Other Analog-to-Digital Converters 456

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD9002AJ

Analog Devices

Analog To Digital Converter, Flash Method

Other

J Bend

28

QCCJ

Square

Ceramic, Metal-Sealed Cofired

1

Yes

0 mV

150 MHz

1

Bipolar

8

0.4688 %

Binary

-5.2 V

-5.2 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-2 V

Parallel, 8 Bits

-25 °C (-13 °F)

Gold

Quad

S-CQCC-J28

0.125 in (3.18 mm)

0.45 in (11.43 mm)

No

e4

0.45 in (11.43 mm)

AD7575BQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Track

Dual

15 µs

R-GDIP-T18

0.24 in (6.096 mm)

0.3 in (7.62 mm)

No

e0

AD9032BD

Analog Devices

Analog To Digital Converter, Flash Method

Other

Through-Hole

40

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1.024 V

25 MHz

1

Bipolar

12

0.0488 %

5 V

2's Complement Binary

5,-5.2 V

-5.2 V

In-Line

DIP40,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-1.024 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

93.1 ns

R-CDIP-T40

0.225 in (5.715 mm)

0.6 in (15.24 mm)

No

e0

2.095 in (53.21 mm)

HAS-1409LMB

Analog Devices

Analog To Digital Converter

Other

Through-Hole

40

DIP

Rectangular

Metal

1

No

10 V

1

Hybrid

MIL-STD-883 Class B (Modified)

14

0.009 %

Offset Binary, 2's Complement Binary

5,±15 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-MDIP-T40

No

e0

AD7572BQ12

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

0.0244 %

5 V

Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Sample

Dual

13 µs

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

e0

ADADC72AD

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Bipolar

16

0.006 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

50 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

5962-01-412-1607

Analog Devices

Analog To Digital Converter

Other

No Lead

28

QCCN

Square

Ceramic

Yes

5 V

1

BICMOS

12

0.024 %

Offset Binary

5,-12/-15 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Quad

S-XQCC-N28

No

MAX162BING

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

12

12 mA

0.024 %

5 V

Offset Binary, Complementary Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Dual

3.25 s

R-PDIP-T24

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

1.203 in (30.545 mm)

ICL7109IPL+

Analog Devices

Analog To Digital Converter, Dual-Slope

Other

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

3.5 V

1

CMOS

12

0.0244 %

5 V

Binary

±5 V

-5 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-3.5 V

Parallel, Word

-20 °C (-4 °F)

Matte Tin - annealed

Dual

R-PDIP-T40

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

2.05 in (52.075 mm)

ICL7109IQH+D

Analog Devices

Analog To Digital Converter, Dual-Slope

Other

J Bend

44

QCCJ

Square

Plastic/Epoxy

1

Yes

3.5 V

1

CMOS

12

0.0244 %

5 V

Binary

±5 V

-5 V

Chip Carrier

LDCC44,.7SQ

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-3.5 V

Parallel, Word

-20 °C (-4 °F)

Matte Tin - annealed

Quad

S-PQCC-J44

0.18 in (4.57 mm)

0.653 in (16.585 mm)

No

e3

0.653 in (16.585 mm)

MAX162AING

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

12

12 mA

0.012 %

5 V

Offset Binary, Complementary Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Dual

3.25 s

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

1.203 in (30.545 mm)

ICL7109IQH+TD

Analog Devices

Analog To Digital Converter, Dual-Slope

Other

J Bend

44

QCCJ

Square

Plastic/Epoxy

1

Yes

3.5 V

1

CMOS

12

0.0244 %

5 V

Binary

±5 V

-5 V

Chip Carrier

LDCC44,.7SQ

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-3.5 V

Parallel, Word

-20 °C (-4 °F)

Matte Tin - annealed

Quad

S-PQCC-J44

3

0.18 in (4.57 mm)

0.653 in (16.585 mm)

No

e3

0.653 in (16.585 mm)

MAX162CING

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

12

12 mA

0.024 %

5 V

Offset Binary, Complementary Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Dual

3.25 s

R-PDIP-T24

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

1.203 in (30.545 mm)

MAX1114AIBH

Analog Devices

Analog To Digital Converter, Flash Method

Other

J Bend

44

QCCJ

Square

Ceramic, Metal-Sealed Cofired

1

Yes

0 mV

150 MHz

1

CMOS

8

550 mA

0.293 %

Binary, 2's Complement Binary

-5.2 V

Chip Carrier

85 °C (185 °F)

-2 V

Parallel, 8 Bits

-20 °C (-4 °F)

Tin Lead

Track

Quad

S-CQCC-J44

No

e0

AD9650USVZ-105EP

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

80

HTFQFP

Square

Plastic/Epoxy

2

Yes

2.7 V

105 MHz

1

CMOS

16

0.0092 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

1.8 V

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

TQFP80,.55SQ

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-2.7 V

Serial, Parallel, Word

-55 °C (-67 °F)

