Xilinx - XCVP1402-1LSEVSVD2197

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XCVP1402-1LSEVSVD2197 by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCVP1402-1LSEVSVD2197
Description MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: BGA; Package Shape: RECTANGULAR; Surface Mount: YES;
Datasheet XCVP1402-1LSEVSVD2197 Datasheet
In Stock482
NAME DESCRIPTION
Minimum Supply Voltage: .676 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Nominal Supply Voltage: .7 V
Maximum Supply Voltage: .724 V
Surface Mount: YES
Minimum Operating Temperature: 0 Cel
No. of Terminals: 2197
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B2197
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 100 Cel
Package Code: BGA
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