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Manufacturer | Samsung |
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Manufacturer's Part Number | K4C561638F-TCDA |
Description | DDR1 DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 66; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Finish: Tin/Lead (Sn/Pb); |
Datasheet | K4C561638F-TCDA Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Organization: | 16MX16 |
Output Characteristics: | 3-STATE |
Sub-Category: | DRAMs |
Surface Mount: | YES |
Terminal Finish: | Tin/Lead (Sn/Pb) |
No. of Terminals: | 66 |
Maximum Clock Frequency (fCLK): | 182 MHz |
No. of Words: | 16777216 words |
Terminal Position: | DUAL |
Package Style (Meter): | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Technology: | CMOS |
JESD-30 Code: | R-PDSO-G66 |
Package Shape: | RECTANGULAR |
Terminal Form: | GULL WING |
Maximum Operating Temperature: | 70 Cel |
Package Code: | TSSOP |
Input/Output Type: | COMMON |
Memory Density: | 268435456 bit |
Sequential Burst Length: | 2,4 |
Memory IC Type: | DDR1 DRAM |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | 0 Cel |
Memory Width: | 16 |
Qualification: | Not Qualified |
Package Equivalence Code: | TSSOP66,.46 |
Interleaved Burst Length: | 2,4 |
Maximum Access Time: | .75 ns |
No. of Words Code: | 16M |
Nominal Supply Voltage / Vsup (V): | 2.5 |
Terminal Pitch: | .635 mm |
Temperature Grade: | COMMERCIAL |
Power Supplies (V): | 2.5 |