Part | RoHS | Manufacturer | Polarity or Channel Type | Configuration | Surface Mount | Nominal Transition Frequency (fT) | Maximum Power Dissipation (Abs) | Maximum Collector Current (IC) | Package Body Material | Transistor Application | Maximum Rise Time (tr) | Maximum VCEsat | Minimum DS Breakdown Voltage | Terminal Form | Package Shape | Operating Mode | No. of Elements | Maximum Fall Time (tf) | No. of Terminals | Package Style (Meter) | Sub-Category | Field Effect Transistor Technology | Maximum Power Dissipation Ambient | Minimum DC Current Gain (hFE) | Maximum Operating Temperature | Maximum Collector-Base Capacitance | Transistor Element Material | Maximum Collector-Emitter Voltage | Maximum Turn On Time (ton) | Minimum Operating Temperature | Maximum Turn Off Time (toff) | Terminal Finish | Maximum Drain-Source On Resistance | Maximum Drain Current (ID) | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Case Connection | Qualification | Additional Features | JEDEC-95 Code | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Feedback Capacitance (Crss) | Reference Standard |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
NPN |
SINGLE |
NO |
100 MHz |
.625 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.6 V |
THROUGH-HOLE |
ROUND |
1 |
3 |
CYLINDRICAL |
Other Transistors |
420 |
150 Cel |
SILICON |
45 V |
MATTE TIN |
BOTTOM |
O-PBCY-T3 |
Not Qualified |
TO-92 |
e3 |
||||||||||||||||||||
|
Fairchild Semiconductor |
NPN |
SINGLE |
NO |
300 MHz |
.625 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
THROUGH-HOLE |
ROUND |
1 |
3 |
CYLINDRICAL |
Other Transistors |
200 |
150 Cel |
SILICON |
30 V |
MATTE TIN |
BOTTOM |
O-PBCY-T3 |
Not Qualified |
TO-92 |
e3 |
|||||||||||||||||||||
|
Onsemi |
PNP |
SINGLE |
NO |
320 MHz |
1.5 W |
.1 A |
PLASTIC/EPOXY |
AMPLIFIER |
THROUGH-HOLE |
ROUND |
1 |
3 |
CYLINDRICAL |
Other Transistors |
120 |
150 Cel |
SILICON |
45 V |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
O-PBCY-T3 |
Not Qualified |
EUROPEAN PART NUMBER |
TO-92 |
e1 |
40 |
260 |
||||||||||||||||||
|
Nexperia |
NPN |
SINGLE |
YES |
100 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.3 V |
GULL WING |
RECTANGULAR |
1 |
6 |
SMALL OUTLINE |
110 |
150 Cel |
1.5 pF |
SILICON |
65 V |
-65 Cel |
DUAL |
R-PDSO-G6 |
AEC-Q101; IEC-60134 |
||||||||||||||||||||||
|
Diodes Incorporated |
NPN AND PNP |
SEPARATE, 2 ELEMENTS |
YES |
300 MHz |
.2 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signals |
200 |
150 Cel |
SILICON |
45 V |
MATTE TIN |
DUAL |
R-PDSO-G6 |
1 |
HIGH RELIABILITY |
e3 |
30 |
260 |
AEC-Q101 |
||||||||||||||||||
Onsemi |
PNP |
SINGLE |
YES |
100 MHz |
.125 W |
.1 A |
PLASTIC/EPOXY |
AMPLIFIER |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
220 |
150 Cel |
SILICON |
45 V |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
e0 |
30 |
235 |
||||||||||||||||||||
|
Micro Commercial Components |
PNP |
SEPARATE, 2 ELEMENTS |
YES |
100 MHz |
.15 W |
.1 A |
PLASTIC/EPOXY |
FLAT |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
Other Transistors |
200 |
150 Cel |
SILICON |
45 V |
Matte Tin (Sn) |
DUAL |
R-PDSO-F6 |
1 |
Not Qualified |
e3 |
10 |
260 |
||||||||||||||||||||
|
Infineon Technologies |
PNP |
SINGLE |
YES |
250 MHz |
.25 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
220 |
150 Cel |
SILICON |
45 V |
Matte Tin (Sn) |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
e3 |
40 |
260 |
|||||||||||||||||||
|
NXP Semiconductors |
PNP |
SINGLE |
YES |
100 MHz |
.2 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.65 V |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
125 |
150 Cel |
5 pF |
SILICON |
45 V |
