Part | RoHS | Manufacturer | Polarity or Channel Type | Configuration | Surface Mount | Nominal Transition Frequency (fT) | Maximum Power Dissipation (Abs) | Maximum Collector Current (IC) | Package Body Material | Transistor Application | Maximum Rise Time (tr) | Maximum VCEsat | Minimum DS Breakdown Voltage | Terminal Form | Package Shape | Operating Mode | No. of Elements | Maximum Fall Time (tf) | No. of Terminals | Package Style (Meter) | Sub-Category | Field Effect Transistor Technology | Maximum Power Dissipation Ambient | Minimum DC Current Gain (hFE) | Maximum Operating Temperature | Maximum Collector-Base Capacitance | Transistor Element Material | Maximum Collector-Emitter Voltage | Maximum Turn On Time (ton) | Minimum Operating Temperature | Maximum Turn Off Time (toff) | Terminal Finish | Maximum Drain-Source On Resistance | Maximum Drain Current (ID) | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Case Connection | Qualification | Additional Features | JEDEC-95 Code | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Feedback Capacitance (Crss) | Reference Standard |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Toshiba |
NPN |
YES |
.1 W |
.08 A |
1 |
BIP General Purpose Small Signal |
50 |
SILICON |
|||||||||||||||||||||||||||||||||||||
National Semiconductor |
PNP |
SINGLE |
NO |
300 MHz |
.2 W |
.08 A |
PLASTIC/EPOXY |
SWITCHING |
WIRE |
ROUND |
1 |
3 |
CYLINDRICAL |
Other Transistors |
20 |
125 Cel |
SILICON |
75 ns |
TIN LEAD |
BOTTOM |
O-PBCY-W3 |
Not Qualified |
TO-92 |
e0 |
||||||||||||||||||||||
Allegro MicroSystems |
NPN AND PNP |
NO |
.75 W |
.08 A |
BIP General Purpose Small Signal |
500 |
85 Cel |
|||||||||||||||||||||||||||||||||||||||
Onsemi |
PNP |
SINGLE |
YES |
500 MHz |
.225 W |
.08 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
20 |
150 Cel |
SILICON |
12 V |
25 ns |
35 ns |
TIN LEAD |
DUAL |
R-PDSO-G3 |
Not Qualified |
TO-236AB |
e0 |
235 |
|||||||||||||||||||
Onsemi |
PNP |
SINGLE |
YES |
500 MHz |
.08 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
20 |
SILICON |
12 V |
25 ns |
35 ns |
TIN LEAD |
DUAL |
R-PDSO-G3 |
Not Qualified |
TO-236AB |
e0 |
|||||||||||||||||||||||
|
Onsemi |
PNP |
SINGLE |
YES |
130 MHz |
.2 W |
.08 A |
PLASTIC/EPOXY |
SWITCHING |
.7 V |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
.2 W |
135 |
125 Cel |
3.2 pF |
SILICON |
160 V |
Tin/Bismuth (Sn/Bi) |
DUAL |
R-PDSO-G3 |
1 |
e6 |
||||||||||||||||||||
|
Onsemi |
NPN |
SINGLE |
YES |
150 MHz |
.2 W |
.08 A |
PLASTIC/EPOXY |
SWITCHING |
.7 V |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
.2 W |
135 |
125 Cel |
2.8 pF |
SILICON |
160 V |
Tin/Bismuth (Sn/Bi) |
DUAL |
R-PDSO-G3 |
1 |
e6 |
||||||||||||||||||||
|
Onsemi |
NPN |
SINGLE |
YES |
150 MHz |
.2 W |
.08 A |
PLASTIC/EPOXY |
SWITCHING |
.7 V |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
.2 W |
90 |
125 Cel |
2.8 pF |
SILICON |
160 V |
Tin/Bismuth (Sn/Bi) |
DUAL |
R-PDSO-G3 |
1 |
e6 |
||||||||||||||||||||
NXP Semiconductors |
PNP |
SINGLE |
NO |
500 MHz |
.08 A |
PLASTIC/EPOXY |
SWITCHING |
THROUGH-HOLE |
ROUND |
1 |
3 |
CYLINDRICAL |
30 |
SILICON |
12 V |
BOTTOM |
O-PBCY-T3 |
Not Qualified |
TO-92 |
|||||||||||||||||||||||||||
NXP Semiconductors |
PNP |
SINGLE |
NO |
