Part | RoHS | Manufacturer | Polarity or Channel Type | Configuration | Surface Mount | Nominal Transition Frequency (fT) | Maximum Power Dissipation (Abs) | Maximum Collector Current (IC) | Package Body Material | Transistor Application | Maximum Rise Time (tr) | Maximum VCEsat | Minimum DS Breakdown Voltage | Terminal Form | Package Shape | Operating Mode | No. of Elements | Maximum Fall Time (tf) | No. of Terminals | Package Style (Meter) | Sub-Category | Field Effect Transistor Technology | Maximum Power Dissipation Ambient | Minimum DC Current Gain (hFE) | Maximum Operating Temperature | Maximum Collector-Base Capacitance | Transistor Element Material | Maximum Collector-Emitter Voltage | Maximum Turn On Time (ton) | Minimum Operating Temperature | Maximum Turn Off Time (toff) | Terminal Finish | Maximum Drain-Source On Resistance | Maximum Drain Current (ID) | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Case Connection | Qualification | Additional Features | JEDEC-95 Code | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Feedback Capacitance (Crss) | Reference Standard |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
NPN |
SINGLE |
NO |
100 MHz |
1 A |
METAL |
SWITCHING |
WIRE |
ROUND |
1 |
3 |
CYLINDRICAL |
100 |
175 Cel |
SILICON |
80 V |
TIN LEAD |
BOTTOM |
O-MBCY-W3 |
COLLECTOR |
Qualified |
TO-18 |
e0 |
MIL-19500/391H |
||||||||||||||||||||||
Microchip Technology |
NPN |
SINGLE |
NO |
1.5 A |
METAL |
WIRE |
ROUND |
1 |
3 |
CYLINDRICAL |
35 |
200 Cel |
SILICON |
55 V |
TIN LEAD |
BOTTOM |
O-MBCY-W3 |
Qualified |
TO-5 |
e0 |
MIL-19500/207 |
|||||||||||||||||||||||||
Microchip Technology |
PNP |
SINGLE |
YES |
.5 W |
.6 A |
CERAMIC, METAL-SEALED COFIRED |
1.6 V |
NO LEAD |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
.5 W |
50 |
200 Cel |
8 pF |
SILICON |
60 V |
45 ns |
-65 Cel |
300 ns |
DUAL |
R-CDSO-N3 |
Not Qualified |
MIL-19500 |
|||||||||||||||||||||
Microchip Technology |
NPN AND PNP |
SEPARATE, 2 ELEMENTS |
YES |
.6 A |
CERAMIC, METAL-SEALED COFIRED |
NO LEAD |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
50 |
200 Cel |
SILICON |
40 V |
45 ns |
300 ns |
TIN LEAD |
DUAL |
R-XDSO-N6 |
Qualified |
e0 |
MIL-19500/421G |
||||||||||||||||||||||||
Microchip Technology |
NPN |
SINGLE |
YES |
.8 A |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
NO LEAD |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
30 |
200 Cel |
SILICON |
50 V |
35 ns |
300 ns |
Tin/Lead (Sn/Pb) |
DUAL |
R-CDSO-N3 |
Qualified |
e0 |
MIL-19500/255 |
|||||||||||||||||||||||
Microchip Technology |
NPN |
SINGLE |
NO |
100 MHz |
1 A |
METAL |
WIRE |
ROUND |
1 |
3 |
CYLINDRICAL |
15 |
SILICON |
80 V |
BOTTOM |
O-MBCY-W3 |
TO-5 |
|||||||||||||||||||||||||||||
Microchip Technology |
NPN |
SINGLE |
NO |
15 MHz |
5 W |
1 A |
METAL |
WIRE |
ROUND |
1 |
3 |
CYLINDRICAL |
Other Transistors |
40 |
200 Cel |
SILICON |
250 V |
1000 ns |
10000 ns |
TIN LEAD |
BOTTOM |
O-MBCY-W3 |
COLLECTOR |
Qualified |
TO-205AD |
e0 |
MIL-19500 |
|||||||||||||||||||