Sample

Quad

50 ns

S-PQFP-G80

3

0.047 in (1.2 mm)

0.472 in (12 mm)

30 s

260 °C (500 °F)

0.472 in (12 mm)

AD5202AD

Analog Devices

Analog To Digital Converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic

1

No

10 V

1

Hybrid

12

0.012 %

Complementary Offset Binary

5,±15 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

ADADC80-10

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

10

0.048 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

21 µs

R-CDIP-T32

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

1.2 in (30.48 mm)

5962-9169005M3A

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

3

Yes

20 V

1

BIMOS

MIL-STD-883

12

0.0122 %

15 V

Binary

5,±12/±15 V

-15 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

90 °C (194 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Quad

15 µs

S-CQCC-N28

No

e0

AD9023AZ

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

28

SOP

Rectangular

Ceramic, Metal-Sealed Cofired

1

Yes

1.024 V

20 MHz

1

Bipolar

12

240 mA

0.0732 %

5 V

Offset Binary

5,-5.2 V

-5.2 V

Small Outline

SOP28,.76

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-1.024 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

R-CDSO-G28

0.5 in (12.7 mm)

No

e0

0.72 in (18.285 mm)

AD7572BE05

Analog Devices

Analog To Digital Converter

Other

No Lead

28

QCCN

Square

Ceramic

1

Yes

5 V

1

BICMOS

12

0.024 %

Offset Binary

5,-15 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Quad

S-XQCC-N28

No

e0

AD1878

Analog Devices

Analog To Digital Converter Subsystem

Other

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

3 V

1

BICMOS

16

5 V

2's Complement Binary

-5 V

In-Line

70 °C (158 °F)

-3 V

Serial

-25 °C (-13 °F)

Tin Lead

Dual

400 µs

R-PDIP-T28

No

e0

HAS-1409LM

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

125 kHz

1

Hybrid

14

0.009 %

15 V

Offset Binary, 2's Complement Binary

5,±15 V

-15 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

R-PDIP-T40

0.19 in (4.83 mm)

0.9 in (22.86 mm)

No

e0

AD7851KRZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

5.25 V

285 kHz

1

CMOS

14

0.0061 %

5 V

Binary, 2's Complement Binary

5 V

Small Outline

SOP24,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

0 mV

Serial

0 °C (32 °F)

Matte Tin

Track

Dual

3.25 µs

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

40 s

260 °C (500 °F)

0.606 in (15.4 mm)

ADC1143K

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Pin/Peg

32

DIP

Rectangular

1

No

10 V

1

16

0.003 %

15 V

Binary, Offset Binary, 2's Complement Binary

-15 V

In-Line

85 °C (185 °F)

-10 V

Serial, Parallel, Word

-25 °C (-13 °F)

Dual

100 µs

R-XDIP-P32

No

AD9027BD

Analog Devices

Analog To Digital Converter, Flash Method

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1.024 V

31 MHz

1

Bipolar

12

260 mA

0.0732 %

5 V

Offset Binary

5,-5.2 V

-5.2 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-1.024 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

R-CDIP-T28

0.284 in (7.21 mm)

0.6 in (15.24 mm)

No

e0

1.4 in (35.56 mm)

AD7891YS-2

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

44

QFP

Square

Plastic/Epoxy

8

Yes

2.5 V

500 kHz

1

CMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

5 V

Flatpack

QFP44,.57SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

105 °C (221 °F)

-2.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin/Lead

Track

Quad

1.6 µs

S-PQFP-G44

0.096 in (2.45 mm)

0.394 in (10 mm)

No

e0

30 s

220 °C (428 °F)

0.394 in (10 mm)

HAS-1202AM

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Pin/Peg

32

DIP

Rectangular

Metal

1

No

5.12 V

641 kHz

1

Hybrid

12

0.0122 %

15 V

Binary, Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5.12 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

1.56 µs

R-MDIP-P32

0.2 in (5.08 mm)

0.9 in (22.86 mm)

No

e0

1.5 in (38.1 mm)

ADC1140

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Pin/Peg

32

DIP

Square

1

No

10 V

1

Hybrid

16

0.003 %

15 V

Binary, Offset Binary, 2's Complement Binary

5,±15 V

-15 V

Microelectronic Assembly

DIP34,1.8

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

35 µs

S-XDMA-P32

No

e0

5962-01-283-6923

Analog Devices

Analog To Digital Converter

Other

Through-Hole

32

DIP

Rectangular

Ceramic

No

10 V

1

Hybrid

12

0.012 %

Offset Binary

5,±12/±15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-XDIP-T32

No

AD9213-6G

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Ball

192

HBGA

Square

Plastic/Epoxy

1

Yes

1.4 V

10250 MHz

1

12

1 V

Offset Binary, 2's Complement Binary, Gray Code

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

115 °C (239 °F)

-1.4 V

Serial

-10 °C (14 °F)

