Xilinx - XC6VCX75T-1FFG784I

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XC6VCX75T-1FFG784I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC6VCX75T-1FFG784I
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;
Datasheet XC6VCX75T-1FFG784I Datasheet
In Stock378
NAME DESCRIPTION
Minimum Supply Voltage: .95 V
Package Body Material: Plastic/Epoxy
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.79 ns
Maximum Seated Height: 3.1 mm
No. of Inputs: 360
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 360
Position Of Terminal: Bottom
No. of Terminals: 784
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B784
Maximum Clock Frequency: 1098 MHz
Package Shape: Square
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: BGA
Width: 29 mm
Moisture Sensitivity Level (MSL): 4
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.05 V
Nominal Supply Voltage (V): 1
Technology Used: CMOS
No. of Logic Cells: 74496
No. of CLBs: 5820
JESD-609 Code: e1
Minimum Operating Temperature: -40 °C (-40 °F)
Qualification: No
Package Equivalence Code: BGA784,28X28,40
Finishing Of Terminal Used: Tin Silver Copper
Length: 29 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 245 °C (473 °F)
Power Supplies (V): 1,1.2/2.5,2.5 V
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