Other Analog-to-Digital Converters 456

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD9821KST

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

1

Yes

1.8 V

40 MHz

1

CMOS

12

3 V

Binary

3 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-20 °C (-4 °F)

Tin Lead

Sample

Quad

S-PQFP-G48

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e0

0.276 in (7 mm)

AD9022BZ

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

28

SOP

Rectangular

Ceramic, Metal-Sealed Cofired

1

Yes

1.024 V

20 MHz

1

Bipolar

12

0.0732 %

5 V

Offset Binary

5,-5.2 V

-5.2 V

Small Outline

SOP28,.76

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-1.024 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

R-CDSO-G28

0.165 in (4.191 mm)

0.5 in (12.7 mm)

No

e0

0.72 in (18.29 mm)

ADC908GBC

Analog Devices

Analog To Digital Converter

Other

1

10 V

1

CMOS

MIL-STD-883 Class B (Modified)

8

0.29 %

5 V

Binary

5 V

DIE OR CHIP

Analog to Digital Converters

25 °C (77 °F)

25 °C (77 °F)

No

AD7572CE12

Analog Devices

Analog To Digital Converter

Other

No Lead

28

QCCN

Square

Ceramic

1

Yes

5 V

1

BICMOS

12

0.018 %

Offset Binary

5,-15 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Quad

S-XQCC-N28

No

e0

AD7576AQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.46 V

1

CMOS

MIL-M-38510

8

0.3906 %

5 V

Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Sample

Dual

20 µs

R-GDIP-T18

0.24 in (6.096 mm)

0.3 in (7.62 mm)

No

e0

AD7856KR-REEL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

8

Yes

5.25 V

285 kHz

1

CMOS

14

0.0122 %

5 V

Binary

5 V

Small Outline

SOP24,.4

Analog to Digital Converters

0.05 in (1.27 mm)

105 °C (221 °F)

0 mV

Serial

0 °C (32 °F)

Tin Lead

Track

Dual

5.25 µs

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

240 °C (464 °F)

0.606 in (15.4 mm)

AD6645JSQ-105

Analog Devices

Analog To Digital Converter

Other

Gull Wing

52

QFP

Square

Plastic/Epoxy

1

Yes

5 V

1

Bipolar

14

2's Complement Binary

3.3,5 V

Flatpack

QFP52,.47SQ

Analog to Digital Converters

0.025 in (0.635 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQFP-G52

No

e0

AD9003SM/883B

Analog Devices

Analog To Digital Converter

Other

Through-Hole

40

DIP

Rectangular

Metal

1

No

2.5 V

1

38535Q/M;38534H;883B

12

0.049 %

Complementary Binary, Complementary Offset Binary

5,±15 V

In-Line

DIP40,.9

Analog to Digital Converters

0.1 in (2.54 mm)

100 °C (212 °F)

Parallel, Word

-25 °C (-13 °F)

Tin/Lead

Dual

R-MDIP-T40

No

e0

AD9034BZ

Analog Devices

Analog To Digital Converter, Flash Method

Other

Flat

40

DFP

Rectangular

1

Yes

1.024 V

20.48 MHz

1

CMOS

12

5 V

2's Complement Binary

5,-5.2 V

-5.2 V

Flatpack

FL40,1.2,100

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-1.024 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

49 ns

R-XDFP-F40

0.217 in (5.515 mm)

1.09 in (27.69 mm)

No

e0

2.095 in (53.21 mm)

AD7856KR

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

8

Yes

5.25 V

285 kHz

1

CMOS

14

0.0122 %

5 V

Binary

5 V

Small Outline

SOP24,.4

Analog to Digital Converters

0.05 in (1.27 mm)

105 °C (221 °F)

0 mV

Serial

0 °C (32 °F)

Tin Lead

Track

Dual

5.25 µs

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

240 °C (464 °F)

0.606 in (15.4 mm)

5962-9169005M3X

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

3

Yes

1

BIMOS

12

0.0122 %

15 V

Binary

-15 V

Chip Carrier

90 °C (194 °F)

Parallel, Word

-55 °C (-67 °F)

Quad

15 µs

S-CQCC-N28

No

AD369AD

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

50 kHz

1

Hybrid

12

0.0183 %

15 V

Complementary Binary

5,±15 V

-15 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

15 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD9007BM

Analog Devices

Analog To Digital Converter, Flash Method

Other

Pin/Peg

46

QIP

Rectangular

Metal

1

No

1.25 V

10.24 MHz

1

Hybrid

12

5 V

2's Complement Binary

5,-5.2 V

-5.2 V

In-Line

DIP46,1.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-1.25 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

97 ns

R-MDIP-P46

0.305 in (7.743 mm)

1.3 in (33.02 mm)