Bottom

0.975 ns

S-PBGA-B192

0.067 in (1.71 mm)

0.472 in (12 mm)

0.472 in (12 mm)

AD7772BQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

76 kHz

1

BICMOS

12

0.0244 %

5 V

Binary, Offset Binary, Comp Binary, 2's Complement Binary, Comp 2's Complement, Comp Offset Binary

5,-15 V

-15 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial

-25 °C (-13 °F)

Tin Lead

Dual

10.2 µs

R-GDIP-T20

0.197 in (5 mm)

0.3 in (7.62 mm)

No

e0

0.992 in (25.195 mm)

HAS-1202MB

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Pin/Peg

32

DIP

Rectangular

Metal

1

No

5.12 V

349 kHz

1

Hybrid

MIL-STD-883 Class B (Modified)

12

0.0122 %

15 V

Binary, Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

100 °C (212 °F)

-5.12 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

2.86 µs

R-MDIP-P32

0.2 in (5.08 mm)

0.9 in (22.86 mm)

No

e0

1.5 in (38.1 mm)

AD7851KN

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5.25 V

285 kHz

1

CMOS

14

0.0061 %

5 V

Binary, 2's Complement Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial

0 °C (32 °F)

Tin Lead

Track

Dual

3.25 µs

R-PDIP-T24

0.18 in (4.57 mm)

0.3 in (7.62 mm)

No

e0

1.165 in (29.59 mm)

ADADC85Z-122

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

12

0.0003 %

12 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

-12 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-25 °C (-13 °F)

Dual

10 µs

R-CDIP-T32

0.23 in (5.84 mm)

0.9 in (22.86 mm)

No

1.62 in (41.15 mm)

AD7888BRU

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

8

Yes

5.25 V

125 kHz

1

CMOS

12

0.0244 %

Binary

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Analog to Digital Converters

0.026 in (0.65 mm)

105 °C (221 °F)

0 mV

Serial

0 °C (32 °F)

Tin Lead

Track

Dual

7.25 µs

R-PDSO-G16

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e0

0.197 in (5 mm)

AD10401AB

Analog Devices

Analog To Digital Converter

Other

Ball

625

BGA

Square

Plastic/Epoxy

1

Yes

2

14

2's Complement Binary

3.3,5 V

Grid Array

BGA625,25X25,40

Analog to Digital Converters

0.039 in (1 mm)

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B625

No

ADC1143J

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Pin/Peg

32

DIP

Rectangular

1

No

10 V

1

16

0.006 %

15 V

Binary, Offset Binary, 2's Complement Binary

-15 V

In-Line

85 °C (185 °F)

-10 V

Serial, Parallel, Word

-25 °C (-13 °F)

Dual

70 µs

R-XDIP-P32

No

ADC912BIFW

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

CMOS

12

7 mA

0.0244 %

5 V

Binary, Offset Binary

-15 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

13.5 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7672BE03

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

2

Yes

15 V

1

CMOS

12

12 mA

0.024 %

5 V

Binary

5,-12 V

-12 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-15 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Sample

Quad

3.25 µs

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

5962-01-412-3030

Analog Devices

Analog To Digital Converter

Other

No Lead

28

QCCN

Square

Ceramic

Yes

5 V

1

BICMOS

12

0.024 %

Offset Binary

5,-12/-15 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Quad

S-XQCC-N28

No

AD9022AQ

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

1.024 V

20 MHz

1

Bipolar

12

0.0732 %

5 V

Offset Binary

5,-5.2 V

-5.2 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-1.024 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

ADADC85Z-10

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

10

0.048 %

12 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±12/±15 V

-12 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

8.4 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

AD7574ACHIPS

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

No Lead

18

DIE

1

Yes

15 V

1

CMOS

8

0.293 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

85 °C (185 °F)

-15 V

Parallel, 8 Bits

-25 °C (-13 °F)

Upper

15 µs

X-XUUC-N18

No

AD7550BQ/+

Analog Devices

Analog To Digital Converter

Other

Through-Hole

40

DIP

Rectangular

Ceramic

1

No

2 V

1

CMOS

13

0.012 %

Offset Binary

±5,12 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T40

e0

AD9026BD

Analog Devices

Analog To Digital Converter, Flash Method

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1.024 V

31 MHz

1

Bipolar

12

248 mA

0.0732 %

5 V

Offset Binary

5,-5.2 V

-5.2 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-1.024 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

R-CDIP-T28

0.284 in (7.21 mm)

0.6 in (15.24 mm)

No

e0

1.4 in (35.56 mm)

ADC910BIET

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

10

60 mA

0.0488 %

5 V

Binary

-5 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

12 µs

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD7581BQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

17 V

1

CMOS

8

8 mA

0.293 %

5 V

Binary, Offset Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-17 V

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD7574BD

Analog Devices

Analog To Digital Converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

15 V

1

CMOS

8

0.2 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.