Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
840 mV |
500 MHz |
1 |
CMOS |
8 |
650 mA |
0.3516 % |
1.9 V |
Offset Binary |
1.9 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-840 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
2 ns |
S-PQFP-G144 |
3 |
0.063 in (1.6 mm) |
0.787 in (20 mm) |
No |
Peak-to-peak input voltage range: 0.84 V |
e3 |
30 s |
260 °C (500 °F) |
0.787 in (20 mm) |
||||||||
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Other |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5 V |
100 kHz |
1 |
CMOS |
16 |
0.0061 % |
5 V |
Binary |
5 V |
Small Outline |
SOP28,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-25 °C (-13 °F) |
Sample |
Dual |
8 µs |
R-PDSO-G28 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
0.705 in (17.9 mm) |
||||||||||||||||
Texas Instruments |
Analog To Digital Converter, Resistance Ladder |
Other |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
50 MHz |
1 |
8 |
0.7617 % |
5 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
550 mV |
Parallel, 8 Bits |
-20 °C (-4 °F) |
Track |
Dual |
20 ns |
R-PDSO-G24 |
0.089 in (2.25 mm) |
0.209 in (5.3 mm) |
0.6 in (15.24 mm) |
||||||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Other |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
250 kHz |
1 |
CMOS |
16 |
5 V |
2's Complement Binary |
±5 V |
-5 V |
Small Outline |
SOP28,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-2.5 V |
Parallel, Word |
-25 °C (-13 °F) |
Nickel Palladium Gold |
Sample |
Dual |
4 µs |
R-PDSO-G28 |
3 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.705 in (17.9 mm) |
||||||||||
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Other |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5 V |
100 kHz |
1 |
CMOS |
16 |
0.0046 % |
5 V |
Binary |
5 V |
Small Outline |
SOP28,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-25 °C (-13 °F) |
Sample |
Dual |
8 µs |
R-PDSO-G28 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
0.705 in (17.9 mm) |
||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Other |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
250 kHz |
1 |
CMOS |
16 |
0.0092 % |
5 V |
2's Complement Binary |
±5 V |
-5 V |
Small Outline |
SOP28,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-2.5 V |
Parallel, Word |
-25 °C (-13 °F) |
Sample |
Dual |
4 µs |
R-PDSO-G28 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
0.705 in (17.9 mm) |
||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Other |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
250 kHz |
1 |
CMOS |
16 |
5 V |
2's Complement Binary |
±5 V |
-5 V |
Small Outline |
SOP28,.4 |
Analog to Digital Converters |
4.75 V |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-2.5 V |
Parallel, Word |
-25 °C (-13 °F) |
Nickel Palladium Gold |
Sample |
Dual |
4 µs |
R-PDSO-G28 |
3 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.705 in (17.9 mm) |
|||||||||
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
2.75 V |
11.1 kHz |
1 |
CMOS |
18 |
5 V |
2's Complement Binary |
±5 V |
-5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-2.75 V |
Serial |
-25 °C (-13 °F) |
Sample |
Dual |
R-PDIP-T28 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
1.472 in (37.4 mm) |
|||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Delta-Sigma |
Other |
Gull Wing |
24 |
SSOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
2.828 V |
48 kHz |
1 |
CMOS |
20 |
5 V |
Binary |
Small Outline, Shrink Pitch |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-25 °C (-13 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G24 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.323 in (8.2 mm) |
||||||||||||||||
Texas Instruments |
Analog To Digital Converter, Flash Method |
Other |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
3.3 V |
10 MHz |
1 |
CMOS |
8 |
0.3906 % |
3 V |
Binary |
3 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP24,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-35 °C (-31 °F) |
Dual |
R-PDSO-G24 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
0.307 in (7.8 mm) |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Other |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
8 |
Yes |
