Other Analog-to-Digital Converters 456

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD579BD

Analog Devices

Analog To Digital Converter

Other

Through-Hole

32

DIP

Rectangular

Ceramic

1

No

20 V

1

Hybrid

10

Binary, Complementary Binary, Offset 2's Complement, Offset Binary, Complementary Offset Binary, 2's Complement

5,±15 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T32

No

e0

AD7575BCHIPS

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

No Lead

18

DIE

1

Yes

2.46 V

1

CMOS

8

0.1953 %

5 V

Offset Binary

Uncased Chip

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Track

Upper

15 µs

X-XUUC-N18

No

ADADC72AM

Analog Devices

Analog To Digital Converter

Other

Through-Hole

32

DIP

Rectangular

Metal

1

No

20 V

1

Bipolar

16

0.006 %

Offset Binary

5,±15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-MDIP-T32

No

e0

AD7572CQ05/883B

Analog Devices

Analog To Digital Converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

CMOS

MIL-STD-883 Class B

12

0.0122 %

5 V

Complementary Offset Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-25 °C (-13 °F)

Sample

Dual

5 µs

R-CDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

1.29 in (32.77 mm)

HAS-1204SM

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Pin/Peg

40

DIP

Rectangular

Metal

1

No

5 V

500 kHz

1

Hybrid

12

177 mA

15 V

Complementary Binary, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP40,.9

Analog to Digital Converters

0.1 in (2.54 mm)

100 °C (212 °F)

-5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

2 µs

R-MDIP-P40

0.19 in (4.83 mm)

0.9 in (22.86 mm)

No

e0

AD5211BD/883B

Analog Devices

Analog To Digital Converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic

1

No

5 V

1

Hybrid

38535Q/M;38534H;883B

12

0.012 %

Complementary Offset Binary

5,±15 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

LC89086

Onsemi

Analog To Digital Converter

Other

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

Bipolar

8

0.19 %

5 V

Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-30 °C (-22 °F)

Dual

R-PDIP-T24

No

TSA1005-40IF

STMicroelectronics

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

2

Yes

2.8 V

40 MHz

1

CMOS

10

0.07 %

2.5 V

Binary

2.5 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

1.1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Quad

S-PQFP-G48

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e0

0.276 in (7 mm)

TSA1005I-40IF

STMicroelectronics

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

2

Yes

2.8 V

40 MHz

1

CMOS

10

0.07 %

2.5 V

Binary

2.5 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

1.1 V

Parallel, Word

0 °C (32 °F)

Nickel Palladium Gold

Track

Quad

S-PQFP-G48

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e4

0.276 in (7 mm)

TSA1005-40IFT

STMicroelectronics

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

2

Yes

2.8 V

40 MHz

1

CMOS

10

0.07 %

2.5 V

Binary

2.5 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

1.1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Quad

S-PQFP-G48

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e0

0.276 in (7 mm)

TDA8765H/5

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

44

QFP

Square

Plastic/Epoxy

1

Yes

55 MHz

1

Bipolar

10

0.1709 %

5 V

Binary, 2's Complement Binary

3.3,5 V

Flatpack

QFP44,.5SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

Parallel, Word

0 °C (32 °F)

Sample

Quad

S-PQFP-G44

0.083 in (2.1 mm)

0.394 in (10 mm)

No

0.394 in (10 mm)

935260347518

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

44

QFP

Square

Plastic/Epoxy

1

Yes

40 MHz

1

10

0.1709 %

5 V

Binary, 2's Complement Binary

Flatpack

0.031 in (0.8 mm)

85 °C (185 °F)

Parallel, Word

0 °C (32 °F)

Sample

Quad

S-PQFP-G44

0.083 in (2.1 mm)

0.394 in (10 mm)

No

0.394 in (10 mm)

TDA8765H/5B-S

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

44

QFP

Square

Plastic/Epoxy

1

Yes

55 MHz

1

10

0.1709 %

5 V

Binary, 2's Complement Binary

Flatpack

0.031 in (0.8 mm)

85 °C (185 °F)

Parallel, Word

0 °C (32 °F)

Sample

Quad

S-PQFP-G44

0.083 in (2.1 mm)

0.394 in (10 mm)

No

0.394 in (10 mm)

