Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
3 V |
1 |
CMOS |
12 |
0.0122 % |
5 V |
Binary, 2's Complement Binary |
±5 V |
-5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-3 V |
Serial, Parallel, 8 Bits, Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Track |
Dual |
9 µs |
R-PDIP-T24 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e3 |
1.25 in (31.75 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Commercial |
Gull Wing |
12 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
1.253 V |
1 |
CMOS |
16 |
0.0183 % |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
4.8 ms |
R-PDSO-G12 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.159 in (4.039 mm) |
||||||||||||||||
Analog Devices |
Analog To Digital Converter |
Commercial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
1 |
CMOS |
14 |
0.012 % |
5 V |
2's Complement Binary |
±5 V |
-5 V |
Small Outline, Shrink Pitch |
SSOP28,.25 |
Analog to Digital Converters |
0.025 in (0.635 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G28 |
No |
e0 |
245 °C (473 °F) |
||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
5.05 V |
500 kHz |
1 |
10 |
0.0977 % |
5 V |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
1.4 µs |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
10 V |
250 kHz |
1 |
Bipolar |
16 |
0.0031 % |
5 V |
2's Complement Binary |
Small Outline, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
-10 V |
Parallel, 8 Bits, Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
2.5 µs |
R-PDSO-G28 |
1 |
0.078 in (1.99 mm) |
0.209 in (5.3 mm) |
No |
e0 |
0.402 in (10.2 mm) |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Pin/Peg |
24 |
DIP |
Rectangular |
Metal |
1 |
No |
1 V |
100 MHz |
1 |
Bipolar |
8 |
303 mA |
0.4688 % |
5 V |
Binary |
5,-5.2 V |
-5.2 V |
In-Line |
DIP24,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-1 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Dual |
R-MDIP-P24 |
0.6 in (15.24 mm) |
No |
e0 |
1.272 in (32.3205 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
105 MHz |
2 |
CMOS |
12 |
0.0366 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e0 |
0.354 in (9 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
No Lead |
24 |
HVSON |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.1 V |
1 MHz |
1 |
CMOS |
32 |
0.00035 % |
2.5 V |
2's Complement Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-2.5 V |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
652 ns |
R-PDSO-N24 |
0.031 in (0.8 mm) |
0.157 in (4 mm) |
e3 |
0.276 in (7 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Commercial |
No Lead |
12 |
HVSON |
Square |
2 |
Yes |
1.25 V |
1 |
16 |
0.0122 % |
Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.018 in (0.45 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
23 ms |
S-XDSO-N12 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
105 MHz |
2 |
CMOS |
10 |
0.0586 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
2.46 V |
1 |
CMOS |
8 |
0.3906 % |
5 V |
Offset Binary |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Matte Tin |
Track |
Quad |
15 µs |
S-PQCC-J20 |
1 |
0.18 in (4.573 mm) |
0.353 in (8.966 mm) |
No |
e3 |
260 °C (500 °F) |
0.353 in (8.966 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1.9 V |
25 MHz |
1 |
CMOS |
14 |
0.0244 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
1 V |
Parallel, Word |
0 °C (32 °F) |
Tin/Lead |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e0 |
0.197 in (5 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5 V |
300 kHz |
1 |
BICMOS |
12 |
0.0244 % |
5 V |
Binary |
-5 V |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits, Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
2.7 ms |
R-PDSO-G24 |
1 |
0.104 in (2.642 mm) |
0.295 in (7.493 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.606 in (15.395 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
6 |
VSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
3.65 V |
1 MHz |
1 |
CMOS |
12 |
0.0244 % |
3 V |
Binary |
Small Outline, Very Thin Profile, Shrink Pitch |
0.037 in (0.95 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G6 |
1 |
0.039 in (1 mm) |
0.064 in (1.625 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.114 in (2.9 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
No Lead |
12 |
HVSON |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
2.048 V |
14 kHz |
1 |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-2.048 V |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
1.6 µs |
R-PDSO-N12 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.157 in (4 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
10 V |
250 kHz |
1 |
Bipolar |
16 |
0.0031 % |
5 V |
2's Complement Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-10 V |
Parallel, 8 Bits, Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
2.5 µs |
R-PDSO-G28 |
1 |
0.104 in (2.642 mm) |
0.295 in (7.493 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.704 in (17.89 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
5 V |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
±5 V |
-5 V |
Chip Carrier |
LDCC28,.5SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 mV |