10 V |
454.5 kHz |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
5 V |
Flatpack |
QFP44,.57SQ,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
105 °C (221 °F) |
-10 V |
Serial, Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Track |
Quad |
1.6 µs |
S-PQFP-G44 |
0.096 in (2.45 mm) |
0.394 in (10 mm) |
No |
e0 |
0.394 in (10 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
1 |
CMOS |
MIL-STD-883 Class B |
12 |
0.0244 % |
5 V |
Complementary Offset Binary |
5,-15 V |
-15 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-25 °C (-13 °F) |
Sample |
Dual |
5 µs |
R-CDIP-T24 |
0.225 in (5.715 mm) |
0.3 in (7.62 mm) |
No |
1.29 in (32.77 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
1.024 V |
31 MHz |
1 |
Bipolar |
12 |
260 mA |
0.0732 % |
5 V |
Offset Binary |
5,-5.2 V |
-5.2 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-1.024 V |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Track |
Dual |
250 ns |
R-CDIP-T28 |
0.284 in (7.21 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.4 in (35.56 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Other |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
8 |
Yes |
10 V |
454.5 kHz |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
105 °C (221 °F) |
-10 V |
Serial, Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Track |
Quad |
1.6 µs |
S-PQCC-J44 |
3 |
0.18 in (4.57 mm) |
0.653 in (16.585 mm) |
No |
e0 |
0.653 in (16.585 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Other |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
500 mV |
150 MHz |
1 |
Bipolar |
8 |
175 mA |
0.39 % |
Binary |
-5.2 V |
-5.2 V |
Chip Carrier |
LDCC28,.5SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-6 V |
Parallel, 8 Bits |
-25 °C (-13 °F) |
Tin Lead |
Quad |
8 ns |
S-PQCC-J28 |
0.18 in (4.57 mm) |
0.453 in (11.5062 mm) |
No |
e0 |
0.453 in (11.5062 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
2 |
No |
5.985 V |
1 |
BICMOS |
18 |
5 V |
2's Complement Binary |
±5 V |
-5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-5.985 V |
Serial |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
5 V |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary |
5,-12/-15 V |
-15 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Sample |
Dual |
5.2 µs |
R-GDIP-T24 |
0.225 in (5.715 mm) |
0.3 in (7.62 mm) |
No |
e0 |
|||||||||||||||
Analog Devices |
Analog To Digital Converter |
Other |
1 |
5 V |
1 |
CMOS |
MIL-STD-883 Class B (Modified) |
8 |
5 V |
Offset Binary |
5 V |
DIE OR CHIP |
Analog to Digital Converters |
25 °C (77 °F) |
25 °C (77 °F) |
No |
||||||||||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
1 |
Hybrid |
12 |
0.0122 % |
15 V |
Binary |
5,±15 V |
-15 V |
In-Line |
DIP24,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-5 V |
Serial, Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Sample |
Dual |
13 µs |
R-CDIP-T24 |
No |
e0 |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
32 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
2 |
No |
10 V |
1 |
Hybrid |
10 |
0.048 % |
12 V |
Complementary Binary, Complementary 2's Complement, Complementary Offset Binary |
5,±12/±15 V |
-12 V |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-10 V |
Serial, Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Dual |
21 µs |
R-CDIP-T32 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.2 in (30.48 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Other |
Flat |
68 |
QFF |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
1 V |
65 MHz |
2 |
Bipolar |
14 |
5 V |
2's Complement Binary |
±5,3.3 V |
-5 V |
Flatpack |
TPAK68,2.0SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Track |
Quad |
S-CQFP-F68 |
0.175 in (4.45 mm) |
0.95 in (24.13 mm) |
No |
e0 |
0.95 in (24.13 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
2.46 V |
1 |
CMOS |
8 |
0.1953 % |
5 V |
Offset Binary |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-25 °C (-13 °F) |
Tin Lead |
Dual |
30 µs |
R-GDIP-T18 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||||||||
Analog Devices |
Analog To Digital Converter |
Other |
Flat |
52 |
GQFF |
Square |
Ceramic |
1 |
Yes |
5 V |
1 |
Bipolar |
38535Q/M;38534H;883B |
14 |
2's Complement Binary |