Tin (Sn) |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
e3 |
30 |
260 |
|||||||||||||||||
|
Onsemi |
PNP |
SINGLE |
YES |
100 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
125 |
150 Cel |
SILICON |
30 V |
-55 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
TO-236AB |
e3 |
40 |
260 |
||||||||||||||||||
|
NXP Semiconductors |
PNP |
YES |
100 MHz |
.38 W |
.1 A |
Other Transistors |
200 |
150 Cel |
TIN |
1 |
e3 |
30 |
260 |
||||||||||||||||||||||||||||||||
|
Infineon Technologies |
NPN |
SINGLE WITH BUILT-IN RESISTOR |
YES |
140 MHz |
.25 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
20 |
SILICON |
50 V |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 1 |
|||||||||||||||||||||||
|
Infineon Technologies |
PNP |
SINGLE WITH BUILT-IN RESISTOR |
YES |
160 MHz |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
70 |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 10 |
e3 |
|||||||||||||||||||||||
|
Infineon Technologies |
PNP |
SINGLE WITH BUILT-IN RESISTOR |
YES |
200 MHz |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
30 |
SILICON |
50 V |
DUAL |
R-PDSO-G3 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 1 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||
|
NXP Semiconductors |
NPN |
CURRENT MIRROR |
YES |
100 MHz |
.25 W |
.1 A |
PLASTIC/EPOXY |
.6 V |
GULL WING |
RECTANGULAR |
1 |
4 |
SMALL OUTLINE |
Other Transistors |
110 |
150 Cel |
SILICON |
30 V |
TIN |
DUAL |
R-PDSO-G4 |
1 |
COLLECTOR |
Not Qualified |
FOR TRANSISTOR2 HFE IS 420 |
e3 |
30 |
260 |
|||||||||||||||||
|
NXP Semiconductors |
NPN |
SINGLE |
YES |
250 MHz |
.25 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.55 V |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
90 |
150 Cel |
SILICON |
45 V |
150 ns |
800 ns |
TIN |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
LOW NOISE |
TO-236AB |
e3 |
30 |
260 |
||||||||||||||
|
Infineon Technologies |
PNP |
SINGLE |
YES |
250 MHz |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
110 |
SILICON |
45 V |
TIN |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
e3 |
||||||||||||||||||||||||
|
NXP Semiconductors |
NPN |
SINGLE |
YES |
100 MHz |
.225 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.2 V |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
20 |
150 Cel |
SILICON |
80 V |
1000 ns |
TIN |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
TO-236AB |
e3 |
30 |
260 |
||||||||||||||||
|
Leshan Radio |
NPN |
YES |
.385 W |
.1 A |
2 |
BIP General Purpose Small Signal |
80 |
SILICON |
|||||||||||||||||||||||||||||||||||||
|
Leshan Radio |
NPN |
YES |
.385 W |
.1 A |
2 |
BIP General Purpose Small Signal |
160 |
SILICON |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||
|
Onsemi |
PNP |
YES |
.4 W |
.1 A |
1 |
BIP General Purpose Small Signal |
60 |
SILICON |
MATTE TIN |
1 |
e3 |
30 |
260 |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
NPN |
SINGLE WITH BUILT-IN RESISTOR |
YES |
.25 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.3 V |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
.25 W |
30 |
150 Cel |
3.5 pF |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 1 |
TO-236AB |
e3 |
30 |
260 |
|||||||||||||||
|
NXP Semiconductors |
NPN |
SINGLE WITH BUILT-IN RESISTOR |
YES |
.25 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.3 V |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
.25 W |
100 |
150 Cel |
3.5 pF |
SILICON |
50 V |
Tin (Sn) |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
BUILT IN BIAS RESISTANCE RATIO IS 21 |
TO-236AB |
e3 |
30 |
260 |
|||||||||||||||
|
NXP Semiconductors |
NPN |
SINGLE WITH BUILT-IN RESISTOR |
YES |
.2 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