Microchip Technology |
PNP |
SINGLE |
NO |
.6 A |
METAL |
SWITCHING |
WIRE |
ROUND |
1 |
3 |
CYLINDRICAL |
50 |
200 Cel |
SILICON |
60 V |
45 ns |
300 ns |
TIN LEAD |
BOTTOM |
O-MBCY-W3 |
COLLECTOR |
Qualified |
TO-39 |
e0 |
MIL-19500/290K |
|||||||||||||||||||||
|
Microchip Technology |
NPN |
SINGLE |
YES |
5 W |
1 A |
CERAMIC, METAL-SEALED COFIRED |
NO LEAD |
RECTANGULAR |
1 |
4 |
SMALL OUTLINE |
Other Transistors |
40 |
200 Cel |
SILICON |
350 V |
1000 ns |
10000 ns |
GOLD OVER NICKEL |
DUAL |
R-CDSO-N4 |
COLLECTOR |
Qualified |
e4 |
MIL-19500 |
||||||||||||||||||||
Microchip Technology |
NPN |
SINGLE |
NO |
15 MHz |
5 W |
1 A |
METAL |
WIRE |
ROUND |
1 |
3 |
CYLINDRICAL |
Other Transistors |
40 |
200 Cel |
SILICON |
250 V |
1000 ns |
10000 ns |
TIN LEAD |
BOTTOM |
O-MBCY-W3 |
COLLECTOR |
Qualified |
TO-205AD |
e0 |
MIL-19500 |
|||||||||||||||||||
Microchip Technology |
NPN |
SINGLE |
NO |
.8 W |
1 A |
METAL |
WIRE |
ROUND |
1 |
3 |
CYLINDRICAL |
Other Transistors |
40 |
200 Cel |
SILICON |
250 V |
1000 ns |
10000 ns |
TIN LEAD |
BOTTOM |
O-MBCY-W3 |
COLLECTOR |
Qualified |
TO-5 |
e0 |
MIL-19500 |
||||||||||||||||||||
Microchip Technology |
NPN |
SINGLE |
NO |
.5 A |
METAL |
WIRE |
ROUND |
1 |
3 |
CYLINDRICAL |
40 |
200 Cel |
SILICON |
80 V |
TIN LEAD |
BOTTOM |
O-MBCY-W3 |
COLLECTOR |
Qualified |
TO-5 |
e0 |
MIL-19500/182F |
||||||||||||||||||||||||
Microchip Technology |
NPN |
SINGLE |
NO |
.5 A |
METAL |
WIRE |
ROUND |
1 |
3 |
CYLINDRICAL |
40 |
200 Cel |
SILICON |
80 V |
TIN LEAD |
BOTTOM |
O-MBCY-W3 |
COLLECTOR |
Qualified |
TO-5 |
e0 |
MIL-19500/182F |
||||||||||||||||||||||||
Microchip Technology |
NPN |
SINGLE |
NO |
1 W |
1 A |
METAL |
.5 V |
WIRE |
ROUND |
1 |
3 |
CYLINDRICAL |
.5 W |
15 |
200 Cel |
12 pF |
SILICON |
80 V |
-65 Cel |
BOTTOM |
O-MBCY-W3 |
COLLECTOR |
Qualified |
HIGH RELIABILITY |
TO-206AA |
MIL-19500; RH - 100K Rad(Si) |
||||||||||||||||||||
Microchip Technology |
NPN |
SINGLE |
NO |
.5 A |
METAL |
WIRE |
ROUND |
1 |
3 |
CYLINDRICAL |
40 |
200 Cel |
SILICON |
80 V |
TIN LEAD |
BOTTOM |
O-MBCY-W3 |
COLLECTOR |
Qualified |
TO-5 |
e0 |
MIL-19500/182F |
||||||||||||||||||||||||
Microchip Technology |
NPN |
SINGLE |
YES |
.8 A |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
NO LEAD |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
30 |
SILICON |
50 V |
DUAL |
R-CDSO-N3 |
MIL-19500/255 |
|||||||||||||||||||||||||||||
Microchip Technology |
NPN |
SINGLE |
NO |
500 MHz |
.36 W |
.2 A |
METAL |
SWITCHING |
WIRE |
ROUND |
1 |
3 |
CYLINDRICAL |
Other Transistors |
20 |
200 Cel |
SILICON |
15 V |
12 ns |
18 ns |
TIN LEAD |
BOTTOM |
O-MBCY-W3 |
COLLECTOR |
Qualified |
TO-18 |
e0 |
MIL-19500/317K |
||||||||||||||||||
Microchip Technology |
NPN |
SINGLE |
NO |
50 MHz |
.8 W |
.5 A |
METAL |
SWITCHING |
WIRE |
ROUND |
1 |
3 |
CYLINDRICAL |
Other Transistors |
40 |
200 Cel |
SILICON |
80 V |
TIN LEAD |
BOTTOM |
O-MBCY-W3 |
Not Qualified |
TO-39 |
e0 |
||||||||||||||||||||||
Microchip Technology |
||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