3.3,5 V |
Flatpack, Guard Ring |
TPAK52,1.5SQ,40 |
Analog to Digital Converters |
0.039 in (1 mm) |
85 °C (185 °F) |
-35 °C (-31 °F) |
Quad |
S-XQFP-F52 |
No |
|||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
50 kHz |
1 |
Hybrid |
12 |
0.0122 % |
15 V |
Complementary Binary |
5,±15 V |
-15 V |
In-Line |
DIP28,.6 |
Other Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-5 V |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Track |
Dual |
15 µs |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
||||||||||||||
Analog Devices |
Analog To Digital Converter |
Other |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic |
No |
15 V |
1 |
CMOS |
8 |
0.3 % |
5 V |
Offset Binary |
5 V |
In-Line |
DIP18,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Dual |
R-XDIP-T18 |
No |
|||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
5.25 V |
125 kHz |
1 |
CMOS |
12 |
0.0244 % |
Binary |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP16,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
105 °C (221 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Tin Lead |
Track |
Dual |
7.25 µs |
R-PDSO-G16 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e0 |
0.197 in (5 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
2 |
No |
7.3 V |
50 kHz |
1 |
CMOS |
10 |
10 mA |
0.098 % |
5 V |
Binary |
5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-300 mV |
Parallel, 8 Bits |
-25 °C (-13 °F) |
Tin Lead |
Sample |
Dual |
18.5 µs |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Other |
Gull Wing |
28 |
SOP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
1.024 V |
20 MHz |
1 |
Bipolar |
12 |
0.0732 % |
5 V |
Offset Binary |
5,-5.2 V |
-5.2 V |
Small Outline |
SOP28,.76 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-1.024 V |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Track |
Dual |
R-CDSO-G28 |
0.165 in (4.191 mm) |
0.5 in (12.7 mm) |
No |
e0 |
0.72 in (18.29 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
32 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
2 |
No |
10 V |
1 |
Hybrid |
12 |
0.012 % |
15 V |
Complementary Binary, Complementary 2's Complement, Complementary Offset Binary |
5,±15 V |
-15 V |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-10 V |
Parallel, Word |
-25 °C (-13 °F) |
Gold |
Sample |
Dual |
25 µs |
R-CDIP-T32 |
0.28 in (7.11 mm) |
0.6 in (15.24 mm) |
No |
e4 |
1.2 in (30.48 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
10 V |
1 |
CMOS |
12 |
7 mA |
0.0244 % |
5 V |
Binary, Offset Binary |
-15 V |
Small Outline |
0.05 in (1.27 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Dual |
13.5 µs |
R-PDSO-G24 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
0.606 in (15.4 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Other |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
10 V |
125 kHz |
1 |
Hybrid |
14 |
0.009 % |
15 V |
Offset Binary, 2's Complement Binary |
5,±15 V |
-15 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-10 V |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Track |
Dual |
R-PDIP-T40 |
0.19 in (4.83 mm) |
0.9 in (22.86 mm) |
No |
e0 |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Other |
Gull Wing |
52 |
HLQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
2.2 V |
105 MHz |
1 |
Bipolar |
14 |
5 V |
2's Complement Binary |
3.3,5 V |
Flatpack, Heat Sink/Slug, Low Profile |
QFP52,.47SQ |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-10 °C (14 °F) |
Tin Lead |
Track |
Quad |
S-PQFP-G52 |
0.063 in (1.6 mm) |
0.472 in (12 mm) |
No |
e0 |
0.472 in (12 mm) |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
10 V |
1 |
CMOS |
12 |
7 mA |
0.0244 % |
5 V |
Binary, Offset Binary |
5,-12/-15 V |
-15 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Dual |
13.5 µs |
R-PDIP-T24 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e0 |
1.199 in (30.45 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
3 V |
1 |
BICMOS |
18 |
5 V |
2's Complement Binary |
-5 V |
In-Line |
70 °C (158 °F) |
-3 V |
Serial |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-PDIP-T28 |
No |
e0 |
||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
15 V |
1 |
Bipolar |
10 |
60 mA |
0.098 % |
5 V |
Binary |
±5 V |
