Commercial Analog-to-Digital Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD7828LRS

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

8

Yes

5 V

50 kHz

1

CMOS

8

0.39 %

5 V

Binary, Complementary Offset Binary

5 V

Small Outline, Shrink Pitch

SOP28,.4

Analog to Digital Converters

0.026 in (0.65 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Dual

2.4 µs

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e0

240 °C (464 °F)

0.402 in (10.2 mm)

LTC2323CUFD-16#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

28

HVQCCN

Rectangular

Plastic/Epoxy

2

Yes

2.053 V

5 MHz

1

CMOS

16

0.0183 %

3.3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-2.044 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Quad

R-PQCC-N28

0.031 in (0.8 mm)

0.157 in (4 mm)

e3

0.197 in (5 mm)

LTC2430CGN#TR

Analog Devices

Analog To Digital Converter, Delta-Sigma

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

1

Yes

5.8 V

1

20

0.002 %

Binary

Small Outline, Shrink Pitch

0.025 in (0.635 mm)

70 °C (158 °F)

2.4 V

Serial

0 °C (32 °F)

Tin Lead

Dual

163.44 ms

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.9116 mm)

No

e0

0.193 in (4.9 mm)

LTC2151CUJ-12#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.5 V

210 MHz

1

CMOS

12

0.0293 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1.5 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

AD7572JN12

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

12

0.0244 %

5 V

Binary

5,-12/-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

13 µs

R-PDIP-T24

0.3 in (7.62 mm)

No

e0

1.227 in (31.165 mm)

LTC1199CMS8#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

2

Yes

5.05 V

450 kHz

1

10

0.0977 %

5 V

Binary

Small Outline, Thin Profile, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

1.4 µs

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

LTC2327CMS-16#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

10.2525 V

500 kHz

1

CMOS

16

0.0023 %

5 V

2's Complement Binary

Small Outline, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

-10.2275 V

Serial

0 °C (32 °F)

Matte Tin

Dual

1.5 µs

R-PDSO-G16

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

0.159 in (4.039 mm)

LTC2242CUP-10

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

250 MHz

1

CMOS

10

0.0977 %

2.5 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

ADADC85CZ-10

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

10

0.048 %

12 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±12/±15 V

-12 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

8.4 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

AD578JD

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

MIL-STD-883 Class B

12

0.0183 %

15 V

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

6 µs

R-CDIP-T32

0.275 in (6.98 mm)

0.6 in (15.24 mm)

No

e0

1.612 in (40.945 mm)

LTC2473CMS#PBF

Analog Devices

Analog To Digital Converter, Delta-Sigma

Commercial

Gull Wing

12

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

1.253 V

1

CMOS

16

0.0183 %

Binary

Small Outline, Thin Profile, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Matte Tin - annealed

Dual

4.8 ms

R-PDSO-G12

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.159 in (4.039 mm)

LTC2324CUKG-16#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2.064 V

2 MHz

1

CMOS

16

0.0183 %

3.3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-2.034 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2421CMS#TR

Analog Devices

Analog To Digital Converter, Delta-Sigma

Commercial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

1

Yes

1

20

Binary

Small Outline, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

Serial

0 °C (32 °F)

Tin Lead

Dual

163.44 ms

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

0.118 in (3 mm)

LTC1864CMS8#TR

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

1

Yes

5.25 V

250 kHz

1

16

0.0122 %

5 V

Binary

Small Outline, Thin Profile, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Tin Lead

Sample

Dual

3.2 µs

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

0.118 in (3 mm)

LTC2229CUH#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

80 MHz

1

CMOS

12

0.0269 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-500 mV

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

LTC2223CUK#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

80 MHz

1

CMOS

12

0.0269 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

LTC1197LCS8#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.75 V

250 kHz

1

10

0.0977 %

2.7 V

Binary

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

2.9 µs

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0.193 in (4.9 mm)

LTC1290BCSW#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

8

Yes

5.05 V

50 kHz

1

CMOS

12

0.0122 %

5 V

2's Complement Binary

-5 V

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-5.05 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

