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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | MC8641VU1000HC |
Description | MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 1023; Package Code: BGA; Package Shape: SQUARE; Length: 33 mm; |
In Stock | 4,870 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 1 V |
Package Body Material: | CERAMIC, METAL-SEALED COFIRED |
Nominal Supply Voltage: | 1.05 V |
Integrated Cache: | YES |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Maximum Seated Height: | 2.77 mm |
Sub-Category: | Microprocessors |
Surface Mount: | YES |
No. of Terminals: | 1023 |
Terminal Position: | BOTTOM |
Format: | FLOATING POINT |
Package Style (Meter): | GRID ARRAY |
Address Bus Width: | 32 |
Technology: | CMOS |
JESD-30 Code: | S-CBGA-B1023 |
Maximum Clock Frequency: | 166.66 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 105 Cel |
Package Code: | BGA |
Width: | 33 mm |
Speed: | 166.66 rpm |
Peripheral IC Type: | MICROPROCESSOR |
Maximum Supply Voltage: | 1.1 V |
Low Power Mode: | YES |
Boundary Scan: | YES |
External Data Bus Width: | 32 |
Bit Size: | 32 |
Minimum Operating Temperature: | 0 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA1023,32X32,40 |
Length: | 33 mm |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Terminal Pitch: | 1 mm |
Power Supplies (V): | 1.1,1.8/2.5,2.5/3.3 |