NXP Semiconductors - 935316686557

The NXP Semiconductors MIMXRT1064DVL6AR microprocessor features integrated cache, 1048576 RAM words, and low power mode. It is suitable for applications requiring high-speed processing in a compact form factor, such as IoT devices and embedded systems.

MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Peak Reflow Temperature (C): 260;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Width: 25 mm;

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE;

XAM6234ATCGGAALW by Texas Instruments is a 64-bit microprocessor with 8-bit on-chip data RAM and 16-bit external data bus width. It operates at a max clock frequency of 26 MHz, suitable for low power mode applications in various devices due to its CMOS technology and integrated cache feature. The package style is grid array with very thin profile, making it ideal for compact designs requiring high processing speeds.

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 483; Package Code: BGA; Package Shape: SQUARE; Low Power Mode: YES;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

The NXP Semiconductors MCF54418CMJ250 microprocessor features a 32-bit architecture, integrated cache, and operates at a max clock frequency of 100 MHz. Ideal for industrial applications requiring low power consumption, it supports multiple power supplies (1.2V, 1.8V, 3.3V) and has a temperature range of -40 to 85°C.

AM5706BCBDJEA by Texas Instruments is a Microprocessor with 32-bit External Data Bus, 16-bit Address Bus, and integrated cache. It operates at a max clock frequency of 38.4 MHz and supports low power mode. Ideal for industrial applications requiring high-speed processing in a compact package.

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE;

NXP Semiconductors' MPC860ENVR66D4 microprocessor features 32-bit address and external data bus width, with a max clock frequency of 50 MHz. Suitable for low power mode applications, this RISC-based processor operates at 66 rpm speed and integrates cache memory.

MCF54450VM240J by Freescale Semiconductor is a 32-bit microprocessor with integrated cache and 16-bit external data bus width. It features a package style of grid array, low profile, and operates at speeds up to 240 rpm. Ideal for applications requiring low power mode and commercial temperature grade.

MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

The NXP Semiconductors MCF54416CMJ250 is a 32-bit microprocessor with integrated cache and a max clock frequency of 100 MHz. It is commonly used in industrial applications due to its low power mode and temperature grade of INDUSTRIAL.

AM5708BCBDJEA by Texas Instruments is a Microprocessor with 32-bit External Data Bus, 16-bit Address Bus, and integrated cache. It operates at a max clock frequency of 38.4 MHz and supports low power mode. Ideal for industrial applications requiring high-speed processing in compact form factor.

MICROPROCESSOR; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 40; Package Code: DIP; Package Shape: RECTANGULAR;

XTDA4VMXXXGALF by Texas Instruments is a 64-bit microprocessor with 32-bit external data bus width, operating at up to 27 MHz. Ideal for automotive applications, it features integrated cache, low power mode, and boundary scan capability. This CMOS technology processor has a temperature range of -40 to 125 °C and comes in a square package style with 827 terminals.

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 896; Package Code: FBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;