Skyworks Solutions - SKY65725-11

  1. Home
  2. Skyworks Solutions - SKY65725-11
SKY65725-11 by Skyworks Solutions

Image shown is a representation only.

Manufacturer Skyworks Solutions
Manufacturer's Part Number SKY65725-11
Description TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
NAME DESCRIPTION
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Telecom IC Type: TELECOM CIRCUIT
Peak Reflow Temperature (C): NOT SPECIFIED
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

EFR32BG22C224F512IM32-C by Silicon Labs

EFR32BG22C224F512IM32-C

Silicon Labs

TELECOM CIRCUIT;
ST25R3916-BWLT by STMicroelectronics

ST25R3916-BWLT

STMicroelectronics

TELECOM CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
MGC3030-I/SS by Microchip Technology

MGC3030-I/SS

Microchip Technology

MGC3030-I/SS by Microchip is a telecom IC with 28 terminals, operating from -40 to 85°C. It has a small outline package, matte tin finish, and nominal voltage of 3.3V. Ideal for telecom circuits, it features gull wing terminals and is suitable for industrial temperature grades.
AT86RF215-ZU by Atmel

AT86RF215-ZU

Atmel

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: VQCCN; Package Shape: SQUARE;
MRF24J40MA-I/RM by Microchip Technology

MRF24J40MA-I/RM

Microchip Technology

Microchip Technology's MRF24J40MA-I/RM is a 3.3V telecom interface IC with 12 terminals, operating from -40 to 85°C. Its plastic/epoxy package suits industrial applications, offering reliable wireless communication solutions in harsh environments.
XB3-24Z8UT by Digi International

XB3-24Z8UT

Digi International

The Digi International XB3-24Z8UT is an industrial-grade telecom circuit with 20 terminals in a through-hole package. It operates b/w -40°C to 85°C, making it suitable for various telecom interface applications. This MICROELECTRONIC ASSEMBLY offers reliable performance in harsh environments.
CLEO35-WIFI1 by FTDI

CLEO35-WIFI1

FTDI

CLEO35-WIFI1 by FTDI is a TELECOM CIRCUIT IC with 3.3V supply voltage, operating from -40 to 125 °C. Its MICROELECTRONIC ASSEMBLY package measures 31.6mm x 35.3mm x 4.6mm, ideal for automotive telecom applications due to its wide temperature range and compact design.
AT86RF215IQ-ZU by Microchip Technology

AT86RF215IQ-ZU

Microchip Technology

AT86RF215IQ-ZU by Microchip is a RF and baseband circuit IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, suitable for industrial use. With matte tin finish and terminal pitch of 0.5 mm, it's ideal for telecom interface applications.
CC2640F128RHBR by Texas Instruments

CC2640F128RHBR

Texas Instruments

CC2640F128RHBR by Texas Instruments is a telecom IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a nominal voltage of 3V. Ideal for telecom circuits, it features a terminal pitch of 0.5mm and no-lead terminal form.
ATWILC1000-MR110UB by Microchip Technology

ATWILC1000-MR110UB

Microchip Technology

ATWILC1000-MR110UB by Microchip Technology is a surface mount telecom interface IC with 1 function. It operates at temperatures ranging from -40 to 85 °C and has a data rate of 72.2 Mbps. This IC is commonly used in industrial applications requiring a nominal voltage of 3.3 V.
ST60-2230C-P by Laird Technologies

ST60-2230C-P

Laird Technologies

TELECOM CIRCUIT;
STID135-WB by STMicroelectronics

STID135-WB

STMicroelectronics

TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
RN4678APL-V/RM111 by Microchip Technology

RN4678APL-V/RM111

Microchip Technology

RN4678APL-V/RM111 by Microchip Tech is a telecom IC with 33 terminals, operating temp range of -20 to 70°C. It has a supply voltage of 1.9V and terminal pitch of 1.1mm. Ideal for telecom applications due to TS16949 screening level and no-lead terminal form.
LMH0384SQ/NOPB by National Semiconductor

LMH0384SQ/NOPB

National Semiconductor

Other Telecom ICs; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: QCCN; Package Shape: SQUARE;
AD9364BBCZREEL by Analog Devices

AD9364BBCZREEL

Analog Devices

AD9364BBCZREEL by Analog Devices is a 144-terminal telecom IC with a supply voltage of 1.8V, operating b/w -40 to 85°C. It features a grid array package style and is suitable for telecom circuit applications requiring low profile and fine pitch components.
NEO-M8T-0 by U-blox Ag

NEO-M8T-0

U-blox Ag

NEO-M8T-0 by U-blox Ag is a telecom IC with 24 terminals, operating from -40 to 85°C. With a compact size of 12.2mm x 16mm and low supply voltage of 3V, it's ideal for industrial applications requiring precise positioning and timing accuracy. Its no-lead terminal form and dual position make it suitable for various telecom circuit designs.
CLRC66303HNE by NXP Semiconductors

CLRC66303HNE

NXP Semiconductors

TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 2; Terminal Finish: NICKEL PALLADIUM GOLD SILVER; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e4;
SX1281IMLTRT by Semtech

SX1281IMLTRT

Semtech

TELECOM CIRCUIT; Terminal Finish: MATTE TIN; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260;
BGT24LTR11N16E6327XTSA1 by Infineon Technologies

BGT24LTR11N16E6327XTSA1

Infineon Technologies

BGT24LTR11N16E6327XTSA1 by Infineon is a Telecom IC with 16 terminals, operating at -40 to 85°C. It has a nominal voltage of 3.3V and a terminal pitch of 0.5mm. This chip carrier is ideal for telecom circuit applications due to its very thin profile and industrial temperature grade suitability.
SN65DSI83TPAPRQ1 by Texas Instruments

SN65DSI83TPAPRQ1

Texas Instruments

SN65DSI83TPAPRQ1 by Texas Instruments is a telecom interface IC with 64 terminals in a square package. It operates b/w -40 to 105°C, with a data rate of 1 Mbps and nominal voltage of 1.8V. Ideal for industrial applications requiring high-speed data transmission in compact spaces.