Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
No Lead |
18 |
DIE |
1 |
Yes |
2.46 V |
1 |
CMOS |
8 |
5 V |
Binary |
Uncased Chip |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Upper |
20 µs |
X-XUUC-N18 |
No |
e0 |
||||||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.1 V |
1 MHz |
1 |
CMOS |
18 |
0.001 % |
2.5 V |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
527 ns |
R-PDSO-G16 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.159 in (4.039 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Commercial |
No Lead |
8 |
HVSON |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.5 V |
60 Hz |
1 |
CMOS |
16 |
0.0153 % |
5 V |
Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-5.5 V |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
23 ms |
R-PDSO-N8 |
1 |
0.031 in (0.8 mm) |
0.079 in (2 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
6.05 V |
750 kHz |
1 |
CMOS |
8 |
0.3906 % |
2.7 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
1.85 µs |
R-PDSO-G8 |
1 |
0.069 in (1.752 mm) |
0.154 in (3.899 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.193 in (4.9 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
15 V |
250 kHz |
1 |
BICMOS |
12 |
0.0122 % |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-300 mV |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
3 ms |
R-PDIP-T24 |
1 |
0.15 in (3.81 mm) |
0.3 in (7.62 mm) |
No |
e3 |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
2.46 V |
1 |
CMOS |
8 |
0.3906 % |
5 V |
Offset Binary |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Track |
Quad |
15 µs |
S-PQCC-J20 |
1 |
0.18 in (4.573 mm) |
0.353 in (8.966 mm) |
No |
e0 |
0.353 in (8.966 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5 V |
1 |
CMOS |
MIL-STD-883 Class B |
12 |
0.0122 % |
5 V |
Complementary Offset Binary |
5,-15 V |
-15 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 mV |
Parallel, Word |
0 °C (32 °F) |
Sample |
Dual |
12.5 µs |
R-PDIP-T24 |
0.3 in (7.62 mm) |
No |
1.227 in (31.165 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
16 |
SOP |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
5.55 V |
1.4 kHz |
1 |
CMOS |
12 |
0.0732 % |
5 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G16 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.39 in (9.9 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
3.05 V |
25 kHz |
1 |
CMOS |
12 |
0.0122 % |
3 V |
2's Complement Binary |
-3 V |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-3.05 V |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Sample |
Dual |
26 µs |
R-PDIP-T20 |
0.165 in (4.2 mm) |
0.3 in (7.62 mm) |
No |
e3 |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
4 V |
100 kHz |
1 |
CMOS |
16 |
0.0046 % |
5 V |
2's Complement Binary |
Small Outline, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
-4 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin - annealed |
Sample |
Dual |
8 µs |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.402 in (10.2 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
2.46 V |
1 |
CMOS |
8 |
0.3906 % |
5 V |
Binary |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Quad |
20 µs |
S-PQCC-J20 |
0.18 in (4.57 mm) |
0.353 in (8.965 mm) |
No |
e0 |
0.353 in (8.965 mm) |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
125 MHz |
2 |
CMOS |
10 |
0.0684 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e0 |
0.354 in (9 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
4.102 V |
10 MHz |
1 |
CMOS |
18 |
0.0007 % |
5 V |
2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-4.09 V |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
78 ns |
S-PQCC-N32 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
e3 |
0.197 in (5 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
2 |
No |
6.05 V |
33 kHz |
1 |
8 |
0.3906 % |
3 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
32 µs |
R-PDIP-T8 |
1 |
0.15 in (3.809 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
2 |
No |
6.05 V |
33 kHz |
1 |
8 |
0.3906 % |
3 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Sample |
Dual |
32 µs |
R-PDIP-T8 |
1 |
0.3 in (7.62 mm) |
No |
e3 |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
5.05 V |
77 kHz |
1 |
CMOS |
12 |
12 mA |
0.0122 % |
5 V |
Binary, 2's Complement Binary |
-5 V |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-5.05 V |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
12 µs |
R-PDIP-T20 |
1 |
0.15 in (3.81 mm) |
0.3 in (7.62 mm) |
No |
e3 |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
6 |
VSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
3.65 V |
3 MHz |
1 |
CMOS |
12 |
0.0244 % |
3 V |
Binary |
Small Outline, Very Thin Profile, Shrink Pitch |
0.037 in (0.95 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G6 |
1 |
0.039 in (1 mm) |