Serial, Parallel, 8 Bits, Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Track |
Quad |
9 µs |
S-PQCC-J28 |
3 |
0.18 in (4.57 mm) |
0.453 in (11.5062 mm) |
No |
e3 |
260 °C (500 °F) |
0.453 in (11.5062 mm) |
|||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
40 |
1 |
No |
2 V |
20 MHz |
1 |
12 |
0.0125 % |
15 V |
Binary, 2's Complement Binary |
-15 V |
Microelectronic Assembly |
70 °C (158 °F) |
-2 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Track |
X-XXMA-X40 |
No |
e0 |
|||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
15 V |
1 |
CMOS |
12 |
9 mA |
0.024 % |
5 V |
Binary |
5,-12/-15 V |
Small Outline |
SOP24,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-15 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
3.25 µs |
R-PDSO-G24 |
3 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
240 °C (464 °F) |
0.606 in (15.4 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.25 V |
250 kHz |
1 |
16 |
0.0092 % |
5 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Tin/Lead |
Sample |
Dual |
3.2 µs |
R-PDSO-G8 |
1 |
0.069 in (1.752 mm) |
0.154 in (3.9 mm) |
No |
e0 |
0.193 in (4.903 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
15 V |
250 kHz |
1 |
BICMOS |
12 |
0.0122 % |
5 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-300 mV |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
8 ms |
R-PDSO-G24 |
1 |
0.104 in (2.642 mm) |
0.295 in (7.493 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.606 in (15.395 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
68 |
QFP |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
1.75 V |
60 MHz |
1 |
Bipolar |
10 |
0.2197 % |
5 V |
Offset Binary, 2's Complement Binary |
±5 V |
-5 V |
Flatpack |
QFP68,1.1SQ,50 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-1.75 V |
Parallel, Word |
0 °C (32 °F) |
Tin/Lead |
Sample |
Quad |
S-CQFP-G68 |
0.143 in (3.622 mm) |
0.95 in (24.13 mm) |
No |
e0 |
30 s |
220 °C (428 °F) |
0.95 in (24.13 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
8 |
Yes |
4.101 V |
200 kHz |
1 |
CMOS |
18 |
0.0023 % |
5 V |
2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-4.091 V |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
4.405 µs |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
8 |
VSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.056 V |
2.5 MHz |
1 |
CMOS |
14 |
0.0244 % |
3 V |
Binary |
Small Outline, Very Thin Profile, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Sample |
Dual |
R-PDSO-G8 |
1 |
0.039 in (1 mm) |
0.064 in (1.625 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.114 in (2.9 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
125 MHz |
1 |
CMOS |
10 |
0.0586 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
25 MHz |
1 |
CMOS |
10 |
0.0488 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
32 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
1 |
Hybrid |
10 |
0.048 % |
15 V |
Complementary Binary, Complementary 2's Complement, Complementary Offset Binary |
5,±15 V |
-15 V |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-10 V |
Serial, Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Dual |
8.4 µs |
R-CDIP-T32 |
0.225 in (5.72 mm) |
0.9 in (22.86 mm) |
No |
e0 |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
17 V |
1 |
CMOS |
8 |
8 mA |
0.293 % |
5 V |
Binary, Offset Binary |
5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-17 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T28 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.472 in (37.4 mm) |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Pin/Peg |
72 |
Rectangular |
1 |
No |
10 V |
1 |
10 |
0.0977 % |
15 V |
Binary, Offset Binary, 2's Complement Binary |
-15 V |
Microelectronic Assembly |
70 °C (158 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Dual |
1.5 µs |
R-XDMA-P72 |
No |
|||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic |
No |
20 V |
1 |
12 |
0.024 % |
Offset Binary |
5,±12/±15 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Dual |
R-XDIP-T28 |
No |
|||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
17 V |
1 |
CMOS |
8 |
8 mA |
0.195 % |
5 V |
Binary, Offset Binary |
5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-17 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T28 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.472 in (37.4 mm) |
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|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
No Lead |
28 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
2.053 V |
5 MHz |
1 |
CMOS |
14 |
0.0244 % |
3.3 V |
2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-2.044 V |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
R-PQCC-N28 |
0.031 in (0.8 mm) |
0.157 in (4 mm) |
e3 |
0.197 in (5 mm) |
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|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
150 kHz |
1 |
12 |
0.0244 % |
3 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
4.66 µs |
R-PDSO-G8 |
1 |
0.069 in (1.752 mm) |
0.154 in (3.899 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.193 in (4.9025 mm) |
