Commercial Analog-to-Digital Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD574AJN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

1

Bipolar

12

40 mA

0.0244 %

12 V

Binary

5,±12/±15 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

35 µs

R-PDIP-T28

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

1.445 in (36.71 mm)

LTC1289CCSW#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

8

Yes

3.05 V

25 kHz

1

CMOS

12

0.0122 %

3 V

2's Complement Binary

-3 V

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-3.05 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

26 µs

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

250 °C (482 °F)

0.504 in (12.8 mm)

AD1671JQ

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1.25 MHz

1

BICMOS

12

68 mA

0.0813 %

5 V

Offset Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

800 ns

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

5962-01-373-5188

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

5 V

1

BICMOS

12

0.024 %

Offset Binary

5,-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T24

1

No

LTC2255CUH#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

125 MHz

1

CMOS

14

0.0305 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

AD774BJR

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

1

BICMOS

12

14 mA

0.0244 %

15 V

Binary

5,±12/±15 V

-15 V

Small Outline

SOP28,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

8 µs

R-PDSO-G28

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.705 in (17.9 mm)

LTC1867LACGN

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

8

Yes

1.25 V

175 kHz

1

16

0.0046 %

2.7 V

Binary, 2's Complement Binary

Small Outline, Shrink Pitch

0.025 in (0.635 mm)

70 °C (158 °F)

-1.25 V

Serial

0 °C (32 °F)

Tin/Lead

Dual

3.7 µs

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

No

e0

0.193 in (4.89 mm)

AD871JD

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1 V

5 MHz

1

BICMOS

12

0.0366 %

5 V

Offset Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

200 ns

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

LTC2312CTS8-14#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

1

Yes

2.056 V

500 kHz

1

CMOS

14

0.0244 %

3 V

Binary

Small Outline, Very Thin Profile, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

e3

30 s

260 °C (500 °F)

0.114 in (2.9 mm)

LTC2392CUK-16#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

4.75 V

500 kHz

1

CMOS

16

0.0031 %

5 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-2.5 V

Serial, Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

1.3 µs

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

AD7875LPZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

1

Yes

5 V

1

CMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

±5 V

-5 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Serial, Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Matte Tin

Track

Quad

9 µs

S-PQCC-J28

3

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e3

260 °C (500 °F)

0.453 in (11.5062 mm)

AD7878KPZ

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

1

Yes

3 V

8.3 kHz

1

CMOS

12

5 V

Binary

±5 V

-5 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-3 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Track

Quad

7.125 µs

S-PQCC-J28

3

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e3

260 °C (500 °F)

0.453 in (11.5062 mm)

LTC1273ACSW#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

5 V

300 kHz

1

BICMOS

12

0.0122 %

5 V

Binary

-5 V

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

2.7 ms

R-PDSO-G24

1

0.104 in (2.642 mm)

0.295 in (7.493 mm)

No

e3

30 s

260 °C (500 °F)

0.606 in (15.395 mm)

LTC2302CDD#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

10

HVSON

Square

Plastic/Epoxy

1

Yes

5.25 V

500 kHz

1

12

0.0244 %

5 V

2's Complement Binary

Small Outline, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

1.6 µs

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

LTC1293BCN#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

6

No

5.05 V

77 kHz

1

CMOS

12

12 mA

0.0122 %

5 V

Binary, 2's Complement Binary

-5 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-5.05 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

12 µs

R-PDIP-T16

1

0.15 in (3.81 mm)

0.3 in (7.62 mm)

No

e3

AD9048KP

Analog Devices

Analog To Digital Converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

1

Yes

0 mV

1

Bipolar

8

0.25 %

Binary, Complementary Binary, Offset 2's Complement, Complementary Offset 2's Complement

5,-5.2 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J28

No

e0

LTC1294DCSW#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

8

Yes

46.5 kHz

1

CMOS

12

0.0183 %

5 V

Binary

-5 V

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

R-PDSO-G20

1

0.116 in (2.95 mm)

