Commercial Analog-to-Digital Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD7572LN12

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

12

0.0122 %

5 V

Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

13 µs

R-PDIP-T24

0.3 in (7.62 mm)

No

e0

1.227 in (31.165 mm)

LTC2216CUP

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.75 V

80 MHz

1

CMOS

16

0.0053 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

LTC1407CMSE-1#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

2

Yes

1.25 V

3 MHz

1

12

0.0488 %

3 V

2's Complement Binary

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

-1.25 V

Serial

0 °C (32 °F)

Tin/Lead

Sample

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

0.118 in (3 mm)

LTC1296CCN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

5.05 V

46.5 kHz

1

CMOS

12

0.0122 %

5 V

Binary

-5 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-5.05 V

Serial

0 °C (32 °F)

Tin Lead

Sample

Dual

12 µs

R-PDIP-T20

1

0.15 in (3.81 mm)

0.3 in (7.62 mm)

No

e0

LTC2190CUKG#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

2

Yes

2 V

25 MHz

1

CMOS

16

0.0092 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Serial, Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

R-PQCC-N52

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

0.315 in (8 mm)

LTC2296CUP#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

25 MHz

2

CMOS

14

0.0305 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

LTC1605ACN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

6.25 kHz

1

CMOS

16

0.0031 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

8 µs

R-PDIP-T28

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e0

AN1678KN

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

200 kHz

1

12

12 V

Binary, 2's Complement Binary

-12 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Sample

Dual

R-PDIP-T28

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

1.445 in (36.7 mm)

LTC2164CUK#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.25 V

105 MHz

1

CMOS

16

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

700 mV

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N48

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

0.276 in (7 mm)

LTC2377CDE-16#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

16

HVSON

Rectangular

Plastic/Epoxy

1

Yes

5.15 V

500 kHz

1

CMOS

16

0.0008 %

2.5 V

2's Complement Binary

Small Outline, Heat Sink/Slug, Very Thin Profile

0.018 in (0.45 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Matte Tin

Dual

1.5 µs

R-PDSO-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.157 in (4 mm)

LTC1096CS8

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

1

Yes

9.05 V

33 kHz

1

8

0.3906 %

3 V

Binary

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Tin/Lead

Sample

Dual

32 µs

R-PDSO-G8

1

0.069 in (1.752 mm)

0.154 in (3.9 mm)

No

e0

0.193 in (4.9025 mm)

LTC1272-8CCN#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

15 V

250 kHz

1

BICMOS

12

0.0244 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-300 mV

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

8 ms

R-PDIP-T24

1

0.15 in (3.81 mm)

0.3 in (7.62 mm)

No

e3

LTC1606CSW#TR

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

250 kHz

1

Bipolar

16

0.0031 %

5 V

2's Complement Binary

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-10 V

Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

2.5 µs

R-PDSO-G28

1

0.104 in (2.642 mm)

0.295 in (7.493 mm)

No

e0

0.704 in (17.89 mm)

AD9202JRSRL

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1

Yes

5.5 V

32 MHz

1

CMOS

10

0.2832 %

3 V

Binary

3/5 V

Small Outline, Shrink Pitch

SSOP28,.3

Analog to Digital Converters

0.026 in (0.65 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

R-PDSO-G28

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e0

0.402 in (10.2 mm)

AD7572AJN10

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

15 V

1

CMOS

12

9 mA

0.024 %

5 V

Binary

5,-12/-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-15 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

10.4 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.199 in (30.45 mm)

LTC1605-1CG#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1

Yes

4 V

100 kHz

1

CMOS

16

0.0046 %

5 V

Binary

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Dual

8 µs

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

30 s

260 °C (500 °F)

0.402 in (10.2 mm)

LTC2223CUK

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

80 MHz

1

CMOS

12

0.0269 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e0

0.276 in (7 mm)

LTC2374CUH-16#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

8

Yes

5 V

1.6 MHz

1

CMOS

16

0.0015 %

5 V

Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-2.5 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Quad