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Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
5 V |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary |
-12 V |
Chip Carrier |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-5 V |
Parallel, Word |
0 °C (32 °F) |
Quad |
5.2 µs |
S-PQCC-J28 |
0.178 in (4.51 mm) |
0.453 in (11.505 mm) |
No |
0.453 in (11.505 mm) |
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Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
128 kHz |
1 |
BICMOS |
14 |
34 mA |
0.0122 % |
12 V |
Binary, 2's Complement Binary |
5,±12 V |
-12 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-5 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
6.3 µs |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
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|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
16 |
HTSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.054 V |
5 MHz |
1 |
CMOS |
16 |
0.0122 % |
3.3 V |
Binary |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-2.042 V |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G16 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
e3 |
0.159 in (4.039 mm) |
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|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Commercial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
5.8 V |
1 |
16 |
0.0019 % |
5 V |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-300 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Dual |
149.6 ms |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
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|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
105 MHz |
1 |
CMOS |
10 |
0.0781 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
48 |
TSSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
2.048 V |
400 kHz |
1 |
10 |
0.0977 % |
5 V |
Binary, 2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-2.048 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
3 µs |
R-PDSO-G48 |
1 |
0.047 in (1.2 mm) |
0.24 in (6.1 mm) |
No |
e0 |
0.492 in (12.5 mm) |
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|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
12 |
0.0244 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
1 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N40 |
1 |
0.031 in (0.8 mm) |
0.236 in (6 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.236 in (6 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
10 |
HTSSOP |
Square |
Plastic/Epoxy |
2 |
Yes |
1.25 V |
3 MHz |
1 |
14 |
0.0244 % |
3 V |
2's Complement Binary |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1.25 V |
Serial |
0 °C (32 °F) |
Tin/Lead |
Sample |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
0.118 in (3 mm) |
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|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2.75 V |
105 MHz |
1 |
16 |
0.0053 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 mV |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2.25 V |
130 MHz |
1 |
CMOS |
16 |
0.0061 % |
3.3 V |
Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
1.5 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e0 |
0.354 in (9 mm) |
|||||||||||||||||
Analog Devices |
Digital To Analog Converter |
Commercial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.048 V |
10 MHz |
1 |
CMOS |
12 |
0.0244 % |
5 V |
2's Complement Binary |
-5 V |
Small Outline, Shrink Pitch |
0.025 in (0.635 mm) |
70 °C (158 °F) |
-2.048 V |
Parallel, Word |
0 °C (32 °F) |
Tin/Lead |
Sample |
Dual |
90 ns |
R-PDSO-G28 |
0.069 in (1.75 mm) |
0.154 in (3.899 mm) |
e0 |
0.389 in (9.893 mm) |
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Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5.25 V |
400 kHz |
1 |
8 |
0.3906 % |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
3.75 µs |
R-PDIP-T20 |
0.155 in (3.937 mm) |
0.3 in (7.62 mm) |
No |
e0 |
|||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
48 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
1.6 V |
25 MHz |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Offset Binary, 2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1.6 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
R-PDSO-G48 |
1 |
0.047 in (1.2 mm) |
0.24 in (6.1 mm) |
No |
e0 |
20 s |
235 °C (455 °F) |
0.492 in (12.5 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter |
Commercial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
6.1875 V |
1 |
CMOS |
20 |
300 μA |
0.01 % |
5 V |
Binary |
3/5 V |
Small Outline, Shrink Pitch |
Analog to Digital Converters |
70 °C (158 °F) |
-12.5 mV |
Serial |
0 °C (32 °F) |
Tin/Lead |
Dual |
163.2 ms |
R-PDSO-G28 |
No |
e0 |
||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
48 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
1.6 V |
50 MHz |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Offset Binary, 2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1.6 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G48 |
1 |
0.047 in (1.2 mm) |
0.24 in (6.1 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.492 in (12.5 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.