PNP |
SINGLE |
NO |
10 W |
1 A |
METAL |
SWITCHING |
WIRE |
ROUND |
1 |
3 |
CYLINDRICAL |
Other Transistors |
30 |
200 Cel |
SILICON |
300 V |
1000 ns |
-65 Cel |
10000 ns |
GOLD |
BOTTOM |
O-MBCY-W3 |
COLLECTOR |
Not Qualified |
HIGH RELIABILITY |
TO-5 |
e4 |
|||||||||||||||||
Microchip Technology |
NPN |
SINGLE |
YES |
.5 W |
1 A |
CERAMIC, METAL-SEALED COFIRED |
.5 V |
NO LEAD |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
.5 W |
15 |
200 Cel |
12 pF |
SILICON |
80 V |
-65 Cel |
DUAL |
R-CDSO-N3 |
Qualified |
HIGH RELIABILITY |
MIL-19500; RH - 100K Rad(Si) |
||||||||||||||||||||||
Microchip Technology |
NPN |
7 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR |
NO |
.5 A |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
1.6 V |
THROUGH-HOLE |
RECTANGULAR |
7 |
16 |
IN-LINE |
1000 |
125 Cel |
SILICON |
50 V |
-55 Cel |
TIN LEAD |
DUAL |
R-CDIP-T16 |
Not Qualified |
e0 |
||||||||||||||||||||||||
Microchip Technology |
NPN |
SINGLE |
NO |
500 MHz |
.36 W |
.2 A |
METAL |
SWITCHING |
WIRE |
ROUND |
1 |
3 |
CYLINDRICAL |
Other Transistors |
20 |
200 Cel |
SILICON |
15 V |
12 ns |
18 ns |
TIN LEAD |
BOTTOM |
O-MBCY-W3 |
COLLECTOR |
Qualified |
TO-18 |
e0 |
MIL-19500/317K |
||||||||||||||||||
Microchip Technology |
NPN |
SINGLE |
NO |
15 MHz |
5 W |
1 A |
METAL |
WIRE |
ROUND |
1 |
3 |
CYLINDRICAL |
Other Transistors |
40 |
200 Cel |
SILICON |
350 V |
1000 ns |
10000 ns |
TIN LEAD |
BOTTOM |
O-MBCY-W3 |
COLLECTOR |
Qualified |
TO-205AD |
e0 |
MIL-19500 |
|||||||||||||||||||
Microchip Technology |
NPN |
SINGLE |
NO |
500 MHz |
.36 W |
.2 A |
METAL |
SWITCHING |
WIRE |
ROUND |
1 |
3 |
CYLINDRICAL |
Other Transistors |
20 |
200 Cel |
SILICON |
15 V |
12 ns |
18 ns |
TIN LEAD |
BOTTOM |
O-MBCY-W3 |
COLLECTOR |
Qualified |
TO-18 |
e0 |
MIL-19500/317K |
||||||||||||||||||
Microchip Technology |
NPN |
SINGLE |
NO |
15 MHz |
5 W |
1 A |
METAL |
WIRE |
ROUND |
1 |
3 |
CYLINDRICAL |
Other Transistors |
40 |
200 Cel |
SILICON |
350 V |
1000 ns |
10000 ns |
TIN LEAD |
BOTTOM |
O-MBCY-W3 |
COLLECTOR |
Qualified |
TO-205AD |
e0 |
MIL-19500 |
|||||||||||||||||||
Microchip Technology |
NPN |
SINGLE |
NO |
15 MHz |
5 W |
1 A |
METAL |
WIRE |
ROUND |
1 |
3 |
CYLINDRICAL |
Other Transistors |
40 |
200 Cel |
SILICON |
350 V |
1000 ns |
10000 ns |
TIN LEAD |
BOTTOM |
O-MBCY-W3 |
COLLECTOR |
Qualified |
TO-205AD |
e0 |
MIL-19500 |
|||||||||||||||||||
Microchip Technology |
NPN |
SINGLE |
NO |
.5 A |
METAL |
WIRE |
ROUND |
1 |
3 |
CYLINDRICAL |
50 |
200 Cel |
SILICON |
30 V |
TIN LEAD |
BOTTOM |
O-MBCY-W3 |
Not Qualified |
TO-5 |
e0 |
||||||||||||||||||||||||||
Microchip Technology |
NPN |
SEPARATE, 2 ELEMENTS |
NO |
60 MHz |
.5 W |
.5 A |
METAL |
WIRE |
ROUND |
2 |
6 |
CYLINDRICAL |
Other Transistors |
50 |
200 Cel |
SILICON |
60 V |
TIN LEAD |
BOTTOM |
O-MBCY-W6 |
Qualified |
TO-78 |
e0 |
MIL-19500/270 |
||||||||||||||||||||||
Microchip Technology |
NPN |
SEPARATE, 2 ELEMENTS |
NO |
1.25 W |
.03 A |
METAL |
WIRE |
ROUND |
2 |
6 |
CYLINDRICAL |
Other Transistors |
300 |