35 |
150 Cel |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
BUILT IN BIAS RESISTOR RATIO IS 4.5 |
e3 |
30 |
260 |
|||||||||||||||||||
|
NXP Semiconductors |
NPN |
SINGLE WITH BUILT-IN RESISTOR |
YES |
.2 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
80 |
150 Cel |
SILICON |
50 V |
Tin (Sn) |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
BUILT IN BIAS RESISTANCE RATIO IS 1 |
e3 |
30 |
260 |
|||||||||||||||||||
|
Onsemi |
PNP |
SINGLE WITH BUILT-IN RESISTOR |
YES |
.31 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
35 |
SILICON |
50 V |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G3 |
1 |
BUILT IN BIAS RESISTANCE RATIO IS 1 |
e3 |
NOT SPECIFIED |
NOT SPECIFIED |
AEC-Q101 |
||||||||||||||||||||
Onsemi |
NPN |
SINGLE |
NO |
.1 A |
PLASTIC/EPOXY |
AMPLIFIER |
THROUGH-HOLE |
ROUND |
1 |
3 |
CYLINDRICAL |
600 |
SILICON |
45 V |
BOTTOM |
O-PBCY-T3 |
LOW NOISE |
TO-92 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
NPN |
SINGLE |
YES |
100 MHz |
.43 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
NO LEAD |
RECTANGULAR |
1 |
3 |
CHIP CARRIER |
Other Transistors |
120 |
150 Cel |
SILICON |
50 V |
TIN |
BOTTOM |
R-PBCC-N3 |
1 |
COLLECTOR |
Not Qualified |
e3 |
30 |
260 |
||||||||||||||||||
|
Fairchild Semiconductor |
NPN |
SINGLE |
NO |
300 MHz |
.625 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
THROUGH-HOLE |
ROUND |
1 |
3 |
CYLINDRICAL |
Other Transistors |
420 |
150 Cel |
SILICON |
30 V |
MATTE TIN |
BOTTOM |
O-PBCY-T3 |
Not Qualified |
TO-92 |
e3 |
|||||||||||||||||||||
|
NXP Semiconductors |
NPN AND PNP |
SEPARATE, 2 ELEMENTS |
YES |
100 MHz |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
200 |
150 Cel |
SILICON |
65 V |
Tin (Sn) |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
e3 |
30 |
260 |
|||||||||||||||||||||
|
Diodes Incorporated |
NPN AND PNP |
SEPARATE, 2 ELEMENTS |
YES |
300 MHz |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
200 |
SILICON |
45 V |
MATTE TIN |
DUAL |
R-PDSO-G6 |
1 |
HIGH RELIABILITY |
e3 |
260 |
AEC-Q101 |
||||||||||||||||||||||
|
Onsemi |
NPN |
SINGLE |
YES |
100 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
.6 V |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
200 |
150 Cel |
4.5 pF |
SILICON |
30 V |
-55 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
TO-236 |
e3 |
40 |
260 |
||||||||||||||||
|
NXP Semiconductors |
NPN |
SINGLE |
YES |
100 MHz |
.1 A |
PLASTIC/EPOXY |
AMPLIFIER |
.6 V |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
200 |
150 Cel |
3 pF |
SILICON |
45 V |
TIN |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
LOW NOISE |
e3 |
30 |
260 |
|||||||||||||||||
|
Diodes Incorporated |
PNP |
SINGLE |
YES |
200 MHz |
.2 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
125 |
150 Cel |
SILICON |
65 V |
MATTE TIN |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
e3 |
30 |
260 |
|||||||||||||||||||
|
Infineon Technologies |
PNP |
SINGLE |
YES |
250 MHz |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
125 |
150 Cel |
SILICON |
45 V |
TIN |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
e3 |
|||||||||||||||||||||||
|
Infineon Technologies |
NPN |
YES |
.25 W |
.1 A |
1 |
BIP General Purpose Small Signal |
30 |
SILICON |
1 |
260 |
|||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PNP |
YES |
.25 W |
.1 A |
1 |
BIP General Purpose Small Signal |
30 |
SILICON |
1 |
260 |
|||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PNP |
SINGLE WITH BUILT-IN RESISTOR |
YES |
200 MHz |
.25 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
30 |
SILICON |
50 V |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 1 |
|||||||||||||||||||||||
