Other Analog-to-Digital Converters 456

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD6644AST-40

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

52

LQFP

Square

Plastic/Epoxy

1

Yes

2.2 V

40 MHz

1

Bipolar

14

0.0031 %

5 V

2's Complement Binary

3.3,5 V

Flatpack, Low Profile

QFP52,.47SQ

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Quad

S-PQFP-G52

3

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e0

240 °C (464 °F)

0.394 in (10 mm)

AD6644ASTZ-40

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

52

LQFP

Square

Plastic/Epoxy

1

Yes

2.2 V

40 MHz

1

Bipolar

14

0.0031 %

5 V

2's Complement Binary

3.3,5 V

Flatpack, Low Profile

QFP52,.47SQ

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-25 °C (-13 °F)

Matte Tin

Track

Quad

S-PQFP-G52

3

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

0.394 in (10 mm)

AD7672BCHIPS

Analog Devices

Analog To Digital Converter

Other

1

10 V

1

BICMOS

12

0.024 %

Binary, Offset Binary

5,-12 V

DIE OR CHIP

Analog to Digital Converters

85 °C (185 °F)

-25 °C (-13 °F)

No

AD7580BQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

7.3 V

50 kHz

1

CMOS

10

10 mA

0.049 %

5 V

Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-300 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Sample

Dual

18.5 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

LTC2392HLX-16#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

1

Yes

4.75 V

500 kHz

1

CMOS

16

0.0031 %

5 V

Offset Binary, 2's Complement Binary

Flatpack, Low Profile, Fine Pitch

0.02 in (0.5 mm)

125 °C (257 °F)

-2.5 V

Serial, Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

1.3 µs

S-PQFP-G48

3

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

AD7851KR

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

5.25 V

285 kHz

1

CMOS

14

0.0061 %

5 V

Binary, 2's Complement Binary

5 V

Small Outline

SOP24,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

0 mV

Serial

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Track

Dual

3.25 µs

R-PDSO-G24

3

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

30 s

240 °C (464 °F)

0.606 in (15.4 mm)

AD9007AM

Analog Devices

Analog To Digital Converter, Flash Method

Other

Pin/Peg

46

QIP

Rectangular

Metal

1

No

1.25 V

10.24 MHz

1

Hybrid

12

5 V

2's Complement Binary

5,-5.2 V

-5.2 V

In-Line

DIP46,1.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-1.25 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

97 ns

R-MDIP-P46

0.305 in (7.743 mm)

1.3 in (33.02 mm)

No

e0

AD7574AQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

20 V

1

CMOS

8

0.293 %

5 V

Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-20 V

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Dual

15 µs

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7571BQ

Analog Devices

Analog To Digital Converter

Other

Through-Hole

28

DIP

Rectangular

Ceramic

1

No

1

CMOS

10

Offset Binary

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

AD7576AE

Analog Devices

Analog To Digital Converter

Other

No Lead

20

QCCN

Square

Ceramic

1

Yes

2.46 V

1

CMOS

8

0.39 %

5 V

Binary

5 V

Chip Carrier

LCC20,.35SQ

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Quad

S-XQCC-N20

No

e0

AD7581AQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

17 V

1

CMOS

8

8 mA

0.731 %

5 V

Binary, Offset Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-17 V

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD9032AD

Analog Devices

Analog To Digital Converter, Flash Method

Other

Through-Hole

40

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1.024 V

25 MHz

1

Bipolar

12

0.0488 %

5 V

2's Complement Binary

5,-5.2 V

-5.2 V

In-Line

DIP40,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-1.024 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

93.1 ns

R-CDIP-T40

0.225 in (5.715 mm)

0.6 in (15.24 mm)

No

e0

2.095 in (53.21 mm)

AD5202BD

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

12

0.0122 %

15 V

Binary

5,±15 V

-15 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Sample

Dual

50 µs

R-CDIP-T24

No

e0

ADC7672CQ10

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

0.0244 %

5 V

Binary

-12 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-25 °C (-13 °F)

Dual

10.4 µs

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

AD9821KSTZ

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

1

Yes

1.8 V

40 MHz

1

CMOS

12

3 V

Binary

3 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-20 °C (-4 °F)

Matte Tin

Sample

Quad

S-PQFP-G48

3

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e3

260 °C (500 °F)

0.276 in (7 mm)

