Part | RoHS | Manufacturer | Polarity or Channel Type | Configuration | Surface Mount | Maximum Power Dissipation (Abs) | Package Body Material | Transistor Application | Minimum DS Breakdown Voltage | Minimum Power Gain (Gp) | Terminal Form | Package Shape | Operating Mode | No. of Elements | Highest Frequency Band | Maximum Pulsed Drain Current (IDM) | Maximum Drain Current (Abs) (ID) | No. of Terminals | Package Style (Meter) | Sub-Category | Field Effect Transistor Technology | Maximum Power Dissipation Ambient | Maximum Operating Temperature | Transistor Element Material | Minimum Operating Temperature | Terminal Finish | Maximum Drain-Source On Resistance | Maximum Drain Current (ID) | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Case Connection | Qualification | Additional Features | JEDEC-95 Code | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Feedback Capacitance (Crss) | Reference Standard |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
105 V |
16.5 dB |
FLAT |
SQUARE |
ENHANCEMENT MODE |
1 |
L BAND |
2 |
FLANGE MOUNT |
METAL-OXIDE SEMICONDUCTOR |
225 Cel |
SILICON |
DUAL |
S-CDFM-F2 |
SOURCE |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||
|
Wolfspeed |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
105 V |
16.5 dB |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
L BAND |
2 |
FLANGE MOUNT |
METAL-OXIDE SEMICONDUCTOR |
225 Cel |
SILICON |
DUAL |
R-CDFM-F2 |
SOURCE |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||
|
STMicroelectronics |
N-CHANNEL |
SINGLE |
YES |
74 W |
PLASTIC/EPOXY |
AMPLIFIER |
65 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
ULTRA HIGH FREQUENCY BAND |
4 A |
2 |
FLATPACK |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
200 Cel |
SILICON |
4 A |
DUAL |
R-PDFP-F2 |
SOURCE |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||
|
Toshiba |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
15 V |
FLAT |
RECTANGULAR |
DEPLETION MODE |
1 |
KU BAND |
20 A |
2 |
FLANGE MOUNT |
Other Transistors |
JUNCTION |
136 W |
175 Cel |
GALLIUM ARSENIDE |
20 A |
DUAL |
R-CDFM-F2 |
SOURCE |
Not Qualified |
|||||||||||||||
|
NXP Semiconductors |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
150 V |
16.2 dB |
FLAT |
RECTANGULAR |
DEPLETION MODE |
1 |
S BAND |
2 |
FLATPACK |
METAL-OXIDE SEMICONDUCTOR |
225 Cel |
GALLIUM NITRIDE |
-55 Cel |
DUAL |
R-CDFP-F2 |
40 |
260 |
|||||||||||||||||
|
NXP Semiconductors |
N-CHANNEL |
SINGLE |
1 |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
225 Cel |
TIN |
3 |
e3 |
40 |
260 |
||||||||||||||||||||||||||||
|
Wolfspeed |
N-CHANNEL |
SINGLE |
NO |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
84 V |
13 dB |
FLAT |
RECTANGULAR |
DEPLETION MODE |
1 |
C BAND |
2 |
FLANGE MOUNT |
HIGH ELECTRON MOBILITY |
150 Cel |
GALLIUM NITRIDE |
-40 Cel |
3 A |
DUAL |
R-CDFM-F2 |
SOURCE |
NOT SPECIFIED |
NOT SPECIFIED |
.4 pF |
||||||||||||||
|
Wolfspeed |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
120 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
S BAND |
2 |
FLANGE MOUNT |
HIGH ELECTRON MOBILITY |
GALLIUM NITRIDE |
GOLD OVER NICKEL |
DUAL |
R-CDFM-F2 |
SOURCE |
Not Qualified |
e4 |
||||||||||||||||||
|
Wolfspeed |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
120 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
S BAND |
2 |
FLANGE MOUNT |
HIGH ELECTRON MOBILITY |
GALLIUM NITRIDE |
GOLD OVER NICKEL |
DUAL |
R-CDFM-F2 |
SOURCE |
Not Qualified |
e4 |
||||||||||||||||||
Wolfspeed |
||||||||||||||||||||||||||||||||||||||||
Wolfspeed |
N-CHANNEL |
SINGLE |
YES |
PLASTIC/EPOXY |
AMPLIFIER |
120 V |
NO LEAD |
SQUARE |
ENHANCEMENT MODE |
1 |