|
Infineon Technologies |
PNP |
YES |
.25 W |
.1 A |
1 |
BIP General Purpose Small Signal |
30 |
SILICON |
1 |
260 |
|||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PNP |
YES |
.25 W |
.1 A |
1 |
BIP General Purpose Small Signal |
30 |
SILICON |
1 |
260 |
|||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PNP |
SINGLE WITH BUILT-IN RESISTOR |
YES |
200 MHz |
.25 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
BIP General Purpose Small Signals |
70 |
SILICON |
50 V |
MATTE TIN |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 4.7 |
e3 |
260 |
||||||||||||||||||||
|
Infineon Technologies |
NPN |
SINGLE |
YES |
250 MHz |
.33 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
90 |
150 Cel |
SILICON |
45 V |
MATTE TIN |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
e3 |
40 |
260 |
|||||||||||||||||||
|
NXP Semiconductors |
NPN |
SINGLE |
YES |
70 MHz |
1.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.5 V |
FLAT |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
40 |
150 Cel |
2 pF |
SILICON |
350 V |
TIN |
SINGLE |
R-PSSO-F3 |
1 |
COLLECTOR |
Not Qualified |
TO-243AA |
e3 |
30 |
260 |
|||||||||||||||
|
ROHM |
NPN |
SINGLE WITH BUILT-IN RESISTOR |
YES |
250 MHz |
.15 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
FLAT |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
.15 W |
30 |
150 Cel |
SILICON |
50 V |
TIN SILVER COPPER |
DUAL |
R-PDSO-F3 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 1 |
e1 |
10 |
260 |
|||||||||||||||||
|
Leshan Radio |
NPN |
SINGLE |
YES |
100 MHz |
.15 W |
.1 A |
PLASTIC/EPOXY |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
420 |
150 Cel |
SILICON |
45 V |
DUAL |
R-PDSO-G3 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||
|
Onsemi |
PNP |
SINGLE WITH BUILT-IN RESISTOR |
YES |
.2 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
60 |
150 Cel |
SILICON |
50 V |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO 1 |
TO-236AB |
e3 |
40 |
260 |
||||||||||||||||||
|
Onsemi |
NPN |
SINGLE WITH BUILT-IN RESISTOR |
YES |
.15 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
80 |
150 Cel |
SILICON |
50 V |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 21.36 |
e3 |
40 |
260 |
|||||||||||||||||||
|
Onsemi |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.385 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
80 |
150 Cel |
SILICON |
50 V |
MATTE TIN |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO 21.36 |
e3 |
30 |
260 |
Small Signal Bipolar Junction Transistors (BJT) are electronic devices used in low-power applications to amplify and switch small signals. They are commonly used in applications such as audio amplifiers, signal processing, and low-power digital circuits.
Small Signal BJTs are designed to handle low-power levels and operate at low to medium frequencies, typically in the range of a few Hz to several MHz. They have a high gain and low noise figure, making them suitable for small signal amplification.
The Small Signal BJT consists of an emitter, base, and collector region, and works by controlling the flow of majority charge carriers (electrons or holes) between the emitter and collector through the base region. When a voltage is applied to the base-emitter junction, a small current flows through the base, allowing a larger current to flow from the emitter to the collector.
Proper use of Small Signal BJTs is important to ensure optimal performance, reliability, and compatibility with other components in the circuit. Small Signal BJTs are often used in conjunction with other components, such as capacitors and resistors, to form complete low-power electronic circuits.B395