0.295 in (7.493 mm)

No

e3

30 s

260 °C (500 °F)

0.524 in (13.3 mm)

LTC2311CMSE-14#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

16

HTSSOP

Rectangular

Plastic/Epoxy

1

Yes

5.25 V

5 MHz

1

CMOS

14

12 mA

0.0122 %

3.3 V

2's Complement Binary

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

TSSOP16,.19,20

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

200 ns

R-PDSO-G16

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

0.159 in (4.039 mm)

AD1674KN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

111 kHz

1

BICMOS

12

18 mA

0.0122 %

15 V

Binary

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

10 µs

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

1.472 in (37.4 mm)

AD9005ALM

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

46

DIP

Rectangular

Metal

1

No

3 V

10 MHz

1

Bipolar

12

55 mA

0.03 %

15 V

Offset Binary

5,-5.2,±15 V

-15 V

In-Line

DIP46,1.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-3 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

100 ns

R-MDIP-T46

0.231 in (5.86 mm)

1.3 in (33.02 mm)

No

e0

LTC2251CUH

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

125 MHz

1

CMOS

10

0.0586 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

LTC2221CUP#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

135 MHz

1

CMOS

12

0.0244 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2355CMSE-14#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

1

Yes

2.5 V

3.5 MHz

1

CMOS

14

0.0244 %

3.3 V

Binary

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

285 ns

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

LTC2422CMS#TRPBF

Analog Devices

Analog To Digital Converter, Delta-Sigma

Commercial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

2

Yes

1

20

Binary

Small Outline, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

Serial

0 °C (32 °F)

Matte Tin

Dual

163.44 ms

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

0.118 in (3 mm)

LTC1098ACN8#TR

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

2

No

6.05 V

33 kHz

1

8

0.3906 %

3 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Tin Lead

Sample

Dual

32 µs

R-PDIP-T8

0.3 in (7.62 mm)

No

e0

LTC2326CMS-18#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

10.2525 V

250 kHz

1

CMOS

18

0.0019 %

5 V

2's Complement Binary

Small Outline, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

-10.2275 V

Serial

0 °C (32 °F)

Matte Tin

Dual

3 µs

R-PDSO-G16

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

0.159 in (4.039 mm)

LTC2159CUK#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

2 V

20 MHz

1

CMOS

16

0.0092 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-2 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

LTC1407CMSE

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

2

Yes

2.5 V

3 MHz

1

12

0.0488 %

3 V

Binary

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Tin/Lead

Sample

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

0.118 in (3 mm)

AD578LN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

MIL-STD-883 Class B

12

0.0183 %

15 V

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

3 µs

R-CDIP-T32

0.275 in (6.98 mm)

0.6 in (15.24 mm)

No

e0

1.612 in (40.945 mm)

LTC1296DCSW

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

8

Yes

46.5 kHz

1

CMOS

12

0.0183 %

5 V

Binary

-5 V

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

Serial

0 °C (32 °F)

Tin Lead

Sample

Dual

R-PDSO-G20

1

0.116 in (2.95 mm)

0.295 in (7.493 mm)

No

e0

0.524 in (13.3 mm)

CAV-1202

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

64

1

No

4 V

2 MHz

1

12

0.0122 %

15 V

Binary, 2's Complement Binary

-15 V

Microelectronic Assembly

70 °C (158 °F)

-4 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

X-XXMA-X64

No

e0

AD9028KE

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

No Lead

68

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

500 mV

325 MHz

1

Bipolar

8

475 mA

0.293 %

Offset Binary, 2's Complement Binary

-5.2 V

-5.2 V

Chip Carrier

LCC68,.95SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-6 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Quad

3.3 ns

S-CQCC-N68

0.103 in (2.62 mm)

0.953 in (24.195 mm)

No

e0

0.953 in (24.195 mm)