C BAND |
6 |
SMALL OUTLINE |
HIGH ELECTRON MOBILITY |
GALLIUM NITRIDE |
DUAL |
S-PDSO-N6 |
|||||||||||||||||||||||
|
Wolfspeed |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
120 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
C BAND |
2 |
FLATPACK |
FET RF Small Signal |
HIGH ELECTRON MOBILITY |
175 Cel |
GALLIUM NITRIDE |
DUAL |
R-CDFP-F2 |
SOURCE |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||
|
Wolfspeed |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
120 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
S BAND |
2 |
FLANGE MOUNT |
FET RF Small Signal |
HIGH ELECTRON MOBILITY |
175 Cel |
GALLIUM NITRIDE |
GOLD OVER NICKEL |
DUAL |
R-CDFM-F2 |
SOURCE |
Not Qualified |
e4 |
||||||||||||||||
|
Wolfspeed |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
120 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
S BAND |
2 |
FLANGE MOUNT |
HIGH ELECTRON MOBILITY |
GALLIUM NITRIDE |
GOLD OVER NICKEL |
DUAL |
R-CDFM-F2 |
SOURCE |
e4 |
|||||||||||||||||||
|
Wolfspeed |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
120 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
S BAND |
2 |
FLANGE MOUNT |
HIGH ELECTRON MOBILITY |
GALLIUM NITRIDE |
GOLD OVER NICKEL |
DUAL |
R-CDFM-F2 |
SOURCE |
e4 |
|||||||||||||||||||
|
Wolfspeed |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
||||||||||||||||||||||||||||||||||||||||
|
Wolfspeed |
|||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
N-CHANNEL |
SINGLE |
YES |
160 W |
PLASTIC/EPOXY |
AMPLIFIER |
80 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
ULTRA HIGH FREQUENCY BAND |
5 A |
2 |
SMALL OUTLINE |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
165 Cel |
SILICON |
Matte Tin (Sn) - annealed |
9 A |
DUAL |
R-PDSO-F2 |
3 |
SOURCE |
Not Qualified |
HIGH RELIABILITY |
e3 |
30 |
250 |
|||||||||
|
NXP Semiconductors |
N-CHANNEL |
YES |
PLASTIC/EPOXY |
AMPLIFIER |
NO LEAD |
RECTANGULAR |
ENHANCEMENT MODE |
L BAND |
4 |
SMALL OUTLINE |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
TIN |
QUAD |
R-PQSO-N4 |
3 |
e3 |
40 |
260 |
||||||||||||||||||||
|
NXP Semiconductors |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
150 V |
17 dB |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
ULTRA HIGH FREQUENCY BAND |
2 |
FLANGE MOUNT |
METAL-OXIDE SEMICONDUCTOR |
225 Cel |
GALLIUM NITRIDE |
-55 Cel |
DUAL |
R-CDFM-F2 |
SOURCE |
40 |
260 |
1 pF |
|||||||||||||||
NXP Semiconductors |
N-CHANNEL |
SINGLE |
YES |
31.2 W |
PLASTIC/EPOXY |
AMPLIFIER |
40 V |
NO LEAD |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
ULTRA HIGH FREQUENCY BAND |
2 A |
4 |
SMALL OUTLINE |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
Tin/Lead (Sn/Pb) |
2 A |
QUAD |
R-PQSO-N4 |
1 |
SOURCE |
Not Qualified |
e0 |
40 |
260 |
|||||||||||
|
NXP Semiconductors |
N-CHANNEL |
SEPARATE, 2 ELEMENTS |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
150 V |
14.9 dB |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
2 |
S BAND |
4 |
FLATPACK |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
GALLIUM NITRIDE |
-55 Cel |
DUAL |
R-CDFP-F4 |
SOURCE |
||||||||||||||||||
|
NXP Semiconductors |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
110 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
L BAND |
2 |
FLANGE MOUNT |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
DUAL |
R-CDFM-F2 |
SOURCE |
||||||||||||||||||||||
|
NXP Semiconductors |
N-CHANNEL |
COMMON SOURCE, 2 ELEMENTS |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
65 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
2 |
S BAND |
4 |
FLATPACK |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
225 Cel |
