3m Electronic Products Division - 110-024-050

  1. Home
  2. 3m Electronic Products Division - 110-024-050
110-024-050 by 3m Electronic Products Division

Image shown is a representation only.

Manufacturer 3m Electronic Products Division
Manufacturer's Part Number 110-024-050
Description IC SOCKET; Device Type Used On: DIP24; Housing Material: GLASS FILLED POLYPHENYLENE SULFIDE; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Mating): GOLD (8) OVER NICKEL (100);
Datasheet 110-024-050 Datasheet
NAME DESCRIPTION
Contact Finish (Mating): Gold (8) over Nickel (100)
IC Socket Type: IC Socket
Contact Finish (Termination): Gold Flash over Nickel
Housing Material: Glass-Filled Polyphenylene Sulfide (PPS)
Device Type Used On: DIP24
Contact Material: Beryllium Copper
Additional Features: 3M
Manufacturer Series: 100
JESD-609 Code: e4
No. of Contacts: 24
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

XR2T-2011-N by Omron

XR2T-2011-N

Omron

IC SOCKET; Contact Finish (Mating): GOLD (10); Manufacturer Series: XR2T; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Termination): GOLD;
XR2A-2215 by Omron

XR2A-2215

Omron

IC SOCKET; Manufacturer Series: XR2;
342-90-139-00-594000 by Mill-max Mfg

342-90-139-00-594000

Mill-max Mfg

Mill-max Mfg's 342-90-139-00-594000 is a Chip Carrier IC Socket with Polyethylene housing material. It has 39 contacts with Tin/Lead finish for mating and termination. Designed for SIP39 devices, it features a rectangular contact configuration ideal for various electronic applications.
XR2T-1811-N by Omron

XR2T-1811-N

Omron

IC SOCKET; Manufacturer Series: XR2T; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Mating): GOLD (10);
123-83-308-41-001101 by Preci-dip Sa

123-83-308-41-001101

Preci-dip Sa

123-83-308-41-001101 by Preci-dip Sa is a DIP8 IC SOCKET with 8 contacts, BE-CU material, and AU finish. It has a 7.62mm PCB row spacing for RECTANGULAR pattern on PCBs. Ideal for applications requiring -55 to 125 °C operating temperatures and wire wrap terminations.
DILB8P-223TLF by Amphenol Communications Solutions

DILB8P-223TLF

Amphenol Communications Solutions

DILB8P-223TLF by Amphenol is a chip carrier IC socket with 8 contacts, copper alloy material, and matte tin finish. It has a PCB contact row spacing of 7.62mm and is used on DIP8 devices. This socket is ideal for applications requiring a dielectric voltage withstand of 1400VAC and operating temperatures ranging from -55 to 105°C.
HLS-1204-TT-31 by Samtec

HLS-1204-TT-31

Samtec

The Samtec HLS-1204-TT-31 is a POLYETHYLENE chip carrier socket for PGA48 devices with 48 contacts. It features Tin contact finish for mating and Tin (Sn) with Nickel (Ni) barrier for termination. Ideal for IC applications requiring reliable connections in electronic assemblies.
XR2A-2478 by Omron

XR2A-2478

Omron

IC SOCKET; Manufacturer Series: XR2;
XR2B-2401-N by Omron

XR2B-2401-N

Omron

IC SOCKET; Manufacturer Series: XR2; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (30);
XR2A-3201-N by Omron

XR2A-3201-N

Omron

IC SOCKET; Device Type Used On: DIP32; Housing Material: POLYBUTYLENE TEREPHTHALATE; JESD-609 Code: e4; No. of Contacts: 32; Contact Finish (Mating): NOT SPECIFIED;
4593 by Keystone Electronics

4593

Keystone Electronics

TRANSISTOR SOCKET; Manufacturer Series: 4593;
PY14QN2-Y3 by Omron

PY14QN2-Y3

Omron

RELAY SOCKET;
XR2A-2463-N by Omron

XR2A-2463-N

Omron

IC SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED; JESD-609 Code: e4; Contact Finish (Termination): GOLD;
40-6552-18 by Aries Electronics

40-6552-18

Aries Electronics

Aries Electronics 40-6552-18 is a DIP42 IC socket with 40 contacts, rated at 1A current. It features Beryllium Nickel Alloy contacts, Polyetheretherketone housing, and Nickel Boron finish. Suitable for chip carrier applications with a rectangular PCB contact pattern, it operates b/w -55°C to 250°C and has a dielectric withstand voltage of 1000VAC.
A28-LC-TT by Assmann Wsw Components

A28-LC-TT

Assmann Wsw Components

A28-LC-TT by Assmann Wsw Components is a DIP28 IC socket with 28 contacts made of phosphor bronze and tin finish. Its housing material is polybutylene terephthalate, suitable for chip carrier applications. The rectangular contact configuration makes it ideal for various electronic devices.
PL11 by Omron

PL11

Omron

RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED;
SD-103-G-22-N by Samtec

SD-103-G-22-N

Samtec

SD-103-G-22-N by Samtec is a Chip Carrier IC Socket with 6 contacts, rectangular contact pattern, and body dimensions of 0.3" length, 0.2" width, and 0.175" depth. It has a PCB contact row spacing of 2.54mm and operates b/w -65°C to 125°C, suitable for DIP6 devices with a current rating of 1A.
173-10-314-00-001000 by Mill-max Mfg

173-10-314-00-001000

Mill-max Mfg

Mill-max Mfg's 173-10-314-00-001000 is a plastic chip carrier IC socket with 14 gold over nickel contacts. It is used for DIP14 devices and has a rectangular contact configuration.
251-5949-01-0602 by 3m Electronic Products Division

251-5949-01-0602

3m Electronic Products Division

The 3m Electronic Products Division's 251-5949-01-0602 is a Chip Carrier IC Socket with GLASS FILLED POLYSULFONE housing. It has 51 BERYLLIUM COPPER contacts finished in GOLD over NICKEL for ZIP51 devices. Ideal for applications requiring reliable connections and durability.
27E487 by TE Connectivity

27E487

TE Connectivity

TE Connectivity's 27E487 is an IC SOCKET with GLASS FILLED POLYESTER housing. It features 8 RND PIN-SKT contacts terminated by SCREW, designed for RELAY applications.