Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Other |
Ball |
192 |
HBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
1.4 V |
10250 MHz |
1 |
12 |
1 V |
Offset Binary, 2's Complement Binary, Gray Code |
Grid Array, Heat Sink/Slug |
0.031 in (0.8 mm) |
115 °C (239 °F) |
-1.4 V |
Serial |
-10 °C (14 °F) |
Bottom |
0.975 ns |
S-PBGA-B192 |
0.067 in (1.71 mm) |
0.472 in (12 mm) |
0.472 in (12 mm) |
|||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter |
Other |
Through-Hole |
40 |
DIP |
Rectangular |
Metal |
1 |
No |
10 V |
1 |
Hybrid |
MIL-STD-883 Class B (Modified) |
14 |
0.009 % |
Offset Binary, 2's Complement Binary |
5,±15 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin/Lead |
Dual |
R-MDIP-T40 |
No |
e0 |
||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
500 mV |
150 MHz |
1 |
Bipolar |
8 |
175 mA |
0.195 % |
Binary |
-5.2 V |
-5.2 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-6 V |
Parallel, 8 Bits |
-25 °C (-13 °F) |
Tin Lead |
Dual |
8 ns |
R-PDIP-T28 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.472 in (37.4 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5.25 V |
285 kHz |
1 |
CMOS |
14 |
0.0061 % |
5 V |
Binary, 2's Complement Binary |
5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Track |
Dual |
3.25 µs |
R-PDIP-T24 |
0.18 in (4.57 mm) |
0.3 in (7.62 mm) |
No |
e3 |
1.165 in (29.59 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
No |
5 V |
1 |
BICMOS |
12 |
0.024 % |
Offset Binary |
5,-15 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Dual |
R-XDIP-T24 |
No |
||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
32 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
1 |
Bipolar |
10 |
0.0488 % |
15 V |
Binary, Offset Binary, 2's Complement Binary |
5,±15 V |
-15 V |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-10 V |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Dual |
800 ns |
R-CDIP-T32 |
0.28 in (7.11 mm) |
0.9 in (22.86 mm) |
No |
e0 |
||||||||||||||||
Analog Devices |
Analog To Digital Converter |
Other |
Through-Hole |
40 |
DIP |
Rectangular |
Ceramic |
No |
2 V |
1 |
CMOS |
13 |
0.012 % |
Offset Binary |
±5,12 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Dual |
R-XDIP-T40 |
No |
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Analog Devices |
Analog To Digital Converter |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
1 |
No |
10 V |
1 |
Hybrid |
38535Q/M;38534H;883B |
12 |
0.012 % |
Complementary Offset Binary |
5,±15 V |
In-Line |
DIP24,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin/Lead |
Dual |
R-XDIP-T24 |
No |
e0 |
||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
500 mV |
150 MHz |
1 |
Bipolar |
8 |
175 mA |
0.39 % |
Binary |
-5.2 V |
-5.2 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-6 V |
Parallel, 8 Bits |
-25 °C (-13 °F) |
Tin Lead |
Dual |
8 ns |
R-PDIP-T28 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.472 in (37.4 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter |
Other |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
1 V |
1 |
BICMOS |
10 |
5 V |
Offset Binary |
5 V |
Small Outline, Shrink Pitch |
SSOP28,.25 |
Analog to Digital Converters |
0.025 in (0.635 mm) |
85 °C (185 °F) |
0 °C (32 °F) |
Tin/Lead |
Dual |
R-PDSO-G28 |
No |
e0 |
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|
Analog Devices |
Analog To Digital Converter, Flash Method |
Other |
Flat |
40 |
DFP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
1.024 V |
25 MHz |
1 |
Bipolar |
12 |
0.0488 % |
5 V |
2's Complement Binary |
5,-5.2 V |
-5.2 V |
Flatpack |
LCC40,.5SQ,40 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-1.024 V |
Parallel, Word |
-25 °C (-13 °F) |
Track |
Dual |
93.1 ns |
R-CDFP-F40 |
0.217 in (5.515 mm) |
1.09 in (27.69 mm) |
No |
2.095 in (53.21 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Single-Slope |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
2 V |
1 |
CMOS |
5 V |
Binary |