SILICON |
DUAL |
R-CDFP-F4 |
SOURCE |
Not Qualified |
40 |
260 |
||||||||||||||||
|
NXP Semiconductors |
N-CHANNEL |
COMMON SOURCE, 2 ELEMENTS |
YES |
1670 W |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
130 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
2 |
ULTRA HIGH FREQUENCY BAND |
4 |
FLANGE MOUNT |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
225 Cel |
SILICON |
DUAL |
R-CDFM-F4 |
SOURCE |
Not Qualified |
40 |
260 |
|||||||||||||||
STMicroelectronics |
N-CHANNEL |
SINGLE |
YES |
45 W |
PLASTIC/EPOXY |
AMPLIFIER |
40 V |
NO LEAD |
SQUARE |
ENHANCEMENT MODE |
1 |
ULTRA HIGH FREQUENCY BAND |
4 A |
5 |
CHIP CARRIER |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
TIN LEAD |
5 A |
QUAD |
S-PQCC-N5 |
SOURCE |
Not Qualified |
HIGH RELIABILITY |
e0 |
|||||||||||||
STMicroelectronics |
N-CHANNEL |
SINGLE |
YES |
52.8 W |
PLASTIC/EPOXY |
AMPLIFIER |
40 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
ULTRA HIGH FREQUENCY BAND |
4 A |
2 |
SMALL OUTLINE |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
165 Cel |
SILICON |
TIN LEAD |
4 A |
DUAL |
R-PDSO-F2 |
SOURCE |
Not Qualified |
HIGH RELIABILITY |
e0 |
|||||||||||||
|
STMicroelectronics |
N-CHANNEL |
SINGLE |
YES |
52.8 W |
PLASTIC/EPOXY |
AMPLIFIER |
40 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
ULTRA HIGH FREQUENCY BAND |
4 A |
2 |
SMALL OUTLINE |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
165 Cel |
SILICON |
MATTE TIN |
4 A |
DUAL |
R-PDSO-F2 |
1 |
SOURCE |
Not Qualified |
HIGH RELIABILITY |
e3 |
|||||||||||
|
STMicroelectronics |
N-CHANNEL |
SINGLE |
YES |
52.8 W |
PLASTIC/EPOXY |
AMPLIFIER |
65 V |
GULL WING |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
ULTRA HIGH FREQUENCY BAND |
4 A |
2 |
SMALL OUTLINE |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
165 Cel |
SILICON |
MATTE TIN |
4 A |
DUAL |
R-PDSO-G2 |
SOURCE |
Not Qualified |
HIGH RELIABILITY |
e3 |
30 |
250 |
||||||||||
|
Infineon Technologies |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
65 V |
GULL WING |
SQUARE |
ENHANCEMENT MODE |
1 |
S BAND |
2 |
SMALL OUTLINE |
METAL-OXIDE SEMICONDUCTOR |
200 Cel |
SILICON |
DUAL |
S-CDSO-G2 |
SOURCE |
HIGH RELIABILITY |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||
|
Infineon Technologies |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
105 V |
16.5 dB |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
L BAND |
2 |
FLATPACK |
METAL-OXIDE SEMICONDUCTOR |
225 Cel |
SILICON |
DUAL |
R-CDFP-F2 |
SOURCE |
|||||||||||||||||||
|
Wolfspeed |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
105 V |
16.5 dB |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
L BAND |
2 |
FLATPACK |
METAL-OXIDE SEMICONDUCTOR |
225 Cel |
SILICON |
DUAL |
R-CDFP-F2 |
SOURCE |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||
|
STMicroelectronics |
N-CHANNEL |
SINGLE |
500 W |
1 |
40 A |
FET General Purpose Powers |
METAL-OXIDE SEMICONDUCTOR |
200 Cel |
40 A |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||
Sumitomo Electric Industries |
||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
N-CHANNEL |
SINGLE |
1 |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
225 Cel |
40 |
260 |
|||||||||||||||||||||||||||||||
|
Ampleon Netherlands B V |
N-CHANNEL |
COMMON SOURCE, 2 ELEMENTS |
YES |
PLASTIC/EPOXY |
AMPLIFIER |
108 V |
17 dB |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
2 |
ULTRA HIGH FREQUENCY BAND |
4 |
FLATPACK |
METAL-OXIDE SEMICONDUCTOR |
125 Cel |
SILICON |
-40 Cel |
.3 ohm |
DUAL |
R-PDFP-F4 |
SOURCE |
IEC-60134 |
||||||||||||||||
|
Wolfspeed |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
N-CHANNEL |