500 MHz |
.08 A |
PLASTIC/EPOXY |
SWITCHING |
THROUGH-HOLE |
ROUND |
1 |
3 |
CYLINDRICAL |
30 |
SILICON |
12 V |
BOTTOM |
O-PBCY-T3 |
Not Qualified |
TO-92 |
|||||||||||||||||||||||||||
|
Toshiba |
PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.08 A |
PLASTIC/EPOXY |
SWITCHING |
FLAT |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
30 |
150 Cel |
SILICON |
50 V |
DUAL |
R-PDSO-F6 |
Not Qualified |
BUILT-IN BIAS RESISTANCE RATIO IS 1 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||
|
Toshiba |
NPN |
YES |
.05 W |
.08 A |
2 |
BIP General Purpose Small Signal |
50 |
SILICON |
|||||||||||||||||||||||||||||||||||||
|
Toshiba |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.08 A |
PLASTIC/EPOXY |
SWITCHING |
FLAT |
RECTANGULAR |
1 |
6 |
SMALL OUTLINE |
80 |
150 Cel |
SILICON |
50 V |
DUAL |
R-PDSO-F6 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 21.36 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||
Toshiba |
PNP |
SINGLE WITH BUILT-IN RESISTOR |
YES |
.08 A |
UNSPECIFIED |
SWITCHING |
NO LEAD |
RECTANGULAR |
1 |
3 |
CHIP CARRIER |
50 |
SILICON |
50 V |
BOTTOM |
R-XBCC-N3 |
COLLECTOR |
BUILT IN BIAS RESISTANCE RATIO IS 1 |
||||||||||||||||||||||||||||
|
Toshiba |
NPN |
YES |
.05 W |
.08 A |
2 |
BIP General Purpose Small Signal |
120 |
SILICON |
|||||||||||||||||||||||||||||||||||||
|
Toshiba |
PNP |
YES |
.05 W |
.08 A |
2 |
BIP General Purpose Small Signal |
120 |
SILICON |
|||||||||||||||||||||||||||||||||||||
|
Toshiba |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.08 A |
PLASTIC/EPOXY |
SWITCHING |
FLAT |
RECTANGULAR |
1 |
6 |
SMALL OUTLINE |
50 |
150 Cel |
SILICON |
50 V |
DUAL |
R-PDSO-F6 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 1 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||
|
Toshiba |
NPN AND PNP |
YES |
.05 W |
.08 A |
2 |
BIP General Purpose Small Signal |
80 |
SILICON |
|||||||||||||||||||||||||||||||||||||
|
Toshiba |
PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.08 A |
PLASTIC/EPOXY |
SWITCHING |
FLAT |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
30 |
150 Cel |
SILICON |
50 V |
DUAL |
R-PDSO-F6 |
Not Qualified |
BUILT-IN BIAS RESISTANCE RATIO IS 1 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||
|
Toshiba |
PNP |
YES |
.05 W |
.08 A |
2 |
BIP General Purpose Small Signal |
70 |
SILICON |
|||||||||||||||||||||||||||||||||||||
|
Toshiba |
PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.08 A |
PLASTIC/EPOXY |
SWITCHING |
FLAT |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
120 |
150 Cel |
SILICON |
50 V |
DUAL |
R-PDSO-F6 |
Not Qualified |
BUILT-IN BIAS RESISTOR |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||
Toshiba |
PNP |
SINGLE WITH BUILT-IN RESISTOR |
YES |
.08 A |
UNSPECIFIED |
SWITCHING |
NO LEAD |
RECTANGULAR |
1 |
3 |
CHIP CARRIER |
80 |
SILICON |
50 V |
BOTTOM |
R-XBCC-N3 |
COLLECTOR |
BUILT IN BIAS RESISTANCE RATIO IS 1 |
||||||||||||||||||||||||||||
|
Toshiba |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.08 A |
PLASTIC/EPOXY |
SWITCHING |
FLAT |
RECTANGULAR |
1 |
6 |
SMALL OUTLINE |
80 |
150 Cel |
SILICON |
50 V |
DUAL |
R-PDSO-F6 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 10 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||