13 µs

R-PDSO-G20

1

0.104 in (2.642 mm)

0.295 in (7.493 mm)

No

e3

30 s

260 °C (500 °F)

0.504 in (12.8015 mm)

AD7828LP

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

8

Yes

5 V

50 kHz

1

CMOS

8

0.1953 %

5 V

Binary, Complementary Offset Binary

5 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Quad

2.4 µs

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

225 °C (437 °F)

0.453 in (11.5062 mm)

LTC2372CUH-18#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

8

Yes

4.104 V

500 kHz

1

CMOS

18

0.001 %

5 V

Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-4.088 V

Serial

0 °C (32 °F)

Matte Tin

Quad

1.5 µs

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

260 °C (500 °F)

0.197 in (5 mm)

LTC1275BCSW#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.5 V

300 kHz

1

BICMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

-5 V

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-2.5 V

Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

2.7 µs

R-PDSO-G24

1

0.104 in (2.642 mm)

0.295 in (7.493 mm)

No

e3

30 s

260 °C (500 °F)

0.606 in (15.395 mm)

AD7875KP

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

1

Yes

5 V

1

CMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

±5 V

-5 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Serial, Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Quad

9 µs

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

225 °C (437 °F)

0.453 in (11.5062 mm)

LTC2450CDC-1#PBF

Analog Devices

Analog To Digital Converter, Delta-Sigma

Commercial

No Lead

6

HVSON

Square

Plastic/Epoxy

1

Yes

5.5 V

1

CMOS

16

0.0153 %

3 V

Binary

Small Outline, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Matte Tin - annealed

Dual

21 ms

S-PDSO-N6

1

0.031 in (0.8 mm)

0.079 in (2 mm)

No

e3

30 s

260 °C (500 °F)

0.079 in (2 mm)

LTC2389CLX-18#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

1

Yes

4.116 V

2.5 MHz

1

CMOS

18

0.0011 %

5 V

Binary, Offset Binary, 2's Complement Binary

Flatpack, Low Profile, Fine Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

-4.076 V

Serial, Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

310 ns

S-PQFP-G48

3

0.063 in (1.6 mm)

0.276 in (7 mm)

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

AD7580KN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

2

No

7.3 V

50 kHz

1

CMOS

10

10 mA

0.049 %

5 V

Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-300 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Sample

Dual

18.5 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.199 in (30.45 mm)

LTC1293CCSW#TR

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

6

Yes

46.5 kHz

1

CMOS

12

0.0122 %

5 V

Binary

-5 V

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

Serial

0 °C (32 °F)

Tin Lead

Sample

Dual

R-PDSO-G16

1

0.116 in (2.95 mm)

0.295 in (7.493 mm)

No

e0

0.406 in (10.3 mm)

LTC1409CG#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1

Yes

2.5 V

66.7 kHz

1

12

0.0244 %

5 V

2's Complement Binary

-5 V

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

-2.5 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

1.25 µs

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

0.402 in (10.2 mm)

ADC910HT

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

15 V

1

Bipolar

10

0.098 %

5 V

Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

12 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

ADC7672KN10

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

12

0.0244 %

5 V

Binary

-12 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Dual

10.4 µs

R-PDIP-T24

0.3 in (7.62 mm)

No

1.227 in (31.165 mm)

LTC1272-8ACSW#TR

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

15 V

250 kHz

1

BICMOS

12

0.0122 %

5 V

Binary

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-300 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

8 ms

R-PDSO-G24

1

0.104 in (2.642 mm)

0.295 in (7.493 mm)

No

e0

0.606 in (15.395 mm)

LTC2482CDD#TR

Analog Devices

Analog To Digital Converter, Delta-Sigma

Commercial

No Lead

10

HVSON

Square

Plastic/Epoxy

1

Yes

2.75 V

1

16

Binary

Small Outline, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

50 mV

Serial

0 °C (32 °F)

Tin Lead

Dual

149.9 ns

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e0

0.118 in (3 mm)

AD7572ALN03

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

15 V

1

CMOS

12

9 mA

0.012 %

5 V

Binary

5,-12/-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-15 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

