Micron Technology - PF38F5060M0Y0V0

PF38F5060M0Y0V0 by Micron Technology

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Manufacturer	Micron Technology
Manufacturer's Part Number	PF38F5060M0Y0V0
Description	MEMORY CIRCUIT; No. of Terminals: 165; Package Code: FBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; Mixed Memory Type: FLASH+PSRAM;
Datasheet	PF38F5060M0Y0V0 Datasheet
In Stock	870

PF38F5060M0Y0V0 Technical Details

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.00016 Amp
Mixed Memory Type:	FLASH+PSRAM
Sub-Category:	Other Memory ICs
Surface Mount:	YES
Memory IC Type:	MEMORY CIRCUIT
No. of Terminals:	165
Qualification:	Not Qualified
Package Equivalence Code:	BGA165,12X15,25
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, FINE PITCH
Maximum Access Time:	96 ns
JESD-30 Code:	R-PBGA-B165
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Nominal Supply Voltage / Vsup (V):	1.8
Package Code:	FBGA
Terminal Pitch:	.635 mm
Power Supplies (V):	1.8

Pricing (USD)

Qty.	Unit Price	Ext. Price
870	-	-

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