-5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-25 °C (-13 °F) |
Tin/Lead |
Dual |
1.76 s |
R-CDIP-T28 |
0.17 in (4.32 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.397 in (35.49 mm) |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
1.024 V |
20 MHz |
1 |
Bipolar |
12 |
0.0732 % |
5 V |
Offset Binary |
5,-5.2 V |
-5.2 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-1.024 V |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Track |
Dual |
R-GDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.49 in (37.85 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
50 kHz |
1 |
Hybrid |
12 |
0.0122 % |
15 V |
Complementary Binary |
5,±15 V |
-15 V |
In-Line |
DIP28,.6 |
Other Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-5 V |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Track |
Dual |
15 µs |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Other |
Gull Wing |
68 |
QFP |
Square |
Ceramic, Metal-Sealed Cofired |
2 |
Yes |
1 V |
80 MHz |
2 |
Bipolar |
12 |
5 V |
2's Complement Binary |
±5,3.3 V |
-5 V |
Flatpack |
TPAK68,2.0SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-25 °C (-13 °F) |
Gold |
Track |
Quad |
8 ns |
S-CQFP-G68 |
0.235 in (5.97 mm) |
0.95 in (24.13 mm) |
No |
e4 |
0.95 in (24.13 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
10 V |
1 |
CMOS |
12 |
7 mA |
0.0122 % |
5 V |
Binary, Offset Binary |
-15 V |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Dual |
13.5 µs |
R-PDIP-T24 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e0 |
1.199 in (30.45 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
8 |
No |
17 V |
1 |
CMOS |
8 |
8 mA |
0.195 % |
5 V |
Binary, Offset Binary |
5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-17 V |
Parallel, 8 Bits |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-GDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
5 V |
1 |
CMOS |
12 |
0.0122 % |
5 V |
Binary |
5,-15 V |
-15 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Sample |
Dual |
13 µs |
R-GDIP-T24 |
0.225 in (5.715 mm) |
0.3 in (7.62 mm) |
No |
e0 |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Other |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
105 MHz |
1 |
CMOS |
10 |
0.2637 % |
3 V |
Offset Binary, 2's Complement Binary |
Flatpack, Low Profile, Fine Pitch |
0.02 in (0.5 mm) |
105 °C (221 °F) |
Serial |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Track |
Quad |
S-PQFP-G48 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
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Analog Devices |
Analog To Digital Converter |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic |
1 |
No |
1 |
CMOS |
10 |
Binary |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin/Lead |
Dual |
R-XDIP-T28 |
No |
e0 |
||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Other |
Pin/Peg |
32 |
Rectangular |
1 |
No |
10 V |
1 |
CMOS |
15 |
0.003 % |
15 V |
Binary, Offset Binary, 2's Complement Binary |
-15 V |
Microelectronic Assembly |
85 °C (185 °F) |
-10 V |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Sample |
50 µs |
R-XXMA-P32 |
No |
e0 |
||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Other |
Pin/Peg |
32 |
DIP |
Rectangular |
1 |
No |
10 V |
1 |
CMOS |
16 |
0.003 % |
15 V |
Binary, Offset Binary, 2's Complement Binary |
5,±15 V |
-15 V |
Microelectronic Assembly |
DIP34,1.8 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-10 V |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Sample |
50 µs |
R-XXMA-P32 |
No |
e0 |
|||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Other |
Gull Wing |
52 |
LQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
2.2 V |
40 MHz |
1 |
Bipolar |
14 |
0.0031 % |
5 V |
2's Complement Binary |
3.3,5 V |
Flatpack, Low Profile |
QFP52,.47SQ |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Track |
Quad |
S-PQFP-G52 |
3 |
0.063 in (1.6 mm) |
0.394 in (10 mm) |
No |
e0 |
240 °C (464 °F) |
0.394 in (10 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Other |