LTC2293CUP#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

65 MHz

2

CMOS

12

0.0342 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-500 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

LTC2206CUK-14#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.25 V

80 MHz

1

CMOS

14

0.0092 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

1.5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e0

0.276 in (7 mm)

LTC2448CUHF#TR

Analog Devices

Analog To Digital Converter, Delta-Sigma

Commercial

No Lead

38

HVQCCN

Rectangular

Plastic/Epoxy

16

Yes

2.75 V

1

24

5 V

Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Tin Lead

Quad

170 ms

R-PQCC-N38

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.276 in (7 mm)

LTC1606CSW#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

250 kHz

1

Bipolar

16

0.0031 %

5 V

2's Complement Binary

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-10 V

Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

2.5 µs

R-PDSO-G28

1

0.104 in (2.642 mm)

0.295 in (7.493 mm)

No

e3

30 s

260 °C (500 °F)

0.704 in (17.89 mm)

LTC2140CUP-12#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

1.25 V

25 MHz

1

CMOS

12

0.022 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

700 mV

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC1196-2BCS8#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

1

Yes

6.05 V

1 MHz

1

CMOS

8

0.3906 %

2.7 V

Binary

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

2.84 µs

R-PDSO-G8

1

0.069 in (1.752 mm)

0.154 in (3.899 mm)

No

e3

30 s

260 °C (500 °F)

0.193 in (4.9 mm)

LTC2205CUK

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.5 V

65 MHz

1

CMOS

16

0.0069 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e0

0.276 in (7 mm)

LTC2151CUJ-14#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.5 V

210 MHz

1

CMOS

14

0.0311 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1.5 V

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

4.7 ns

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

LTC1274CSW

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.048 V

100 kHz

1

CMOS

12

0.0244 %

5 V

Binary, Offset Binary

0 V

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-2.048 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

8 µs

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.606 in (15.4 mm)

LTC1606ACSW#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

250 kHz

1

Bipolar

16

0.0031 %

5 V

2's Complement Binary

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-10 V

Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

2.5 µs

R-PDSO-G28

1

0.104 in (2.642 mm)

0.295 in (7.493 mm)

No

e3

30 s

260 °C (500 °F)

0.704 in (17.89 mm)

LTC2361CS6#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

6

VSSOP

Rectangular

Plastic/Epoxy

1

Yes

3.65 V

250 kHz

1

CMOS

12

0.0244 %

3 V

Binary

Small Outline, Very Thin Profile, Shrink Pitch

0.037 in (0.95 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

R-PDSO-G6

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0.114 in (2.9 mm)

AD578JN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

MIL-STD-883 Class B

12

0.0183 %

15 V

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

6 µs

R-CDIP-T32

0.275 in (6.98 mm)

0.6 in (15.24 mm)

No

e0

1.612 in (40.945 mm)

LTC1198-2BCS8#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

2

Yes

6.05 V

750 kHz

1

CMOS

8

0.3906 %

2.7 V

Binary

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

2.84 µs

R-PDSO-G8

1

0.069 in (1.752 mm)

0.154 in (3.899 mm)

No

e3

30 s

260 °C (500 °F)

0.193 in (4.9 mm)

LTC1272CCSW-8#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

5 V

250 kHz

1

CMOS

12

0.0244 %

5 V

Binary

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Dual

8.125 µs

R-PDSO-G24

0.104 in (2.642 mm)

0.295 in (7.493 mm)

e3

0.606 in (15.395 mm)

LTC1098CS8

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

2

Yes

6.05 V

33 kHz

1

8

0.3906 %

3 V

Binary

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Tin/Lead

Sample

Dual

32 µs

R-PDSO-G8

1

0.069 in (1.752 mm)

0.154 in (3.9 mm)

No

e0

0.193 in (4.9025 mm)

LTC2253CUH#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

125 MHz

1

CMOS

12

0.0366 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.