3.25 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.199 in (30.45 mm)

AD9058KD

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Through-Hole

48

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1 V

50 MHz

2

CMOS

8

154 mA

0.4883 %

5 V

Binary

±5 V

-5 V

In-Line

DIP48,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-1 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Dual

20 ns

R-CDIP-T48

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

2.4 in (60.96 mm)

LTC1416CG#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1

Yes

2.5 V

400 kHz

1

14

0.0122 %

5 V

2's Complement Binary

-5 V

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

-2.5 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

2.2 µs

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

30 s

260 °C (500 °F)

0.402 in (10.2 mm)

LTC1278-4CSW#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.5 V

33.3 kHz

1

CMOS

12

0.0244 %

5 V

2's Complement Binary

-5 V

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-2.5 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

2.3 µs

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.606 in (15.4 mm)

LTC2480CDD#TR

Analog Devices

Analog To Digital Converter, Delta-Sigma

Commercial

No Lead

10

HVSON

Square

Plastic/Epoxy

1

Yes

5.5 V

1

16

0.001 %

5 V

Binary

Small Outline, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Tin Lead

Dual

163.5 ms

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e0

0.118 in (3 mm)

AD7853BN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

1.25 V

200 kHz

1

CMOS

12

0.0122 %

5 V

Binary, 2's Complement Binary

3.3/5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-1.25 V

Serial

0 °C (32 °F)

Tin Lead

Track

Dual

4.6 µs

R-PDIP-T24

0.3 in (7.62 mm)

No

e0

1.227 in (31.165 mm)

LTC2315CTS8-12#TRMPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

1

Yes

3.6 V

5 MHz

1

CMOS

12

0.0366 %

3 V

Binary

Small Outline, Very Thin Profile, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

e3

30 s

260 °C (500 °F)

0.114 in (2.9 mm)

LTC1408CUH-12#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

6

Yes

2.5 V

600 kHz

1

12

0.0244 %

3 V

Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Tin/Lead

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

LTC2412CGN

Analog Devices

Analog To Digital Converter, Delta-Sigma

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

2

Yes

2.75 V

1

24

5.5 V

Binary

Small Outline, Shrink Pitch

0.025 in (0.635 mm)

70 °C (158 °F)

-2.75 V

Serial

0 °C (32 °F)

Tin Lead

Dual

163.44 ms

R-PDSO-G16

1

0.068 in (1.727 mm)

0.154 in (3.899 mm)

No

e0

0.193 in (4.8895 mm)

LTC1272CCN-3#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

250 kHz

1

CMOS

12

0.0244 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Dual

3.25 µs

R-PDIP-T24

0.3 in (7.62 mm)

e3

1.28 in (32.512 mm)

LTC2207CUK-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.25 V

105 MHz

1

CMOS

14

0.0092 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

LTC2224CUK#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

135 MHz

1

CMOS

12

0.0244 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

LTC2153CUJ-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.32 V

310 MHz

1

CMOS

14

0.0458 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1.32 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

3 ns

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

LTC1864LACS8#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.5 V

150 kHz

1

16

0.0092 %

2.7 V

Binary

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

4.66 µs

R-PDSO-G8

1

0.069 in (1.752 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0.193 in (4.9 mm)

LTC2486CDE#TRPBF

Analog Devices

Analog To Digital Converter, Delta-Sigma

Commercial

No Lead

14

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

1

16

5 V

Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

Serial

0 °C (32 °F)

Matte Tin

Sample

Quad

81.9 ms

R-PQCC-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.157 in (4 mm)

LTC1405CGN#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1

Yes

2.048 V

5 MHz

1

CMOS

12

0.0244 %

5 V

2's Complement Binary

-5 V

Small Outline, Shrink Pitch

0.025 in (0.635 mm)

70 °C (158 °F)

-2.048 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

180 ns

R-PDSO-G28

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

e0

0.389 in (9.893 mm)

LTC2216CUP#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.75 V

80 MHz

1

CMOS

16

0.0053 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.