used to send a series of electrical pulses over the telephone line to dial a phone number. DTMF signaling is used to send a sequence of tones to control various telephone functions, such as call forwarding and call waiting. Loop current sensing is used to detect the presence of a telephone off-hook condition, allowing the telephone system to provide appropriate signaling and call management.

Some common features of Telephone Line ICs include:

1. Telephone line interface: Telephone Line ICs provide the necessary interface with the telephone line to enable telephone communication.

2. Signal processing: Telephone Line ICs are designed to process signals quickly and efficiently, ensuring clear and uninterrupted communication.

3. Tone generation and detection: Telephone Line ICs can generate and detect various tones used for telephone communication, such as dial tones and busy signals.

4. Call management: Telephone Line ICs can provide call management functions, such as call waiting and call forwarding.

Telephone Line ICs are used in a variety of telephone systems, including traditional landline phones, cordless phones, and PBX (Private Branch Exchange) systems. They are also used in other communication systems that require telephone line interface, such as alarm systems and security systems.