No

e0

AD7576AQ/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Sample

Dual

30 µs

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

ADC912BIFS

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

1

CMOS

12

7 mA

0.0244 %

5 V

Binary, Offset Binary

-15 V

Small Outline

0.05 in (1.27 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

13.5 µs

R-PDSO-G24

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.606 in (15.4 mm)

AD9821KSTRL

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

1

Yes

1.8 V

40 MHz

1

12

3 V

Binary

Flatpack, Low Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-20 °C (-4 °F)

Tin Lead

Sample

Quad

S-PQFP-G48

3

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e0

240 °C (464 °F)

0.276 in (7 mm)

AD5240BD

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

12

100 mA

0.012 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

5 µs

R-CDIP-T32

0.28 in (7.11 mm)

0.9 in (22.86 mm)

No

e0

AD7550BD/+

Analog Devices

Analog To Digital Converter

Other

Through-Hole

40

DIP

Rectangular

Ceramic

1

No

2 V

1

CMOS

13

0.012 %

Offset Binary

±5,12 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T40

e0

AD7672BQ10

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

15 V

1

CMOS

12

12 mA

0.024 %

5 V

Binary

5,-12 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-15 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Sample

Dual

10.4 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD9012BP

Analog Devices

Analog To Digital Converter, Flash Method

Other

J Bend

28

QCCJ

Square

Plastic/Epoxy

1

Yes

500 mV

100 MHz

1

Bipolar

8

179 mA

0.195 %

5 V

Binary

5,-5.2 V

-5.2 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-6 V

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Quad

13 ns

S-PQCC-J28

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

0.453 in (11.5062 mm)

AD7550BD

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Through-Hole

40

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

2 V

1

CMOS

13

0.012 %

5 V

2's Complement Binary

±5,12 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T40

0.15 in (3.81 mm)

0.6 in (15.24 mm)

No

e0

2 in (50.8 mm)

AD7575AQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Track

Dual

15 µs

R-GDIP-T18

0.24 in (6.096 mm)

0.3 in (7.62 mm)

No

e0

ADC912FW

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

CMOS

12

7 mA

0.0244 %

5 V

Binary, Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

13.5 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

ADC912AGBC

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

No Lead

24

DIE

Rectangular

1

Yes

15 V

1

CMOS

12

7 mA

0.024 %

5 V

Offset Binary

5,-12/-15 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

25 °C (77 °F)

-15 V

Parallel, Word

25 °C (77 °F)

Tin Lead

Upper

11.2 µs

R-XUUC-N24

No

e0

HAS-1409KM

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

125 kHz

1

Hybrid

14

0.009 %

15 V

Offset Binary, 2's Complement Binary

5,±15 V

-15 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

R-PDIP-T40

0.19 in (4.83 mm)

0.9 in (22.86 mm)

No

e0

AD9012AN

Analog Devices

Analog To Digital Converter, Flash Method

Other

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

500 mV

100 MHz

1

Bipolar

8

179 mA

0.39 %

5 V

Binary

5,-5.2 V

-5.2 V

In-Line

DIP28,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-6 V

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Dual

13 ns

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

1.472 in (37.4 mm)

AD7576ACHIPS

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

No Lead

18

DIE

1

Yes

2.46 V

1

CMOS

8

5 V

Binary

Uncased Chip

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Upper

20 µs

X-XUUC-N18

No

e0

AD9012BN

Analog Devices

Analog To Digital Converter, Flash Method

Other

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

500 mV

100 MHz

1

Bipolar

8

179 mA

0.195 %

5 V

Binary

5,-5.2 V

-5.2 V

In-Line

DIP28,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-6 V

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Dual

13 ns

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

1.472 in (37.4 mm)

AD9040AAQ

Analog Devices

Analog To Digital Converter

Other

Through-Hole

28

DIP

Rectangular

Ceramic

1

No

0 mV

1

BICMOS

10

0.24 %

5 V

Offset Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

AD7891YP-1REEL

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

J Bend

44

QCCJ

Square

Plastic/Epoxy

8

Yes

10 V

454.5 kHz

1

CMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

5 V

Chip Carrier

LDCC44,.7SQ

Analog to Digital Converters

0.05 in (1.27 mm)

105 °C (221 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Quad

1.6 µs

S-PQCC-J44

0.18 in (4.57 mm)

0.653 in (16.585 mm)

No

e0

0.653 in (16.585 mm)

AD9240ASRL

Analog Devices

Analog To Digital Converter, Flash Method

Other

Gull Wing

44

QFP

Square

1

Yes

5.25 V

10 MHz

1

CMOS

14

5 V

Binary

5 V

Flatpack

QFP44,.5SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Quad

S-XQFP-G44

3

0.096 in (2.45 mm)

0.394 in (10 mm)

No

e0

240 °C (464 °F)

0.394 in (10 mm)

