
Image shown is a representation only.
Manufacturer | Texas Instruments |
---|---|
Manufacturer's Part Number | OMAPL132BZWT2 |
Description | MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 361; Package Code: LFBGA; Package Shape: SQUARE; Length: 16 mm; |
Datasheet | OMAPL132BZWT2 Datasheet |
In Stock | 130 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | .95 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 1.4 mm |
Sub-Category: | Other Microprocessor ICs |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 361 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B361 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Package Code: | LFBGA |
Width: | 16 mm |
Moisture Sensitivity Level (MSL): | 3 |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Maximum Supply Voltage: | 1.05 V |
JESD-609 Code: | e1 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA361,19X19,32 |
Length: | 16 mm |
Additional Features: | ALSO OPERATES AT 1.2 V AND 1.1 V TYP |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .8 mm |
Power Supplies (V): | 1.2,1.8/3.3 |