AD10201AB

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Ball

385

BGA

Square

Plastic/Epoxy

1

Yes

1.75 V

105 MHz

2

12

0.0366 %

5 V

2's Complement Binary

3.3,5 V

Grid Array

BGA385,25X25,50

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-25 °C (-13 °F)

Track

Bottom

S-PBGA-B385

3

0.075 in (1.9 mm)

1.378 in (35 mm)

No

225 °C (437 °F)

1.378 in (35 mm)

AD5212BD

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

12

0.0122 %

15 V

Binary

5,±15 V

-15 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Sample

Dual

13 µs

R-CDIP-T24

No

e0

AD7578BD

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

17.3 V

1

CMOS

12

7.5 mA

15 V

Binary

±5,15 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-300 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Dual

150 µs

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-01-412-1600

Analog Devices

Analog To Digital Converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic

No

3 V

1

BICMOS

12

0.024 %

5 V

Offset Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-XDIP-T24

No

AD9012BQ

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

-2 V

100 MHz

1

Bipolar

8

0.4688 %

5 V

Binary

5,-5.2 V

-5.2 V

In-Line

DIP28,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T28

0.22 in (5.59 mm)

0.6 in (15.24 mm)

No

e0

AD7572CQ12/883B

Analog Devices

Analog To Digital Converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

CMOS

MIL-STD-883 Class B

12

0.0122 %

5 V

Complementary Offset Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-25 °C (-13 °F)

Sample

Dual

12.5 µs

R-CDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

1.29 in (32.77 mm)

AD7572CQ05

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

0.0122 %

5 V

Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Sample

Dual

5.2 µs

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

e0

AD5211BD

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

Hybrid

12

0.0122 %

15 V

Binary

5,±15 V

-15 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Serial, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Sample

Dual

13 µs

R-CDIP-T24

No

e0

AD9034AZ

Analog Devices

Analog To Digital Converter, Flash Method

Other

Flat

40

DFP

Rectangular

1

Yes

1.024 V

20.48 MHz

1

CMOS

12

5 V

2's Complement Binary

5,-5.2 V

-5.2 V

Flatpack

FL40,1.2,100

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-1.024 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

49 ns

R-XDFP-F40

0.217 in (5.515 mm)

1.09 in (27.69 mm)

No

e0

2.095 in (53.21 mm)

AD7572AE05

Analog Devices

Analog To Digital Converter

Other

No Lead

28

QCCN

Square

Ceramic

1

Yes

5 V

1

BICMOS

12

0.024 %

Offset Binary

5,-12/-15 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Quad

S-XQCC-N28

No

e0

AD7550BQ

Analog Devices

Analog To Digital Converter

Other

Through-Hole

40

DIP

Rectangular

Ceramic

1

No

2 V

1

CMOS

13

0.012 %

Offset Binary

±5,12 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-XDIP-T40

No

e0

AD579BD

Analog Devices

Analog To Digital Converter

Other

Through-Hole

32

DIP

Rectangular

Ceramic

1

No

20 V

1

Hybrid

10

Binary, Complementary Binary, Offset 2's Complement, Offset Binary, Complementary Offset Binary, 2's Complement

5,±15 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T32

No

e0

AD7575BCHIPS

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

No Lead

18

DIE

1

Yes

2.46 V

1

CMOS

8

0.1953 %

5 V

Offset Binary

Uncased Chip

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Track

Upper

15 µs

X-XUUC-N18

No

ADADC72AM

Analog Devices

Analog To Digital Converter

Other

Through-Hole

32

DIP

Rectangular

Metal

1

No

20 V

1

Bipolar

16

0.006 %

Offset Binary

5,±15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-MDIP-T32

No

e0

AD7572CQ05/883B

Analog Devices

Analog To Digital Converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

CMOS

MIL-STD-883 Class B

12

0.0122 %

5 V

Complementary Offset Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-25 °C (-13 °F)

Sample

Dual

5 µs

R-CDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

1.29 in (32.77 mm)

HAS-1204SM

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Pin/Peg

40

DIP

Rectangular

Metal

1

No

5 V

500 kHz

1

Hybrid

12

177 mA

15 V

Complementary Binary, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP40,.9

Analog to Digital Converters

0.1 in (2.54 mm)

100 °C (212 °F)

-5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

2 µs

R-MDIP-P40

0.19 in (4.83 mm)