AD7891YS-2REEL

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

44

QFP

Square

Plastic/Epoxy

8

Yes

2.5 V

500 kHz

1

CMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

5 V

Flatpack

QFP44,.57SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

105 °C (221 °F)

-2.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Quad

1.6 µs

S-PQFP-G44

0.096 in (2.45 mm)

0.394 in (10 mm)

No

e0

0.394 in (10 mm)

AD9034AD

Analog Devices

Analog To Digital Converter, Flash Method

Other

Through-Hole

40

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1.024 V

20.48 MHz

1

CMOS

12

5 V

2's Complement Binary

5,-5.2 V

-5.2 V

In-Line

DIP40,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-1.024 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

49 ns

R-CDIP-T40

0.225 in (5.715 mm)

0.6 in (15.24 mm)

No

e0

2.095 in (53.21 mm)

ADC7672CQ05

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

0.0244 %

5 V

Binary

-12 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-25 °C (-13 °F)

Dual

5.2 µs

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

AD7576BQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.46 V

1

CMOS

MIL-M-38510

8

0.1953 %

5 V

Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Dual

20 µs

R-GDIP-T18

0.24 in (6.096 mm)

0.3 in (7.62 mm)

No

e0

AD7856KR-REEL

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

8

Yes

5.25 V

285 kHz

1

CMOS

14

0.0122 %

5 V

Binary

5 V

Small Outline

SOP24,.4

Analog to Digital Converters

0.05 in (1.27 mm)

105 °C (221 °F)

0 mV

Serial

0 °C (32 °F)

Tin Lead

Track

Dual

5.25 µs

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

240 °C (464 °F)

0.606 in (15.4 mm)

AD5205BD

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

12

0.0122 %

15 V

Binary

5,±15 V

-15 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Sample

Dual

50 µs

R-CDIP-T24

No

e0

AD7691SRMZ-EP-RL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

1

Yes

5.55 V

250 kHz

1

18

0.0008 %

5 V

2's Complement Binary

2.5/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Analog to Digital Converters

0.02 in (0.5 mm)

105 °C (221 °F)

-500 mV

Serial

-55 °C (-67 °F)

Matte Tin

Dual

3.7 µs

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

AD5240BD/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

38535Q/M;38534H;883B

12

100 mA

0.012 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

5 µs

R-CDIP-T32

0.28 in (7.11 mm)

0.9 in (22.86 mm)

No

e0

AD7851KR-REEL

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

5.25 V

285 kHz

1

CMOS

14

0.0061 %

5 V

Binary, 2's Complement Binary

5 V

Small Outline

SOP24,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

0 mV

Serial

0 °C (32 °F)

Tin Lead

Track

Dual

3.25 µs

R-PDSO-G24

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.606 in (15.4 mm)

AD1885

Analog Devices

Analog To Digital Converter Subsystem

Other

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1

Yes

3 V

1

CMOS

16

5 V

2's Complement Binary

-5 V

Small Outline

70 °C (158 °F)

-3 V

Serial

-25 °C (-13 °F)

Dual

R-PDSO-G28

No

ADC85-10

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

10

140 mA

0.048 %

15 V

Complementary Offset Binary, Complementary Binary

-15 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

8.4 µs

R-CDIP-T32

0.23 in (5.84 mm)

0.9 in (22.86 mm)

No

e0

1.612 in (40.945 mm)

HAS-1204BM

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Pin/Peg

40

DIP

Rectangular

Metal

1

No

5 V

500 kHz

1

Hybrid

12

177 mA

15 V

Complementary Binary, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP40,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Serial, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

2 µs

R-MDIP-P40

0.19 in (4.83 mm)

0.9 in (22.86 mm)

No

e0

AD7878BQ

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

3 V

8.3 kHz

1

CMOS

12

5 V

Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-3 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

7.125 µs

R-GDIP-T28

0.22 in (5.59 mm)

0.6 in (15.24 mm)

No

e0

AD1878JD

Analog Devices

Analog To Digital Converter, Delta-Sigma

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

5.985 V

1

BICMOS

16

5 V

2's Complement Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5.985 V

Serial

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD5215BD/883B

Analog Devices

Analog To Digital Converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic

1

No

10 V

1

Hybrid

38535Q/M;38534H;883B

12

0.012 %

Complementary Offset Binary

5,±15 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

AD572AD

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

12

0.012 %

15 V

Binary, Offset Binary, 2's Complement Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial, Parallel, Word

-25 °C (-13 °F)

Gold

Dual

25 µs

R-CDIP-T32

0.28 in (7.11 mm)

0.9 in (22.86 mm)

No

e4

AD7672CQ05

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

15 V

1

CMOS

12

12 mA

0.012 %

5 V

Binary

5,-12 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-15 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Sample

Dual

5.2 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.