200 Cel |
SILICON |
60 V |
BOTTOM |
O-MBCY-W6 |
Qualified |
TO-78 |
NOT SPECIFIED |
NOT SPECIFIED |
MIL-19500/355 |
|||||||||||||||||||||||
Microchip Technology |
NPN AND PNP |
SEPARATE, 2 ELEMENTS |
YES |
.6 A |
PLASTIC/EPOXY |
FLAT |
RECTANGULAR |
2 |
6 |
FLATPACK |
35 |
200 Cel |
SILICON |
40 V |
45 ns |
300 ns |
TIN LEAD |
DUAL |
R-PDFP-F6 |
Not Qualified |
e0 |
|||||||||||||||||||||||||
Microchip Technology |
NPN |
SINGLE |
NO |
.8 A |
METAL |
SWITCHING |
WIRE |
ROUND |
1 |
3 |
CYLINDRICAL |
30 |
200 Cel |
SILICON |
50 V |
35 ns |
300 ns |
TIN LEAD |
BOTTOM |
O-MBCY-W3 |
COLLECTOR |
Qualified |
TO-206AA |
e0 |
MIL-19500/255 |
|||||||||||||||||||||
Microchip Technology |
NPN |
SINGLE |
NO |
1 A |
METAL |
WIRE |
ROUND |
1 |
3 |
CYLINDRICAL |
40 |
SILICON |
350 V |
1000 ns |
10000 ns |
TIN LEAD |
BOTTOM |
O-MBCY-W3 |
COLLECTOR |
Qualified |
TO-5 |
e0 |
MIL-19500/368F |
|||||||||||||||||||||||
Microchip Technology |
PNP |
SINGLE |
NO |
1 A |
METAL |
SWITCHING |
WIRE |
ROUND |
1 |
4 |
CYLINDRICAL |
30 |
200 Cel |
SILICON |
300 V |
1000 ns |
-65 Cel |
10000 ns |
TIN LEAD |
BOTTOM |
O-MBCY-W4 |
COLLECTOR |
Qualified |
TO-5 |
e0 |
MIL-19500/485H |
||||||||||||||||||||
Microchip Technology |
NPN |
SEPARATE, 2 ELEMENTS |
NO |
60 MHz |
.3 W |
.03 A |
METAL |
WIRE |
ROUND |
2 |
6 |
CYLINDRICAL |
Other Transistors |
300 |
200 Cel |
SILICON |
60 V |
-65 Cel |
TIN LEAD |
BOTTOM |
O-MBCY-W6 |
Qualified |
e0 |
MIL-19500/355J |
||||||||||||||||||||||
Microchip Technology |
PNP |
SINGLE |
NO |
1 A |
METAL |
SWITCHING |
WIRE |
ROUND |
1 |
4 |
CYLINDRICAL |
30 |
200 Cel |
SILICON |
300 V |
1000 ns |
-65 Cel |
10000 ns |
Tin/Lead (Sn/Pb) |
BOTTOM |
O-MBCY-W4 |
COLLECTOR |
Qualified |
TO-5 |
e0 |
MILITARY STANDARD (USA) |
||||||||||||||||||||
Microchip Technology |
NPN |
SINGLE |
NO |
.5 A |
METAL |
WIRE |
ROUND |
1 |
3 |
CYLINDRICAL |
40 |
200 Cel |
SILICON |
80 V |
TIN LEAD |
BOTTOM |
O-MBCY-W3 |
COLLECTOR |
Qualified |
TO-5 |
e0 |
MIL-19500/182F |
||||||||||||||||||||||||
Microchip Technology |
PNP |
SINGLE |
NO |
200 MHz |
.625 W |
.8 A |
PLASTIC/EPOXY |
AMPLIFIER |
WIRE |
ROUND |
1 |
3 |
CYLINDRICAL |
Other Transistors |
50 |
150 Cel |
SILICON |
60 V |
50 ns |
110 ns |
TIN LEAD |
BOTTOM |
O-PBCY-W3 |
Not Qualified |
TO-92 |
e0 |
||||||||||||||||||||
Microchip Technology |
NPN AND PNP |
SEPARATE, 2 ELEMENTS |
YES |
.6 A |
UNSPECIFIED |
NO LEAD |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
50 |
200 Cel |
SILICON |
40 V |
45 ns |
300 ns |
TIN LEAD |
DUAL |
R-XDSO-N6 |
Qualified |
e0 |
MIL-19500/421G |
||||||||||||||||||||||||
Microchip Technology |
NPN |
SINGLE |
YES |
.3 A |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
NO LEAD |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
20 |
SILICON |
150 V |
115 ns |
1150 ns |
TIN LEAD |
DUAL |
R-CDSO-N3 |
COLLECTOR |
Qualified |
e0 |
MIL-19500/366 |
|||||||||||||||||||||||
Microchip Technology |
NPN |
SINGLE |
NO |
.5 A |
METAL |
WIRE |
ROUND |
1 |
3 |
CYLINDRICAL |
100 |
200 Cel |
SILICON |
30 V |
TIN LEAD |
BOTTOM |