TDA8765H/4B-S

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

44

QFP

Square

Plastic/Epoxy

1

Yes

40 MHz

1

10

0.1709 %

5 V

Binary, 2's Complement Binary

Flatpack

0.031 in (0.8 mm)

85 °C (185 °F)

Parallel, Word

0 °C (32 °F)

Sample

Quad

S-PQFP-G44

0.083 in (2.1 mm)

0.394 in (10 mm)

No

0.394 in (10 mm)

935260348518

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

44

QFP

Square

Plastic/Epoxy

1

Yes

55 MHz

1

10

0.1709 %

5 V

Binary, 2's Complement Binary

Flatpack

0.031 in (0.8 mm)

85 °C (185 °F)

Parallel, Word

0 °C (32 °F)

Sample

Quad

S-PQFP-G44

0.083 in (2.1 mm)

0.394 in (10 mm)

No

0.394 in (10 mm)

TDA8765H/4B

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

44

QFP

Square

Plastic/Epoxy

1

Yes

40 MHz

1

10

0.1709 %

5 V

Binary, 2's Complement Binary

Flatpack

0.031 in (0.8 mm)

85 °C (185 °F)

Parallel, Word

0 °C (32 °F)

Sample

Quad

S-PQFP-G44

0.083 in (2.1 mm)

0.394 in (10 mm)

No

0.394 in (10 mm)

935260348557

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

44

QFP

Square

Plastic/Epoxy

1

Yes

55 MHz

1

10

0.1709 %

5 V

Binary, 2's Complement Binary

Flatpack

0.031 in (0.8 mm)

85 °C (185 °F)

Parallel, Word

0 °C (32 °F)

Sample

Quad

S-PQFP-G44

0.083 in (2.1 mm)

0.394 in (10 mm)

No

0.394 in (10 mm)

935260348551

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

44

QFP

Square

Plastic/Epoxy

1

Yes

55 MHz

1

10

0.1709 %

5 V

Binary, 2's Complement Binary

Flatpack

0.031 in (0.8 mm)

85 °C (185 °F)

Parallel, Word

0 °C (32 °F)

Sample

Quad

S-PQFP-G44

0.083 in (2.1 mm)

0.394 in (10 mm)

No

0.394 in (10 mm)

TDA8765H/5B

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

44

QFP

Square

Plastic/Epoxy

1

Yes

55 MHz

1

10

0.1709 %

5 V

Binary, 2's Complement Binary

Flatpack

0.031 in (0.8 mm)

85 °C (185 °F)

Parallel, Word

0 °C (32 °F)

Sample

Quad

S-PQFP-G44

0.083 in (2.1 mm)

0.394 in (10 mm)

No

0.394 in (10 mm)

935260347557

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

44

QFP

Square

Plastic/Epoxy

1

Yes

40 MHz

1

10

0.1709 %

5 V

Binary, 2's Complement Binary

Flatpack

0.031 in (0.8 mm)

85 °C (185 °F)

Parallel, Word

0 °C (32 °F)

Sample

Quad

S-PQFP-G44

0.083 in (2.1 mm)

0.394 in (10 mm)

No

0.394 in (10 mm)

935260347551

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

44

QFP

Square

Plastic/Epoxy

1

Yes

40 MHz

1

10

0.1709 %

5 V

Binary, 2's Complement Binary

Flatpack

0.031 in (0.8 mm)

85 °C (185 °F)

Parallel, Word

0 °C (32 °F)

Sample

Quad

S-PQFP-G44

0.083 in (2.1 mm)

0.394 in (10 mm)

No

0.394 in (10 mm)

TDA8765H/5/C1

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

44

QFP

Square

Plastic/Epoxy

1

Yes

55 MHz

1

10

0.1709 %

5 V

Binary, 2's Complement Binary

Flatpack

0.031 in (0.8 mm)

85 °C (185 °F)

Parallel, Word

0 °C (32 °F)

Sample

Quad

S-PQFP-G44

0.083 in (2.1 mm)

0.394 in (10 mm)

No

0.394 in (10 mm)

TDA8765H/4/C1

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

44

QFP

Square

Plastic/Epoxy

1

Yes

40 MHz

1

10

0.1709 %

5 V

Binary, 2's Complement Binary

Flatpack

0.031 in (0.8 mm)