0.064 in (1.625 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.114 in (2.9 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
2 |
Yes |
1.27 V |
1 |
Bipolar |
8 |
45 mA |
0.195 % |
5 V |
Binary |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-1.28 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Matte Tin |
Quad |
10 µs |
S-PQCC-J20 |
1 |
0.18 in (4.57 mm) |
0.353 in (8.965 mm) |
No |
e3 |
260 °C (500 °F) |
0.353 in (8.965 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter |
Commercial |
1 |
2.55 V |
1 |
Bipolar |
8 |
0.2 % |
5 V |
Binary, Offset Binary, 2's Complement, Offset 2's Complement |
5 V |
DIE OR CHIP |
Analog to Digital Converters |
70 °C (158 °F) |
0 °C (32 °F) |
No |
||||||||||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic |
No |
20 V |
1 |
12 |
0.012 % |
Offset Binary |
5,±15 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Dual |
R-XDIP-T28 |
No |
|||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
100 kHz |
1 |
BICMOS |
16 |
18 mA |
12 V |
Binary |
5,±12 V |
-12 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
1 ms |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
32 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
2 |
No |
10 V |
1 |
Hybrid |
10 |
0.0488 % |
12 V |
Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary |
5,±12/±15 V |
-12 V |
In-Line |
DIP32,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Dual |
2 µs |
R-CDIP-T32 |
0.275 in (6.98 mm) |
0.6 in (15.24 mm) |
No |
e0 |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
48 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
500 kHz |
1 |
Hybrid |
16 |
15 V |
Complementary 2's Complement, Complementary Offset Binary |
±5,±15 V |
-15 V |
In-Line |
DIP48,1.0 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-10 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Track |
Dual |
R-CDIP-T48 |
0.233 in (5.91 mm) |
0.6 in (15.24 mm) |
No |
e0 |
2.475 in (62.865 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
5.05 V |
500 kHz |
1 |
10 |
0.0977 % |
5 V |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
1.4 µs |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
0.118 in (3 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
8 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
150 kHz |
1 |
12 |
0.0244 % |
3 V |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
4.66 µs |
R-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
0.118 in (3 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
1 V |
80 MHz |
1 |
CMOS |
12 |
0.0342 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-500 mV |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
32 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
2 |
No |
10 V |
1 |
Hybrid |
MIL-STD-883 Class B |
12 |
0.0183 % |
15 V |
Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary |
5,±15 V |
-15 V |
In-Line |
DIP32,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Dual |
4.5 µs |
R-CDIP-T32 |
0.275 in (6.98 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.612 in (40.945 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
10 |
HTSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
2.8 MHz |
1 |
14 |
0.0244 % |
3 V |
Binary |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Tin/Lead |
Sample |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
0.118 in (3 mm) |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.05 V |
500 kHz |
1 |
10 |
0.0977 % |
5 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
1.4 µs |
R-PDSO-G8 |
1 |
0.069 in (1.752 mm) |
0.154 in (3.899 mm) |
No |
e0 |
0.193 in (4.9025 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
9.05 V |
33 kHz |
1 |
8 |
0.3906 % |
3 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Tin/Lead |
Sample |
Dual |
32 µs |
R-PDSO-G8 |
1 |
0.069 in (1.752 mm) |
0.154 in (3.9 mm) |
No |
e0 |
0.193 in (4.9025 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
46.5 kHz |
1 |
CMOS |
12 |
0.0183 % |
5 V |
Binary |
-5 V |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
Serial |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
R-PDSO-G20 |
1 |
0.116 in (2.95 mm) |
0.295 in (7.493 mm) |
No |
e0 |
0.524 in (13.3 mm) |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
No Lead |
16 |
HVSON |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.15 V |
250 kHz |
1 |
CMOS |
16 |
0.0008 % |
2.5 V |
2's Complement Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.018 in (0.45 mm) |
70 °C (158 °F) |
2.5 V |
Serial |
0 °C (32 °F) |
Matte Tin |
Dual |
3 µs |
R-PDSO-N16 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.157 in (4 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
46.5 kHz |
1 |
CMOS |
12 |
0.0183 % |
5 V |
Binary |
-5 V |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G20 |
1 |
0.116 in (2.95 mm) |
