Other Analog-to-Digital Converters 456

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD7572BE12

Analog Devices

Analog To Digital Converter

Other

No Lead

28

QCCN

Square

Ceramic

1

Yes

5 V

1

BICMOS

12

0.024 %

Offset Binary

5,-15 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Quad

S-XQCC-N28

No

e0

AD9012AP

Analog Devices

Analog To Digital Converter, Flash Method

Other

J Bend

28

QCCJ

Square

Plastic/Epoxy

1

Yes

500 mV

100 MHz

1

Bipolar

8

179 mA

0.39 %

5 V

Binary

5,-5.2 V

-5.2 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-6 V

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Quad

13 ns

S-PQCC-J28

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

0.453 in (11.5062 mm)

ADADC80-Z-12

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

12

0.012 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±12/±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-25 °C (-13 °F)

Gold

Sample

Dual

25 µs

R-CDIP-T32

0.28 in (7.11 mm)

0.6 in (15.24 mm)

No

e4

1.2 in (30.48 mm)

AD9032AZ

Analog Devices

Analog To Digital Converter, Flash Method

Other

Flat

40

DFP

Rectangular

Ceramic, Metal-Sealed Cofired

1

Yes

1.024 V

25 MHz

1

Bipolar

12

0.0488 %

5 V

2's Complement Binary

5,-5.2 V

-5.2 V

Flatpack

LCC40,.5SQ,40

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-1.024 V

Parallel, Word

-25 °C (-13 °F)

Track

Dual

93.1 ns

R-CDFP-F40

0.217 in (5.515 mm)

1.09 in (27.69 mm)

No

2.095 in (53.21 mm)

AD7574BQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

20 V

1

CMOS

8

0.195 %

5 V

Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-20 V

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Dual

15 µs

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD5240ZBD/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

Hybrid

38535Q/M;38534H;883B

12

100 mA

0.012 %

12 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±12/±15 V

-12 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Serial, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

5 µs

R-CDIP-T32

0.28 in (7.11 mm)

0.9 in (22.86 mm)

No

e0

ADC72AD

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

29 kHz

1

16

0.006 %

15 V

Complementary Offset Binary, Complementary Binary

-15 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

50 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

AD368AD

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

50 kHz

1

Hybrid

12

0.0183 %

15 V

Complementary Binary

5,±15 V

-15 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

15 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD9003TM/883B

Analog Devices

Analog To Digital Converter

Other

Through-Hole

40

DIP

Rectangular

Metal

1

No

2.5 V

1

38535Q/M;38534H;883B

12

0.049 %

Complementary Binary, Complementary Offset Binary

5,±15 V

In-Line

DIP40,.9

Analog to Digital Converters

0.1 in (2.54 mm)

100 °C (212 °F)

Parallel, Word

-25 °C (-13 °F)

Tin/Lead

Dual

R-MDIP-T40

No

e0

ADC910ET

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

15 V

1

Bipolar

10

60 mA

0.049 %

5 V

Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

12 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD9003TM

Analog Devices

Analog To Digital Converter, Flash Method

Other

Through-Hole

40

DIP

Rectangular

Metal

1

No

15 V

1 MHz

1

12

90 mA

0.036 %

15 V

Complementary Binary, Complementary Offset Binary

-15 V

In-Line

0.1 in (2.54 mm)

100 °C (212 °F)

-15 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

1 µs

R-MDIP-T40

0.19 in (4.83 mm)

0.9 in (22.86 mm)

No

e0

AD7856KRZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

8

Yes

5.25 V

285 kHz

1

CMOS

14

0.0122 %

5 V

Binary

5 V

Small Outline

SOP24,.4

Analog to Digital Converters

0.05 in (1.27 mm)

105 °C (221 °F)

0 mV

Serial

0 °C (32 °F)

Matte Tin

Track

Dual

5.25 µs

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

260 °C (500 °F)

0.606 in (15.4 mm)

AD7570JD

Analog Devices

Analog To Digital Converter

Other

Through-Hole

28

DIP

Rectangular

Ceramic

1

No

10 V

1

CMOS

8

0.05 %

Binary, Offset Binary

5,15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

AD9650USVZR7-105EP

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

80

HTFQFP

Square

Plastic/Epoxy

2

Yes

2.7 V

105 MHz

1

CMOS

16

0.0092 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

1.8 V

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

TQFP80,.55SQ

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-2.7 V

Serial, Parallel, Word

-55 °C (-67 °F)

Sample

Quad

50 ns

S-PQFP-G80

3

0.047 in (1.2 mm)

0.472 in (12 mm)

30 s

260 °C (500 °F)

0.472 in (12 mm)

AD7572AQ12

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

0.0244 %

5 V

Binary

5,-12/-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Sample

Dual

13 µs

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

e0

AD9050JJ

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

J Bend

28

QCCJ

Square

Ceramic, Metal-Sealed Cofired

1

Yes

40 MHz

1

BICMOS

10

5 V

Offset Binary

Chip Carrier

0.05 in (1.27 mm)