COMMON SOURCE, 2 ELEMENTS |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
65 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
2 |
S BAND |
4 |
FLATPACK |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
225 Cel |
SILICON |
DUAL |
R-CDFP-F4 |
SOURCE |
Not Qualified |
40 |
260 |
||||||||||||||||
|
NXP Semiconductors |
N-CHANNEL |
COMMON SOURCE, 2 ELEMENTS |
YES |
1052 W |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
130 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
2 |
ULTRA HIGH FREQUENCY BAND |
4 |
FLANGE MOUNT |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
DUAL |
R-CDFM-F4 |
SOURCE |
Not Qualified |
40 |
260 |
|||||||||||||||
Mitsubishi Electric |
||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
N-CHANNEL |
SINGLE |
YES |
389 W |
PLASTIC/EPOXY |
125 V |
FLAT |
ROUND |
ENHANCEMENT MODE |
1 |
ULTRA HIGH FREQUENCY BAND |
20 A |
4 |
FLANGE MOUNT |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
200 Cel |
SILICON |
20 A |
RADIAL |
O-PRFM-F4 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||
|
STMicroelectronics |
N-CHANNEL |
SINGLE |
YES |
PLASTIC/EPOXY |
125 V |
FLAT |
ROUND |
ENHANCEMENT MODE |
1 |
VERY HIGH FREQUENCY BAND |
4 |
FLANGE MOUNT |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
20 A |
RADIAL |
O-PRFM-F4 |
3 |
SOURCE |
250 |
|||||||||||||||||||
|
Qorvo |
P-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
FLAT |
RECTANGULAR |
DEPLETION MODE |
1 |
C BAND |
2 |
FLATPACK |
HIGH ELECTRON MOBILITY |
GALLIUM NITRIDE |
5 A |
DUAL |
R-CDFP-F2 |
SOURCE |
30 |
260 |
|||||||||||||||||||
|
Toshiba |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
15 V |
FLAT |
RECTANGULAR |
DEPLETION MODE |
1 |
C BAND |
26 A |
2 |
FLANGE MOUNT |
Other Transistors |
METAL-OXIDE SEMICONDUCTOR |
187 W |
175 Cel |
GALLIUM ARSENIDE |
20 A |
DUAL |
R-CDFM-F2 |
SOURCE |
Not Qualified |
30 |
260 |
|||||||||||||
|
NXP Semiconductors |
N-CHANNEL |
SINGLE |
YES |
294 W |
1 |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
TIN |
3 |
e3 |
40 |
260 |
||||||||||||||||||||||||||
|
NXP Semiconductors |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
110 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
ULTRA HIGH FREQUENCY BAND |
4 |
FLANGE MOUNT |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
225 Cel |
SILICON |
DUAL |
R-CDFM-F4 |
SOURCE |
Not Qualified |
40 |
260 |
RF Power Field Effect Transistors (FET) are electronic devices used in high-frequency RF (radio frequency) applications to amplify and control high-power signals. They are commonly used in applications such as broadcasting, radar, and satellite communications.
RF Power FETs are designed to handle high-power levels and operate at high frequencies, typically in the range of a few MHz to several GHz. They have a low on-resistance and high gain, making them suitable for high-power amplification.
The RF Power FET consists of a gate, source, and drain electrode, and works by controlling the flow of majority charge carriers (electrons or holes) between the source and drain regions through the gate electrode. When a voltage is applied to the gate electrode, it creates an electric field that modifies the conductivity of the channel, allowing current to flow between the source and drain.
RF Power FETs are available in various types and configurations, including N-channel and P-channel FETs, and can handle power levels ranging from a few watts to several kilowatts. They are subject to various standards and regulations, such as JEDEC (Joint Electron Device Engineering Council) and RoHS (Restriction of Hazardous Substances), to ensure their safety and performance.