Other Analog-to-Digital Converters 456

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD5204AD

Analog Devices

Analog To Digital Converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic

1

No

5 V

1

Hybrid

12

0.012 %

Complementary Offset Binary

5,±15 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

AD9254R703F

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Flat

52

QFF

Square

Ceramic, Metal-Sealed Cofired

1

Yes

6 V

150 MHz

1

CMOS

MIL-PRF-38535

14

0.0366 %

1.8 V

Offset Binary, 2's Complement Binary

1.8,2.5 V

Flatpack

QFL52(UNSPEC)

Analog to Digital Converters

0.025 in (0.635 mm)

110 °C (230 °F)

200 mV

Serial

-55 °C (-67 °F)

Gold

Sample

Quad

6.6 ns

S-CQFP-F52

0.093 in (2.365 mm)

0.394 in (10 mm)

No

e4

0.394 in (10 mm)

AD6644AST-65

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

52

LQFP

Square

Plastic/Epoxy

1

Yes

2.2 V

65 MHz

1

Bipolar

14

0.0031 %

5 V

2's Complement Binary

3.3,5 V

Flatpack, Low Profile

QFP52,.47SQ

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Quad

S-PQFP-G52

3

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e0

240 °C (464 °F)

0.394 in (10 mm)

AD7570L

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1

CMOS

10

0.0977 %

15 V

Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

Serial, Parallel, Word

-25 °C (-13 °F)

Dual

120 µs

R-CDIP-T28

0.6 in (15.24 mm)

No

1.397 in (35.49 mm)

AD13280AZ

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

68

QFP

Square

Ceramic, Metal-Sealed Cofired

2

Yes

1 V

80 MHz

2

Bipolar

12

5 V

2's Complement Binary

±5,3.3 V

-5 V

Flatpack

QFP68,1.2SQ,50

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-25 °C (-13 °F)

Track

Quad

8 ns

S-CQFP-G68

0.235 in (5.97 mm)

0.95 in (24.13 mm)

No

30 s

220 °C (428 °F)

0.95 in (24.13 mm)

AD7870CQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

3 V

1

CMOS

12

0.0122 %

5 V

Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-3 V

Serial, Parallel, 8 Bits, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

9 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

ADC912BIFP

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

1

CMOS

12

7 mA

0.0244 %

5 V

Binary, Offset Binary

-15 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

13.5 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.199 in (30.45 mm)

AD5205AD

Analog Devices

Analog To Digital Converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic

1

No

10 V

1

Hybrid

12

0.012 %

Complementary Offset Binary

5,±15 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

AD7570J

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1

CMOS

10

0.0977 %

15 V

Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

Serial, Parallel, Word

-25 °C (-13 °F)

Dual

40 µs

R-CDIP-T28

0.6 in (15.24 mm)

No

1.397 in (35.49 mm)

AD9023BQ

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

1.024 V

20 MHz

1

Bipolar

12

240 mA

0.0732 %

5 V

Offset Binary

5,-5.2 V

-5.2 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-1.024 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD7672BQ05

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

15 V

1

CMOS

12

12 mA

0.024 %

5 V

Binary

5,-12 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-15 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Sample

Dual

5.2 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD9012BJ

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

J Bend

28

QCCJ

Square

Ceramic, Metal-Sealed Cofired

1

Yes

-2 V

100 MHz

1

Bipolar

8

0.4688 %

5 V

Binary

5,-5.2 V

-5.2 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Quad

S-CQCC-J28

0.171 in (4.34 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

AD9483KS-140

Analog Devices

Analog To Digital Converter, Flash Method

Other

Gull Wing

100

HQFP

Rectangular

Plastic/Epoxy

3

Yes

512 mV

140 MHz

1

BICMOS

8

0.6836 %

5 V

Binary

3.3/5 V

Flatpack, Heat Sink/Slug

QFP100,.7X.9

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

-512 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Quad

R-PQFP-G100

5

0.134 in (3.4 mm)

0.551 in (14 mm)

No

e0

225 °C (437 °F)

0.787 in (20 mm)

AD13465AZ

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

68

QFP

Square

Ceramic, Metal-Sealed Cofired

1

Yes

1 V

65 MHz

2

Bipolar

14

5 V

2's Complement Binary

±5,3.3 V

-5 V

Flatpack

LDCC68,1.0SQ

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Quad

S-CQFP-G68

0.235 in (5.97 mm)

0.95 in (24.13 mm)

No

e0

0.95 in (24.13 mm)

HAS1204SMB

Analog Devices

Analog To Digital Converter

Other

Through-Hole

40

DIP

Rectangular

Metal

1

No

5 V

1

Bipolar

MIL-STD-883 Class B (Modified)