427 ns

S-PQCC-N32

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

0.197 in (5 mm)

AD876JR

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1

Yes

2 V

20 MHz

1

CMOS

10

5 V

Binary

3.3,5 V

Small Outline

SOP28,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

50 ns

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

240 °C (464 °F)

0.705 in (17.9 mm)

AD9003A

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

40

Rectangular

1

No

2.5 V

1 MHz

1

12

0.0366 %

15 V

Complementary Binary, Complementary Offset Binary

-15 V

Microelectronic Assembly

70 °C (158 °F)

-2.5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

560 ns

R-XDMA-X40

No

e0

LTC1415CG#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1

Yes

1.25 MHz

1

CMOS

12

20 mA

0.0244 %

5 V

Binary

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

700 ns

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

30 s

260 °C (500 °F)

0.402 in (10.2 mm)

LTC1406CGN

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

24

SSOP

Rectangular

Plastic/Epoxy

1

Yes

5 V

20 MHz

1

8

40 mA

0.3906 %

5 V

Binary

Small Outline, Shrink Pitch

0.025 in (0.635 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Dual

R-PDSO-G24

1

0.069 in (1.75 mm)

0.154 in (3.9116 mm)

No

e0

0.341 in (8.65 mm)

LTC1606CG#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

250 kHz

1

Bipolar

16

0.0031 %

5 V

2's Complement Binary

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

-10 V

Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

2.5 µs

R-PDSO-G28

1

0.078 in (1.99 mm)

0.209 in (5.3 mm)

No

e3

30 s

260 °C (500 °F)

0.402 in (10.2 mm)

LTC2215CUP#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.75 V

65 MHz

1

CMOS

16

0.0053 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC1272-3ACSW#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

15 V

250 kHz

1

BICMOS

12

0.0122 %

5 V

Binary

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-300 mV

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

3 ms

R-PDSO-G24

1

0.104 in (2.642 mm)

0.295 in (7.493 mm)

No

e3

30 s

260 °C (500 °F)

0.606 in (15.395 mm)

LTC2369CMS-18#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

5.1 V

1.6 MHz

1

CMOS

18

0.001 %

2.5 V

Binary

Small Outline, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Matte Tin

Dual

412 ns

R-PDSO-G16

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0.159 in (4.039 mm)

LTC2372CUH-16#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

8

Yes

4.104 V

500 kHz

1

CMOS

16

0.0015 %

5 V

Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-4.088 V

Serial

0 °C (32 °F)

Matte Tin

Quad

1.5 µs

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

260 °C (500 °F)

0.197 in (5 mm)

LTC1199CS8

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

1

Yes

5.05 V

500 kHz

1

10

0.0977 %

5 V

Binary

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Tin Lead

Sample

Dual

1.4 µs

R-PDSO-G8

1

0.069 in (1.752 mm)

0.154 in (3.899 mm)

No

e0

0.193 in (4.9025 mm)

AD7672LN10

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

2

No

15 V

1

CMOS

12

12 mA

0.012 %

5 V

Binary

5,-12 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-15 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

10.4 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.199 in (30.45 mm)

LTC2360CS6#TRMPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

6

VSSOP

Rectangular

Plastic/Epoxy

1

Yes

3.65 V

100 kHz

1

CMOS

12

0.0244 %

3 V

Binary

Small Outline, Very Thin Profile, Shrink Pitch

0.037 in (0.95 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

R-PDSO-G6

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0.114 in (2.9 mm)

CAV-1040

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

36

1

No

4 V

40 MHz

1

10

0.5 %

15 V

Binary, 2's Complement Binary

-15 V

Microelectronic Assembly

70 °C (158 °F)

-4 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

X-XXMA-X36

No

e0

AD7871KP-REEL

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

1

Yes

3 V

83 kHz

1

CMOS

14

0.0061 %

5 V

2's Complement Binary

±5 V

-5 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-3 V

Serial, Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Quad

10.5 µs

S-PQCC-J28

1

0.178 in (4.51 mm)