|
Toshiba |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.05 W |
.08 A |
PLASTIC/EPOXY |
SWITCHING |
FLAT |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
120 |
150 Cel |
SILICON |
50 V |
DUAL |
R-PDSO-F6 |
Not Qualified |
BUILT-IN BIAS RESISTOR |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||
|
Toshiba |
NPN |
YES |
.05 W |
.08 A |
2 |
BIP General Purpose Small Signal |
80 |
SILICON |
|||||||||||||||||||||||||||||||||||||
|
Toshiba |
PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.08 A |
PLASTIC/EPOXY |
SWITCHING |
FLAT |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
30 |
150 Cel |
SILICON |
50 V |
DUAL |
R-PDSO-F6 |
Not Qualified |
BUILT-IN BIAS RESISTANCE RATIO IS 21.36 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||
|
Toshiba |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.05 W |
.08 A |
PLASTIC/EPOXY |
SWITCHING |
FLAT |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
70 |
150 Cel |
SILICON |
50 V |
DUAL |
R-PDSO-F6 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 0.46 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||
|
Toshiba |
NPN |
YES |
.05 W |
.08 A |
2 |
BIP General Purpose Small Signal |
80 |
SILICON |
|||||||||||||||||||||||||||||||||||||
|
Toshiba |
NPN AND PNP |
YES |
.05 W |
.08 A |
2 |
BIP General Purpose Small Signal |
120 |
SILICON |
|||||||||||||||||||||||||||||||||||||
|
Toshiba |
NPN |
YES |
.05 W |
.08 A |
2 |
BIP General Purpose Small Signal |
70 |
SILICON |
|||||||||||||||||||||||||||||||||||||
|
Toshiba |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.08 A |
PLASTIC/EPOXY |
SWITCHING |
FLAT |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
120 |
150 Cel |
SILICON |
50 V |
DUAL |
R-PDSO-F6 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||
|
Toshiba |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.05 W |
.08 A |
PLASTIC/EPOXY |
SWITCHING |
FLAT |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
120 |
150 Cel |
SILICON |
50 V |
DUAL |
R-PDSO-F6 |
Not Qualified |
BUILT-IN BIAS RESISTOR |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||
Toshiba |
PNP |
YES |
.1 W |
.08 A |
1 |
BIP General Purpose Small Signal |
80 |
SILICON |
||||||||||||||||||||||||||||||||||||||
Toshiba |
PNP |
SINGLE WITH BUILT-IN RESISTOR |
YES |
.08 A |
UNSPECIFIED |
SWITCHING |
NO LEAD |
RECTANGULAR |
1 |
3 |
CHIP CARRIER |
80 |
SILICON |
50 V |
BOTTOM |
R-XBCC-N3 |
COLLECTOR |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 1 |
|||||||||||||||||||||||||||
Toshiba |
PNP |
SINGLE WITH BUILT-IN RESISTOR |
YES |
.08 A |
UNSPECIFIED |
SWITCHING |
NO LEAD |
RECTANGULAR |
1 |
3 |
CHIP CARRIER |
120 |
SILICON |
50 V |
BOTTOM |
R-XBCC-N3 |
COLLECTOR |
Not Qualified |
BUILT-IN BIAS RESISTOR |
|||||||||||||||||||||||||||
|
Toshiba |
NPN AND PNP |
YES |
.05 W |
.08 A |
2 |
BIP General Purpose Small Signal |
80 |
SILICON |
|||||||||||||||||||||||||||||||||||||
Toshiba |
PNP |
YES |
.1 W |
.08 A |
1 |
BIP General Purpose Small Signal |
80 |
SILICON |
||||||||||||||||||||||||||||||||||||||
Toshiba |
PNP |
SINGLE WITH BUILT-IN RESISTOR |
YES |
.08 A |
UNSPECIFIED |
SWITCHING |
NO LEAD |
RECTANGULAR |
1 |
3 |
CHIP CARRIER |
120 |
SILICON |
50 V |
BOTTOM |
R-XBCC-N3 |
COLLECTOR |