O-MBCY-W3 |
COLLECTOR |
Qualified |
TO-5 |
e0 |
MIL-19500/225F |
||||||||||||||||||||||||
Microchip Technology |
NPN |
SINGLE |
NO |
.5 A |
METAL |
WIRE |
ROUND |
1 |
3 |
CYLINDRICAL |
100 |
200 Cel |
SILICON |
30 V |
TIN LEAD |
BOTTOM |
O-MBCY-W3 |
COLLECTOR |
Qualified |
TO-5 |
e0 |
MIL-19500/225F |
||||||||||||||||||||||||
Microchip Technology |
PNP |
SEPARATE, 2 ELEMENTS |
YES |
.05 A |
PLASTIC/EPOXY |
NO LEAD |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
125 |
200 Cel |
SILICON |
60 V |
TIN LEAD |
DUAL |
R-PDSO-N6 |
Qualified |
TO-78 |
e0 |
MIL-19500 |
|||||||||||||||||||||||||
Microchip Technology |
NPN |
SINGLE |
NO |
.5 A |
METAL |
WIRE |
ROUND |
1 |
3 |
CYLINDRICAL |
40 |
200 Cel |
SILICON |
80 V |
TIN LEAD |
BOTTOM |
O-MBCY-W3 |
COLLECTOR |
Qualified |
TO-206AA |
e0 |
MIL-19500/182F |
||||||||||||||||||||||||
Microchip Technology |
NPN |
SEPARATE, 2 ELEMENTS |
NO |
60 MHz |
.3 W |
.03 A |
METAL |
WIRE |
ROUND |
2 |
6 |
CYLINDRICAL |
Other Transistors |
300 |
175 Cel |
SILICON |
60 V |
TIN LEAD |
BOTTOM |
O-MBCY-W6 |
Qualified |
TO-78 |
e0 |
MIL-19500/355J |
||||||||||||||||||||||
Microchip Technology |
NPN |
SINGLE |
YES |
100 W |
2 A |
UNSPECIFIED |
NO LEAD |
RECTANGULAR |
3 |
SMALL OUTLINE |
Other Transistors |
70 |
200 Cel |
DUAL |
R-XDSO-N3 |
Qualified |
||||||||||||||||||||||||||||||
Microchip Technology |
NPN |
SEPARATE, 2 ELEMENTS |
YES |
.3 W |
.03 A |
PLASTIC/EPOXY |
NO LEAD |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
Other Transistors |
300 |
200 Cel |
SILICON |
60 V |
TIN LEAD |
DUAL |
R-PDSO-N6 |
Qualified |
e0 |
MIL-19500 |
||||||||||||||||||||||||
Microchip Technology |
NPN |
SEPARATE, 2 ELEMENTS |
YES |
.03 A |
PLASTIC/EPOXY |
NO LEAD |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
300 |
SILICON |
60 V |
TIN LEAD |
DUAL |
R-PDSO-N6 |
Not Qualified |
e0 |
Small Signal Bipolar Junction Transistors (BJT) are electronic devices used in low-power applications to amplify and switch small signals. They are commonly used in applications such as audio amplifiers, signal processing, and low-power digital circuits.
Small Signal BJTs are designed to handle low-power levels and operate at low to medium frequencies, typically in the range of a few Hz to several MHz. They have a high gain and low noise figure, making them suitable for small signal amplification.
The Small Signal BJT consists of an emitter, base, and collector region, and works by controlling the flow of majority charge carriers (electrons or holes) between the emitter and collector through the base region. When a voltage is applied to the base-emitter junction, a small current flows through the base, allowing a larger current to flow from the emitter to the collector.
Proper use of Small Signal BJTs is important to ensure optimal performance, reliability, and compatibility with other components in the circuit. Small Signal BJTs are often used in conjunction with other components, such as capacitors and resistors, to form complete low-power electronic circuits.B395