Gull Wing |
52 |
LQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
2.2 V |
40 MHz |
1 |
Bipolar |
14 |
0.0031 % |
5 V |
2's Complement Binary |
3.3,5 V |
Flatpack, Low Profile |
QFP52,.47SQ |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-25 °C (-13 °F) |
Matte Tin |
Track |
Quad |
S-PQFP-G52 |
3 |
0.063 in (1.6 mm) |
0.394 in (10 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter |
Other |
1 |
10 V |
1 |
BICMOS |
12 |
0.024 % |
Binary, Offset Binary |
5,-12 V |
DIE OR CHIP |
Analog to Digital Converters |
85 °C (185 °F) |
-25 °C (-13 °F) |
No |
||||||||||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
2 |
No |
7.3 V |
50 kHz |
1 |
CMOS |
10 |
10 mA |
0.049 % |
5 V |
Binary |
5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-300 mV |
Parallel, 8 Bits |
-25 °C (-13 °F) |
Tin Lead |
Sample |
Dual |
18.5 µs |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
4.75 V |
500 kHz |
1 |
CMOS |
16 |
0.0031 % |
5 V |
Offset Binary, 2's Complement Binary |
Flatpack, Low Profile, Fine Pitch |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-2.5 V |
Serial, Parallel, Word |
0 °C (32 °F) |
Matte Tin - annealed |
Sample |
Quad |
1.3 µs |
S-PQFP-G48 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.25 V |
285 kHz |
1 |
CMOS |
14 |
0.0061 % |
5 V |
Binary, 2's Complement Binary |
5 V |
Small Outline |
SOP24,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Track |
Dual |
3.25 µs |
R-PDSO-G24 |
3 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
30 s |
240 °C (464 °F) |
0.606 in (15.4 mm) |
|||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Other |
Pin/Peg |
46 |
QIP |
Rectangular |
Metal |
1 |
No |
1.25 V |
10.24 MHz |
1 |
Hybrid |
12 |
5 V |
2's Complement Binary |
5,-5.2 V |
-5.2 V |
In-Line |
DIP46,1.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-1.25 V |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Track |
Dual |
97 ns |
R-MDIP-P46 |
0.305 in (7.743 mm) |
1.3 in (33.02 mm) |
No |
e0 |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
20 V |
1 |
CMOS |
8 |
0.293 % |
5 V |
Binary |
5 V |
In-Line |
DIP18,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-20 V |
Parallel, 8 Bits |
-25 °C (-13 °F) |
Tin Lead |
Dual |
15 µs |
R-GDIP-T18 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic |
1 |
No |
1 |
CMOS |
10 |
Offset Binary |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin/Lead |
Dual |
R-XDIP-T28 |
No |
e0 |
||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter |
Other |
No Lead |
20 |
QCCN |
Square |
Ceramic |
1 |
Yes |
2.46 V |
1 |
CMOS |
8 |
0.39 % |
5 V |
Binary |
5 V |
Chip Carrier |
LCC20,.35SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin/Lead |
Quad |
S-XQCC-N20 |
No |
e0 |
||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
8 |
No |
17 V |
1 |
CMOS |
8 |
8 mA |
0.731 % |
5 V |
Binary, Offset Binary |
5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-17 V |
Parallel, 8 Bits |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-GDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Other |
Through-Hole |
40 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
1.024 V |
25 MHz |
1 |
Bipolar |
12 |
0.0488 % |
5 V |
2's Complement Binary |
5,-5.2 V |
-5.2 V |
In-Line |
DIP40,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-1.024 V |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Track |
Dual |
93.1 ns |
R-CDIP-T40 |
0.225 in (5.715 mm) |
0.6 in (15.24 mm) |
No |
e0 |
2.095 in (53.21 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
1 |
Hybrid |
12 |
0.0122 % |
15 V |
Binary |
5,±15 V |
-15 V |
In-Line |
DIP24,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-10 V |
Serial, Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Sample |
Dual |
50 µs |
R-CDIP-T24 |
No |
e0 |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
5 V |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary |
-12 V |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-5 V |
Parallel, Word |
-25 °C (-13 °F) |
Dual |