0.9 in (22.86 mm)

No

e0

AD5211BD/883B

Analog Devices

Analog To Digital Converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic

1

No

5 V

1

Hybrid

38535Q/M;38534H;883B

12

0.012 %

Complementary Offset Binary

5,±15 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

AD7574BD/+

Analog Devices

Analog To Digital Converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

15 V

1

CMOS

8

0.2 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T18

e0

AD7672CQ10

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

15 V

1

CMOS

12

12 mA

0.012 %

5 V

Binary

5,-12 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-15 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Sample

Dual

10.4 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD5204BD

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

Hybrid

12

0.0122 %

15 V

Binary

5,±15 V

-15 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Serial, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Sample

Dual

50 µs

R-CDIP-T24

No

e0

AD369BM

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

28

DIP

Rectangular

Metal

1

No

5 V

50 kHz

1

Hybrid

12

0.0122 %

15 V

Complementary Binary

5,±15 V

-15 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

15 µs

R-MDIP-T28

0.205 in (5.21 mm)

0.6 in (15.24 mm)

No

e0

1.57 in (39.88 mm)

AD9040AAZ

Analog Devices

Analog To Digital Converter

Other

Gull Wing

28

SOP

Rectangular

Ceramic

1

Yes

0 mV

1

BICMOS

10

0.24 %

5 V

Offset Binary

±5 V

-5 V

Small Outline

SOP28,.76

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDSO-G28

No

e0

AD7571AQ

Analog Devices

Analog To Digital Converter

Other

Through-Hole

28

DIP

Rectangular

Ceramic

1

No

1

CMOS

10

Offset Binary

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

AD7572AE12

Analog Devices

Analog To Digital Converter

Other

No Lead

28

QCCN

Square

Ceramic

1

Yes

5 V

1

BICMOS

12

0.024 %

Offset Binary

5,-12/-15 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Quad

S-XQCC-N28

No

e0

5962-01-194-4160

Analog Devices

Analog To Digital Converter

Other

Through-Hole

32

DIP

Rectangular

Ceramic

No

10 V

1

Hybrid

12

0.012 %

Offset Binary

5,±15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-XDIP-T32

No

AD9002AJ

Analog Devices

Analog To Digital Converter, Flash Method

Other

J Bend

28

QCCJ

Square

Ceramic, Metal-Sealed Cofired

1

Yes

0 mV

150 MHz

1

Bipolar

8

0.4688 %

Binary

-5.2 V

-5.2 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-2 V

Parallel, 8 Bits

-25 °C (-13 °F)

Gold

Quad

S-CQCC-J28

0.125 in (3.18 mm)

0.45 in (11.43 mm)

No

e4

0.45 in (11.43 mm)

AD7575BQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Track

Dual

15 µs

R-GDIP-T18

0.24 in (6.096 mm)

0.3 in (7.62 mm)

No

e0

AD9032BD

Analog Devices

Analog To Digital Converter, Flash Method

Other

Through-Hole

40

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1.024 V

25 MHz

1

Bipolar

12

0.0488 %

5 V

2's Complement Binary

5,-5.2 V

-5.2 V

In-Line

DIP40,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-1.024 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

93.1 ns

R-CDIP-T40

0.225 in (5.715 mm)

0.6 in (15.24 mm)

No

e0

2.095 in (53.21 mm)

HAS-1409LMB

Analog Devices

Analog To Digital Converter

Other

Through-Hole

40

DIP

Rectangular

Metal

1

No

10 V

1

Hybrid

MIL-STD-883 Class B (Modified)

14

0.009 %

Offset Binary, 2's Complement Binary

5,±15 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-MDIP-T40

No

e0

AD7572BQ12

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

0.0244 %

5 V

Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Sample

Dual

13 µs

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

e0

ADADC72AD

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Bipolar

16

0.006 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

50 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

5962-01-412-1607

Analog Devices

Analog To Digital Converter

Other

No Lead

28

QCCN

Square

Ceramic

Yes

5 V

1

BICMOS

12

0.024 %

Offset Binary

5,-12/-15 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Quad

S-XQCC-N28

No

MAX162BING

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

12

12 mA

0.024 %

5 V

Offset Binary, Complementary Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Dual

3.25 s

R-PDIP-T24

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

1.203 in (30.545 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.