85 °C (185 °F)

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Quad

S-CQCC-J28

0.171 in (4.34 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

ADADC85Z-12

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

12

0.012 %

12 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±12/±15 V

-12 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

10 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

DAS1157

Analog Devices

Analog To Digital Converter Subsystem

Other

Pin/Peg

32

Rectangular

1

No

10 V

18 kHz

1

CMOS

14

0.005 %

15 V

Binary, Offset Binary, 2's Complement Binary

-15 V

Microelectronic Assembly

85 °C (185 °F)

-10 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Sample

50 µs

R-XXMA-P32

No

e0

AD9003SM

Analog Devices

Analog To Digital Converter, Flash Method

Other

Through-Hole

40

DIP

Rectangular

Metal

1

No

15 V

1 MHz

1

12

90 mA

0.036 %

15 V

Complementary Binary, Complementary Offset Binary

-15 V

In-Line

0.1 in (2.54 mm)

100 °C (212 °F)

-15 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

1 µs

R-MDIP-T40

0.19 in (4.83 mm)

0.9 in (22.86 mm)

No

e0

AD9688BQ

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

3.3 V

200 MHz

1

Bipolar

4

85 mA

0.3906 %

5 V

Binary

5,-5.2 V

-5.2 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-2.7 V

Parallel, 4 Bits

-25 °C (-13 °F)

Tin Lead

Dual

5.7 ns

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

ADC7672BQ10

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

0.0244 %

5 V

Binary

-12 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-25 °C (-13 °F)

Dual

10.4 µs

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

HAS-1409KMB

Analog Devices

Analog To Digital Converter

Other

Through-Hole

40

DIP

Rectangular

Metal

1

No

10 V

1

Hybrid

MIL-STD-883 Class B (Modified)

14

0.009 %

Offset Binary, 2's Complement Binary

5,±15 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-MDIP-T40

No

e0

AD9218SSTZ-105EPRL

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

2

Yes

105 MHz

1

CMOS

10

0.2637 %

3 V

Binary

Flatpack, Low Profile, Fine Pitch

0.02 in (0.5 mm)

105 °C (221 °F)

Serial

-55 °C (-67 °F)

Nickel Palladium Gold

Track

Quad

S-PQFP-G48

3

0.063 in (1.6 mm)

0.276 in (7 mm)

e4

30 s

260 °C (500 °F)

0.276 in (7 mm)

AD9023BZ

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

28

SOP

Rectangular

Ceramic, Metal-Sealed Cofired

1

Yes

1.024 V

20 MHz

1

Bipolar

12

240 mA

0.0732 %

5 V

Offset Binary

5,-5.2 V

-5.2 V

Small Outline

SOP28,.76

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-1.024 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

R-CDSO-G28

0.5 in (12.7 mm)

No

e0

0.72 in (18.285 mm)

ADC912BIFS

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

1

CMOS

12

7 mA

0.0244 %

5 V

Binary, Offset Binary

-15 V

Small Outline

0.05 in (1.27 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

13.5 µs

R-PDSO-G24

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.606 in (15.4 mm)

AD9821KSTRL

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

1

Yes

1.8 V

40 MHz

1

12

3 V

Binary

Flatpack, Low Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-20 °C (-4 °F)

Tin Lead

Sample

Quad

S-PQFP-G48

3

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e0

240 °C (464 °F)

0.276 in (7 mm)

AD5240BD

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

12

100 mA

0.012 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

5 µs

R-CDIP-T32

0.28 in (7.11 mm)

0.9 in (22.86 mm)

No

e0

AD7550BD/+

Analog Devices

Analog To Digital Converter

Other

Through-Hole

40

DIP

Rectangular

Ceramic

1

No

2 V

1

CMOS

13

0.012 %

Offset Binary

±5,12 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T40

e0

AD7672BQ10

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

15 V

1

CMOS

12

12 mA

0.024 %

5 V

Binary

5,-12 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-15 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Sample

Dual

10.4 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD9012BP

Analog Devices

Analog To Digital Converter, Flash Method

Other

J Bend

28

QCCJ

Square

Plastic/Epoxy

1

Yes

500 mV

100 MHz

1

Bipolar

8

179 mA

0.195 %

5 V

Binary

5,-5.2 V

-5.2 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-6 V

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Quad

13 ns

S-PQCC-J28

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

0.453 in (11.5062 mm)

AD7550BD

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Through-Hole

40

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

2 V

1

CMOS

13

0.012 %

5 V

2's Complement Binary

±5,12 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T40

0.15 in (3.81 mm)

0.6 in (15.24 mm)

No

e0

2 in (50.8 mm)

AD7575AQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Track

Dual

15 µs

R-GDIP-T18

0.24 in (6.096 mm)