10.4 µs |
R-GDIP-T24 |
0.225 in (5.715 mm) |
0.3 in (7.62 mm) |
No |
|||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Other |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
1.8 V |
40 MHz |
1 |
CMOS |
12 |
3 V |
Binary |
3 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Other Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-20 °C (-4 °F) |
Matte Tin |
Sample |
Quad |
S-PQFP-G48 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e3 |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Other |
Ball |
385 |
BGA |
Square |
Plastic/Epoxy |
1 |
Yes |
1.75 V |
105 MHz |
2 |
12 |
0.0366 % |
5 V |
2's Complement Binary |
3.3,5 V |
Grid Array |
BGA385,25X25,50 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-25 °C (-13 °F) |
Track |
Bottom |
S-PBGA-B385 |
3 |
0.075 in (1.9 mm) |
1.378 in (35 mm) |
No |
225 °C (437 °F) |
1.378 in (35 mm) |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
1 |
Hybrid |
12 |
0.0122 % |
15 V |
Binary |
5,±15 V |
-15 V |
In-Line |
DIP24,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-10 V |
Serial, Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Sample |
Dual |
13 µs |
R-CDIP-T24 |
No |
e0 |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
17.3 V |
1 |
CMOS |
12 |
7.5 mA |
15 V |
Binary |
±5,15 V |
-5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-300 mV |
Parallel, 8 Bits |
-25 °C (-13 °F) |
Tin Lead |
Dual |
150 µs |
R-CDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||||
Analog Devices |
Analog To Digital Converter |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
No |
3 V |
1 |
BICMOS |
12 |
0.024 % |
5 V |
Offset Binary |
±5 V |
-5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Dual |
R-XDIP-T24 |
No |
||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
-2 V |
100 MHz |
1 |
Bipolar |
8 |
0.4688 % |
5 V |
Binary |
5,-5.2 V |
-5.2 V |
In-Line |
DIP28,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-GDIP-T28 |
0.22 in (5.59 mm) |
0.6 in (15.24 mm) |
No |
e0 |
||||||||||||||||
Analog Devices |
Analog To Digital Converter |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
1 |
CMOS |
MIL-STD-883 Class B |
12 |
0.0122 % |
5 V |
Complementary Offset Binary |
5,-15 V |
-15 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-25 °C (-13 °F) |
Sample |
Dual |
12.5 µs |
R-CDIP-T24 |
0.225 in (5.715 mm) |
0.3 in (7.62 mm) |
No |
1.29 in (32.77 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
5 V |
1 |
CMOS |
12 |
0.0122 % |
5 V |
Binary |
5,-15 V |
-15 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Sample |
Dual |
5.2 µs |
R-GDIP-T24 |
0.225 in (5.715 mm) |
0.3 in (7.62 mm) |
No |
e0 |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
1 |
Hybrid |
12 |
0.0122 % |
15 V |
Binary |
5,±15 V |
-15 V |
In-Line |
DIP24,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-5 V |
Serial, Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Sample |
Dual |
13 µs |
R-CDIP-T24 |
No |
e0 |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Other |
Flat |
40 |
DFP |
Rectangular |
1 |
Yes |
1.024 V |
20.48 MHz |
1 |
CMOS |
12 |
5 V |
2's Complement Binary |
5,-5.2 V |
-5.2 V |
Flatpack |
FL40,1.2,100 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-1.024 V |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Track |
Dual |
49 ns |
R-XDFP-F40 |
0.217 in (5.515 mm) |
1.09 in (27.69 mm) |
No |
e0 |
2.095 in (53.21 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter |
Other |
No Lead |
28 |
QCCN |
Square |
Ceramic |
1 |
Yes |
5 V |
1 |
BICMOS |
12 |
0.024 % |
Offset Binary |
5,-12/-15 V |
Chip Carrier |
LCC28,.45SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Quad |
S-XQCC-N28 |
No |
e0 |
|||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter |
Other |
Through-Hole |
40 |
DIP |
Rectangular |
Ceramic |
1 |
No |
2 V |
1 |
CMOS |
13 |
0.012 % |
Offset Binary |
±5,12 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-XDIP-T40 |
No |
e0 |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.