-5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Dual |
12 µs |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
10 V |
1 |
CMOS |
12 |
7 mA |
0.0122 % |
5 V |
Binary, Offset Binary |
-15 V |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Dual |
13.5 µs |
R-PDIP-T24 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e0 |
1.199 in (30.45 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Other |
Gull Wing |
52 |
LQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
5.3 V |
65 MHz |
1 |
Bipolar |
14 |
0.0031 % |
5 V |
2's Complement Binary |
Flatpack, Low Profile |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-25 °C (-13 °F) |
Track |
Quad |
S-PQFP-G52 |
0.063 in (1.6 mm) |
0.394 in (10 mm) |
No |
0.394 in (10 mm) |
||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
-2 V |
100 MHz |
1 |
Bipolar |
8 |
0.4688 % |
5 V |
Binary |
5,-5.2 V |
-5.2 V |
In-Line |
DIP28,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-GDIP-T28 |
0.22 in (5.59 mm) |
0.6 in (15.24 mm) |
No |
e0 |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
2 |
No |
7.3 V |
50 kHz |
1 |
CMOS |
8 |
10 mA |
0.195 % |
5 V |
Binary |
5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-300 mV |
Parallel, 8 Bits |
-25 °C (-13 °F) |
Tin Lead |
Sample |
Dual |
18.5 µs |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Gull Wing |
16 |
SOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
5.25 V |
125 kHz |
1 |
CMOS |
12 |
0.0244 % |
Binary |
3/5 V |
Small Outline |
SOP16,.25 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
105 °C (221 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Tin Lead |
Track |
Dual |
7.25 µs |
R-PDSO-G16 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e0 |
240 °C (464 °F) |
0.39 in (9.9 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter |
Other |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic |
1 |
No |
15 V |
1 |
CMOS |
8 |
0.2 % |
5 V |
Offset Binary |
5 V |
In-Line |
DIP18,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin/Lead |
Dual |
R-XDIP-T18 |
e0 |
|||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
2 |
No |
15 V |
1 |
CMOS |
12 |
12 mA |
0.012 % |
5 V |
Binary |
5,-12 V |
-12 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-15 V |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Sample |
Dual |
10.4 µs |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
1 |
Hybrid |
12 |
0.0122 % |
15 V |
Binary |
5,±15 V |
-15 V |
In-Line |
DIP24,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-5 V |
Serial, Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Sample |
Dual |
50 µs |
R-CDIP-T24 |
No |
e0 |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Metal |
1 |
No |
5 V |
50 kHz |
1 |
Hybrid |
12 |
0.0122 % |
15 V |
Complementary Binary |
5,±15 V |
-15 V |
In-Line |
DIP28,.6 |
Other Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-5 V |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Track |
Dual |
15 µs |
R-MDIP-T28 |
0.205 in (5.21 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.57 in (39.88 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter |
Other |
Gull Wing |
28 |
SOP |
Rectangular |
Ceramic |
1 |
Yes |
0 mV |
1 |
BICMOS |
10 |
0.24 % |
5 V |
Offset Binary |
±5 V |
-5 V |
Small Outline |
SOP28,.76 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin/Lead |
Dual |
R-XDSO-G28 |
No |
e0 |
|||||||||||||||||||||
Analog Devices |
Analog To Digital Converter |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic |
1 |
No |
1 |
CMOS |
10 |
Offset Binary |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin/Lead |
Dual |
R-XDIP-T28 |
No |
e0 |
||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter |
Other |
No Lead |
28 |
QCCN |
Square |
Ceramic |
1 |
Yes |
5 V |
1 |
BICMOS |
12 |
0.024 % |
Offset Binary |
5,-12/-15 V |
Chip Carrier |
LCC28,.45SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Quad |
S-XQCC-N28 |
No |
e0 |
|||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter |
Other |
Through-Hole |
32 |
DIP |
Rectangular |
Ceramic |
No |
10 V |
1 |
Hybrid |
12 |
0.012 % |
Offset Binary |
5,±15 V |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Dual |
R-XDIP-T32 |
No |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.