12

Complementary Binary, Complementary Offset Binary

5,±15 V

In-Line

DIP40,.9

Analog to Digital Converters

0.1 in (2.54 mm)

100 °C (212 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-MDIP-T40

No

e0

ADC72BD

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

29 kHz

1

16

0.003 %

15 V

Complementary Offset Binary, Complementary Binary

-15 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

50 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

AD7583KN

Analog Devices

Analog To Digital Converter, Multi-Slope

Other

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

9

No

1

CMOS

8

12 V

Binary

In-Line

85 °C (185 °F)

Parallel, 8 Bits

-25 °C (-13 °F)

Dual

4 ms

R-PDIP-T40

No

AD9821KSTZRL7

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

1

Yes

1.8 V

40 MHz

1

CMOS

12

3 V

Binary

3 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-20 °C (-4 °F)

Matte Tin

Sample

Quad

S-PQFP-G48

3

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e3

260 °C (500 °F)

0.276 in (7 mm)

PM7574GBC

Analog Devices

Analog To Digital Converter

Other

1

10 V

1

CMOS

MIL-STD-883 Class B (Modified)

8

0.29 %

5 V

Offset Binary

5 V

DIE OR CHIP

Analog to Digital Converters

25 °C (77 °F)

25 °C (77 °F)

No

AD369AM

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

28

DIP

Rectangular

Metal

1

No

5 V

50 kHz

1

Hybrid

12

0.0183 %

15 V

Complementary Binary

5,±15 V

-15 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

15 µs

R-MDIP-T28

0.205 in (5.21 mm)

0.6 in (15.24 mm)

No

e0

1.57 in (39.88 mm)

AD5215BD

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

12

0.0122 %

15 V

Binary

5,±15 V

-15 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Sample

Dual

13 µs

R-CDIP-T24

No

e0

AD280BS

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

44

QFP

Square

Plastic/Epoxy

4

Yes

3.5 V

1

24

0.003 %

5 V

2's Complement Binary

5 V

-5 V

Flatpack

QFP44,.5SQ,32

Other Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-3.5 V

Serial

-25 °C (-13 °F)

Tin Lead

Quad

200 ms

S-PQFP-G44

0.096 in (2.45 mm)

0.394 in (10 mm)

No

e0

0.394 in (10 mm)

AD9026AD

Analog Devices

Analog To Digital Converter, Flash Method

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1.024 V

31 MHz

1

Bipolar

12

248 mA

0.0732 %

5 V

Offset Binary

5,-5.2 V

-5.2 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-1.024 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

R-CDIP-T28

0.284 in (7.21 mm)

0.6 in (15.24 mm)

No

e0

1.4 in (35.56 mm)

AD7574BD/883B

Analog Devices

Analog To Digital Converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

15 V

1

CMOS

38535Q/M;38534H;883B

8

0.2 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

AD9023AQ

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

1.024 V

20 MHz

1

Bipolar

12

240 mA

0.0732 %

5 V

Offset Binary

5,-5.2 V

-5.2 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-1.024 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

ADADC85-10

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

10

0.048 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

8.4 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

AD9002AD

Analog Devices

Analog To Digital Converter, Flash Method

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

0 mV

150 MHz

1

Bipolar

8

0.4688 %

Binary

-5.2 V

-5.2 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-2 V

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD7582BD

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

4

No

5 V

1

CMOS

12

7.5 mA

0.024 %

15 V

Binary

±5,15 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Dual

150 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD5201BD

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

Hybrid

12

0.0122 %

15 V

Binary

5,±15 V

-15 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Serial, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Sample

Dual

50 µs

R-CDIP-T24

No

e0

AD7870BQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

3 V

1

CMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-3 V

Serial, Parallel, 8 Bits, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

9 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD572BD

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

12

0.012 %

15 V

Binary, Offset Binary, 2's Complement Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

25 µs

R-CDIP-T32

0.28 in (7.11 mm)

0.9 in (22.86 mm)

No

e0

HAS-1202AMB

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Pin/Peg

32

DIP

Rectangular

Metal

1

No

5.12 V

641 kHz

1

Hybrid

MIL-STD-883 Class B (Modified)

12

0.0122 %

15 V

Binary, Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

100 °C (212 °F)

-5.12 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

1.56 µs

R-MDIP-P32

0.2 in (5.08 mm)

0.9 in (22.86 mm)

No

e0

1.5 in (38.1 mm)

HAS-1202M

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Pin/Peg

32

DIP

Rectangular

Metal

1

No

5.12 V

349 kHz

1

Hybrid

12

0.0122 %

15 V

Binary, Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5.12 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