0.453 in (11.5062 mm)

No

e0

0.453 in (11.5062 mm)

LTC2190CUKG#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

2

Yes

2 V

25 MHz

1

CMOS

16

0.0092 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Serial, Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

R-PQCC-N52

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

0.315 in (8 mm)

LTC1276BCSW#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

5 V

300 kHz

1

BICMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

-5 V

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-5 V

Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

2.7 ms

R-PDSO-G24

1

0.104 in (2.642 mm)

0.295 in (7.493 mm)

No

e3

30 s

260 °C (500 °F)

0.606 in (15.395 mm)

5962-01-145-3422

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic

No

20 V

1

12

0.012 %

Offset Binary

5,±15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T28

No

LTC2233CUK#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

80 MHz

1

CMOS

10

0.0781 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

LTC2472CMS#TRPBF

Analog Devices

Analog To Digital Converter, Delta-Sigma

Commercial

Gull Wing

12

TSSOP

Rectangular

Plastic/Epoxy

2

Yes

1.25 V

1 kHz

1

CMOS

16

0.0183 %

Binary

Small Outline, Thin Profile, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

-1.25 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Dual

4.8 ms

R-PDSO-G12

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.159 in (4.039 mm)

AD671JD-500

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

2 MHz

1

BICMOS

12

0.0977 %

5 V

Binary, Offset Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

500 ns

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.2 in (30.48 mm)

AD578ZLD

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

12

0.0122 %

12 V

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±12/±15 V

-12 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

3 µs

R-CDIP-T32

0.275 in (6.98 mm)

0.6 in (15.24 mm)

No

e0

LTC1274CSW#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.048 V

8 kHz

1

CMOS

12

5 V

Binary

-5 V

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-2.048 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Dual

8 µs

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.606 in (15.4 mm)

AD7871JN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

3 V

83 kHz

1

CMOS

14

5 V

2's Complement Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-3 V

Serial, Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

10.5 µs

R-PDIP-T28

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

1.445 in (36.7 mm)

LTC2207CUK

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.25 V

105 MHz

1

CMOS

16

0.0061 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

1.5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e0

0.276 in (7 mm)

LTC1410CG

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1

Yes

2.5 V

1.25 MHz

1

CMOS

12

30 mA

0.0244 %

5 V

2's Complement Binary

-5 V

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

-2.5 V

Parallel, Word

0 °C (32 °F)

Tin/Lead

Sample

Dual

750 ns

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e0

0.402 in (10.2 mm)

LTC1863LCGN

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

8

Yes

1.25 V

175 kHz

1

12

0.0244 %

2.7 V

Binary, 2's Complement Binary

Small Outline, Shrink Pitch

0.025 in (0.635 mm)

70 °C (158 °F)

-1.25 V

Serial

0 °C (32 °F)

Tin/Lead

Dual

3.7 µs

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

No

e0

0.193 in (4.89 mm)

LTC2175CUKG-12#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

125 MHz

1

CMOS

12

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

Serial

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC1278-4CSW#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.5 V

33.3 kHz

1

CMOS

12

0.0244 %

5 V

2's Complement Binary

-5 V

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-2.5 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

2.3 µs

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.606 in (15.4 mm)

LTC1747CFW#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

48

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

1.6 V

80 MHz

1

CMOS

12

0.0366 %

5 V

Offset Binary, 2's Complement Binary

Small Outline, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

R-PDSO-G48

1

0.047 in (1.2 mm)

0.24 in (6.1 mm)

No

e3

30 s

260 °C (500 °F)

0.492 in (12.5 mm)

LTC2428CG

Analog Devices

Analog To Digital Converter, Delta-Sigma

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

8

Yes

3.7125 V

1

20

3.3 V

Binary

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

-412.5 mV

Serial

0 °C (32 °F)

Tin Lead

Dual

163.44 ms

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e0

0.402 in (10.2 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.