0.3 in (7.62 mm)

No

e0

ADC912FW

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

CMOS

12

7 mA

0.0244 %

5 V

Binary, Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

13.5 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

ADC912AGBC

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

No Lead

24

DIE

Rectangular

1

Yes

15 V

1

CMOS

12

7 mA

0.024 %

5 V

Offset Binary

5,-12/-15 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

25 °C (77 °F)

-15 V

Parallel, Word

25 °C (77 °F)

Tin Lead

Upper

11.2 µs

R-XUUC-N24

No

e0

HAS-1409KM

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

125 kHz

1

Hybrid

14

0.009 %

15 V

Offset Binary, 2's Complement Binary

5,±15 V

-15 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

R-PDIP-T40

0.19 in (4.83 mm)

0.9 in (22.86 mm)

No

e0

AD9012AN

Analog Devices

Analog To Digital Converter, Flash Method

Other

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

500 mV

100 MHz

1

Bipolar

8

179 mA

0.39 %

5 V

Binary

5,-5.2 V

-5.2 V

In-Line

DIP28,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-6 V

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Dual

13 ns

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

1.472 in (37.4 mm)

AD7576ACHIPS

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

No Lead

18

DIE

1

Yes

2.46 V

1

CMOS

8

5 V

Binary

Uncased Chip

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Upper

20 µs

X-XUUC-N18

No

e0

AD9012BN

Analog Devices

Analog To Digital Converter, Flash Method

Other

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

500 mV

100 MHz

1

Bipolar

8

179 mA

0.195 %

5 V

Binary

5,-5.2 V

-5.2 V

In-Line

DIP28,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-6 V

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Dual

13 ns

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

1.472 in (37.4 mm)

AD9040AAQ

Analog Devices

Analog To Digital Converter

Other

Through-Hole

28

DIP

Rectangular

Ceramic

1

No

0 mV

1

BICMOS

10

0.24 %

5 V

Offset Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

AD7891YP-1REEL

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

J Bend

44

QCCJ

Square

Plastic/Epoxy

8

Yes

10 V

454.5 kHz

1

CMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

5 V

Chip Carrier

LDCC44,.7SQ

Analog to Digital Converters

0.05 in (1.27 mm)

105 °C (221 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Quad

1.6 µs

S-PQCC-J44

0.18 in (4.57 mm)

0.653 in (16.585 mm)

No

e0

0.653 in (16.585 mm)

AD9240ASRL

Analog Devices

Analog To Digital Converter, Flash Method

Other

Gull Wing

44

QFP

Square

1

Yes

5.25 V

10 MHz

1

CMOS

14

5 V

Binary

5 V

Flatpack

QFP44,.5SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Quad

S-XQFP-G44

3

0.096 in (2.45 mm)

0.394 in (10 mm)

No

e0

240 °C (464 °F)

0.394 in (10 mm)

AD7891YS-2REEL

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

44

QFP

Square

Plastic/Epoxy

8

Yes

2.5 V

500 kHz

1

CMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

5 V

Flatpack

QFP44,.57SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

105 °C (221 °F)

-2.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Quad

1.6 µs

S-PQFP-G44

0.096 in (2.45 mm)

0.394 in (10 mm)

No

e0

0.394 in (10 mm)

AD5201AD

Analog Devices

Analog To Digital Converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic

1

No

5 V

1

Hybrid

12

0.012 %

Complementary Offset Binary

5,±15 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

AD5214BD/883B

Analog Devices

Analog To Digital Converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic

1

No

5 V

1

Hybrid

38535Q/M;38534H;883B

12

0.012 %

Complementary Offset Binary

5,±15 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

AD7572AQ12/883B

Analog Devices

Analog To Digital Converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

CMOS

MIL-STD-883 Class B

12

0.0244 %

5 V

Complementary Offset Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-25 °C (-13 °F)

Sample

Dual

12.5 µs

R-CDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

1.29 in (32.77 mm)

AD7891YS-1REEL

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

44

QFP

Square

Plastic/Epoxy

8

Yes

10 V

454.5 kHz

1

CMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

5 V

Flatpack

QFP44,.57SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

105 °C (221 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Quad

1.6 µs

S-PQFP-G44

0.096 in (2.45 mm)

0.394 in (10 mm)

No

e0

0.394 in (10 mm)

AD7672BQ03/+

Analog Devices

Analog To Digital Converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic

1

No

10 V

1

BICMOS

12

0.024 %

Binary, Offset Binary

5,-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead (Sn63Pb37)

Dual

R-XDIP-T24

e0

AD7572CE05

Analog Devices

Analog To Digital Converter

Other

No Lead

28

QCCN

Square

Ceramic

1

Yes

5 V

1

BICMOS

12

0.018 %

Offset Binary

5,-15 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Quad

S-XQCC-N28

No

e0

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.