0.295 in (7.493 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.524 in (13.3 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
1.25 MHz |
1 |
CMOS |
12 |
30 mA |
0.0244 % |
5 V |
2's Complement Binary |
-5 V |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-2.5 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
750 ns |
R-PDSO-G28 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.705 in (17.9 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
6 |
VSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
3.65 V |
250 kHz |
1 |
CMOS |
12 |
1.5 mA |
0.0244 % |
3 V |
Binary |
Small Outline, Very Thin Profile, Shrink Pitch |
TSOP6,.11,37 |
0.037 in (0.95 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
3 µs |
R-PDSO-G6 |
1 |
0.039 in (1 mm) |
0.064 in (1.625 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.114 in (2.9 mm) |
|||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
5.05 V |
500 kHz |
1 |
10 |
0.0977 % |
5 V |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
1.4 µs |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
0.118 in (3 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
5 V |
1 |
BICMOS |
12 |
0.024 % |
Offset Binary |
5,-12/-15 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Dual |
R-PDIP-T24 |
1 |
No |
|||||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.1 V |
1 MHz |
1 |
CMOS |
16 |
0.0011 % |
2.5 V |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Dual |
527 ns |
R-PDSO-G16 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.159 in (4.039 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
46.5 kHz |
1 |
CMOS |
12 |
0.0122 % |
5 V |
Binary |
-5 V |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
Serial |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
R-PDSO-G20 |
1 |
0.116 in (2.95 mm) |
0.295 in (7.493 mm) |
No |
e0 |
0.524 in (13.3 mm) |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
80 MHz |
1 |
CMOS |
10 |
0.0781 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e0 |
0.276 in (7 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
10 V |
250 kHz |
1 |
Bipolar |
16 |
0.0031 % |
5 V |
2's Complement Binary |
Small Outline, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
-10 V |
Parallel, 8 Bits, Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
2.5 µs |
R-PDSO-G28 |
1 |
0.078 in (1.99 mm) |
0.209 in (5.3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.402 in (10.2 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
16 |
HTSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.054 V |
2 MHz |
1 |
CMOS |
14 |
0.0153 % |
3.3 V |
Binary |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-2.042 V |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G16 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
e3 |
0.159 in (4.039 mm) |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5 V |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary |
5,-15 V |
-15 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 mV |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
13 µs |
R-PDIP-T24 |
0.3 in (7.62 mm) |
No |
e0 |
1.227 in (31.165 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
800 kHz |
1 |
CMOS |
14 |
0.0076 % |
5 V |
2's Complement Binary |
-5 V |
Small Outline, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
-2.5 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
1.15 µs |
R-PDSO-G28 |
1 |
0.078 in (1.99 mm) |
0.209 in (5.3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.402 in (10.2 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
5.05 V |
46.5 kHz |
1 |
CMOS |
12 |
0.0183 % |
5 V |
Binary |
-5 V |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-5.05 V |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
12 µs |
R-PDIP-T20 |
1 |
0.15 in (3.81 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
52 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
2 V |
80 MHz |
1 |
CMOS |
14 |
0.0168 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 mV |
Serial, Parallel, Word |
0 °C (32 °F) |
Matte Tin - annealed |
Sample |
Quad |
R-PQCC-N52 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.315 in (8 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
400 kHz |
1 |
14 |
0.0122 % |
5 V |
2's Complement Binary |
-5 V |
Small Outline, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
-2.5 V |
Parallel, Word |
0 °C (32 °F) |
Tin/Lead |
Sample |
Dual |
2.2 µs |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e0 |
0.402 in (10.2 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5 V |
300 kHz |
1 |
BICMOS |
12 |
0.0244 % |
5 V |
Binary |
-5 V |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits, Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
2.7 ms |
R-PDSO-G24 |
1 |
0.104 in (2.642 mm) |
0.295 in (7.493 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.606 in (15.395 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.