2.86 µs

R-MDIP-P32

0.2 in (5.08 mm)

0.9 in (22.86 mm)

No

e0

1.5 in (38.1 mm)

ADC7672BQ03

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

0.0244 %

5 V

Binary

-12 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-25 °C (-13 °F)

Dual

3.25 µs

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

AD7870AQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

3 V

1

CMOS

12

5 V

Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-3 V

Serial, Parallel, 8 Bits, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

9 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7851KRZ-REEL

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

5.25 V

285 kHz

1

CMOS

14

0.0061 %

5 V

Binary, 2's Complement Binary

5 V

Small Outline

SOP24,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

0 mV

Serial

0 °C (32 °F)

Matte Tin

Track

Dual

3.25 µs

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

260 °C (500 °F)

0.606 in (15.4 mm)

AD9050JR

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1

Yes

1 V

40 MHz

1

BICMOS

10

5 V

Offset Binary

5 V

Small Outline

SOP28,.45

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

R-PDSO-G28

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.705 in (17.9 mm)

HAS-1201SMB

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Through-Hole

46

DIP

Rectangular

1

No

15 V

1 MHz

1

Hybrid

MIL-STD-883 Class B (Modified)

12

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,-5.2,±15 V

-15 V

In-Line

DIP46,1.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-15 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

1 µs

R-XDIP-T46

0.231 in (5.86 mm)

1.3 in (33.02 mm)

No

e0

AD9002BP

Analog Devices

Analog To Digital Converter, Flash Method

Other

J Bend

28

QCCJ

Square

Plastic/Epoxy

1

Yes

500 mV

150 MHz

1

Bipolar

8

175 mA

0.195 %

Binary

-5.2 V

-5.2 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-6 V

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Quad

8 ns

S-PQCC-J28

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

0.453 in (11.5062 mm)

AD7888BRU-REEL

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

8

Yes

5.25 V

125 kHz

1

CMOS

12

0.0244 %

Binary

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Analog to Digital Converters

0.026 in (0.65 mm)

105 °C (221 °F)

0 mV

Serial

0 °C (32 °F)

Tin Lead

Track

Dual

7.25 µs

R-PDSO-G16

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e0

0.197 in (5 mm)

AD7772CQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

76 kHz

1

BICMOS

12

0.0122 %

5 V

Binary, Offset Binary, Comp Binary, 2's Complement Binary, Comp 2's Complement, Comp Offset Binary

5,-15 V

-15 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial

-25 °C (-13 °F)

Tin Lead

Dual

10.2 µs

R-GDIP-T20

0.197 in (5 mm)

0.3 in (7.62 mm)

No

e0

0.992 in (25.195 mm)

AD7672BQ03

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

15 V

1

CMOS

12

12 mA

0.024 %

5 V

Binary

5,-12 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-15 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Sample

Dual

3.25 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD10226AB

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Ball

385

BGA

Square

Plastic/Epoxy

1

Yes

1.84 V

125 MHz

2

12

0.0317 %

5 V

Offset Binary, 2's Complement Binary

3.3,5 V

Grid Array

BGA385,25X25,50

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-25 °C (-13 °F)

Track

Bottom

S-PBGA-B385

3

0.075 in (1.9 mm)

1.378 in (35 mm)

No

225 °C (437 °F)

1.378 in (35 mm)

AD7574AD/883B

Analog Devices

Analog To Digital Converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

15 V

1

CMOS

38535Q/M;38534H;883B

8

0.3 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

ADC80Z12

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

12

0.012 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

-15 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-25 °C (-13 °F)

Sample

Dual

25 µs

R-CDIP-T32

0.28 in (7.11 mm)

0.6 in (15.24 mm)

1.2 in (30.48 mm)

AD7572BQ05/883B

Analog Devices

Analog To Digital Converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

CMOS

MIL-STD-883 Class B

12

0.0244 %

5 V

Complementary Offset Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-25 °C (-13 °F)

Sample

Dual

5 µs

R-CDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

1.29 in (32.77 mm)

AD7878AQ

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

3 V

8.3 kHz

1

CMOS

12

5 V

Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-3 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

7.125 µs

R-GDIP-T28

0.22 in (5.59 mm)

0.6 in (15.24 mm)

No

e0

AD7572BQ12/883B

Analog Devices

Analog To Digital Converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

CMOS

MIL-STD-883 Class B

12

0.0244 %

5 V

Complementary Offset Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-25 °C (-13 °F)

Sample

Dual

12.5 µs

R-CDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

1.29 in (32.77 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.