|||||||||||||||||||||||||||||
Toshiba |
NPN |
SEPARATE, 2 ELEMENTS |
YES |
.08 A |
PLASTIC/EPOXY |
UNSPECIFIED |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
SILICON |
12 V |
DUAL |
R-PDSO-X6 |
Not Qualified |
|||||||||||||||||||||||||||||||
|
Toshiba |
NPN AND PNP |
YES |
.05 W |
.08 A |
2 |
BIP General Purpose Small Signal |
30 |
SILICON |
|||||||||||||||||||||||||||||||||||||
Toshiba |
PNP |
YES |
.1 W |
.08 A |
1 |
BIP General Purpose Small Signal |
120 |
SILICON |
||||||||||||||||||||||||||||||||||||||
|
Toshiba |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.05 W |
.08 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
50 |
150 Cel |
SILICON |
50 V |
DUAL |
R-PDSO-G6 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 1 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||
|
Toshiba |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.05 W |
.08 A |
PLASTIC/EPOXY |
SWITCHING |
FLAT |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
80 |
150 Cel |
SILICON |
50 V |
DUAL |
R-PDSO-F6 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 10 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||
|
Toshiba |
NPN AND PNP |
YES |
.05 W |
.08 A |
2 |
BIP General Purpose Small Signal |
70 |
SILICON |
|||||||||||||||||||||||||||||||||||||
|
Toshiba |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.08 A |
PLASTIC/EPOXY |
SWITCHING |
FLAT |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
120 |
150 Cel |
SILICON |
50 V |
DUAL |
R-PDSO-F6 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||
Toshiba |
PNP |
YES |
.1 W |
.08 A |
1 |
BIP General Purpose Small Signal |
120 |
SILICON |
||||||||||||||||||||||||||||||||||||||
|
Toshiba |
NPN |
YES |
.05 W |
.08 A |
2 |
BIP General Purpose Small Signal |
30 |
SILICON |
|||||||||||||||||||||||||||||||||||||
Toshiba |
PNP |
SINGLE WITH BUILT-IN RESISTOR |
YES |
.08 A |
UNSPECIFIED |
SWITCHING |
NO LEAD |
RECTANGULAR |
1 |
3 |
CHIP CARRIER |
30 |
SILICON |
50 V |
BOTTOM |
R-XBCC-N3 |
COLLECTOR |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 1 |
Small Signal Bipolar Junction Transistors (BJT) are electronic devices used in low-power applications to amplify and switch small signals. They are commonly used in applications such as audio amplifiers, signal processing, and low-power digital circuits.
Small Signal BJTs are designed to handle low-power levels and operate at low to medium frequencies, typically in the range of a few Hz to several MHz. They have a high gain and low noise figure, making them suitable for small signal amplification.
The Small Signal BJT consists of an emitter, base, and collector region, and works by controlling the flow of majority charge carriers (electrons or holes) between the emitter and collector through the base region. When a voltage is applied to the base-emitter junction, a small current flows through the base, allowing a larger current to flow from the emitter to the collector.
Proper use of Small Signal BJTs is important to ensure optimal performance, reliability, and compatibility with other components in the circuit. Small Signal BJTs are often used in conjunction with other components, such as capacitors and resistors, to form complete low-power electronic circuits.B395