85 °C (185 °F)

Parallel, Word

0 °C (32 °F)

Sample

Quad

S-PQFP-G44

0.083 in (2.1 mm)

0.394 in (10 mm)

No

0.394 in (10 mm)

TDA8768H/5

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

44

QFP

Square

Plastic/Epoxy

1

Yes

2 V

4.58 MHz

1

Bipolar

12

0.1099 %

5 V

Binary, 2's Complement Binary

3.3/5,5 V

Flatpack

QFP44,.5SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

Parallel, Word

-20 °C (-4 °F)

Tin

Sample

Quad

S-PQFP-G44

0.083 in (2.1 mm)

0.394 in (10 mm)

No

e3

0.394 in (10 mm)

TDA8765H/4

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

44

QFP

Square

Plastic/Epoxy

1

Yes

40 MHz

1

Bipolar

10

0.1709 %

5 V

Binary, 2's Complement Binary

3.3,5 V

Flatpack

QFP44,.5SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

Parallel, Word

0 °C (32 °F)

Sample

Quad

S-PQFP-G44

0.083 in (2.1 mm)

0.394 in (10 mm)

No

0.394 in (10 mm)

TDA8768H/4

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

44

QFP

Square

Plastic/Epoxy

1

Yes

2 V

3.333 MHz

1

Bipolar

12

0.1099 %

5 V

Binary, 2's Complement Binary

3.3/5,5 V

Flatpack

QFP44,.5SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

Parallel, Word

-20 °C (-4 °F)

Tin

Sample

Quad

S-PQFP-G44

0.083 in (2.1 mm)

0.394 in (10 mm)

No

e3

0.394 in (10 mm)

SDA8200

Infineon Technologies

Analog To Digital Converter

Other

Through-Hole

40

DIP

Rectangular

Ceramic

1

No

2 V

1

Bipolar

6

0.4 %

5 V

Binary, Offset Binary

±5 V

-5 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

50 °C (122 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T40

No

e0

MAX1114BIDO

Maxim Integrated

Analog To Digital Converter, Flash Method

Other

Through-Hole

42

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

0 mV

150 MHz

1

CMOS

8

550 mA

0.3711 %

Binary, 2's Complement Binary

-5.2 V

In-Line

85 °C (185 °F)

-2 V

Parallel, 8 Bits

-20 °C (-4 °F)

Tin Lead

Track

Dual

R-CDIP-T42

No

e0

MAX172BING

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

12

12 mA

0.024 %

5 V

Binary

5,-12/-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

10.4 µs

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

1.203 in (30.545 mm)

MAX1125BIBH

Maxim Integrated

Analog To Digital Converter, Flash Method

Other

J Bend

44

QCCJ

Square

Ceramic, Metal-Sealed Cofired

1

Yes

0 mV

300 MHz

1

CMOS

8

550 mA

0.3711 %

Binary, 2's Complement Binary

-5.2 V

Chip Carrier

85 °C (185 °F)

-2 V

Parallel, 8 Bits

-20 °C (-4 °F)

Tin Lead

Track

Quad

S-CQCC-J44

No

e0

MX7820UQ/883B

Maxim Integrated

Analog To Digital Converter, Flash Method

Other

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5.1 V

1

CMOS

8

5 V

Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-100 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Track

Dual

2 µs

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.95 in (24.13 mm)

MAX1150AIZS

Maxim Integrated

Analog To Digital Converter, Flash Method

Other

Gull Wing

80

QFP

Rectangular

Plastic/Epoxy

1

Yes

0 mV

500 MHz

1

CMOS

8

1.2 A

0.3906 %

Binary

-5.2 V

-5.2 V

Flatpack

QFP80,.7X.9,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Parallel, 8 Bits

-20 °C (-4 °F)

Tin Lead

Quad

R-PQFP-G80

0.134 in (3.4 mm)

0.551 in (14 mm)

No

e0

0.787 in (20 mm)

MAX1125AIBH

Maxim Integrated

Analog To Digital Converter, Flash Method

Other

J Bend

44

QCCJ

Square

Ceramic, Metal-Sealed Cofired

1

Yes

0 mV

300 MHz

1

CMOS

8

550 mA

0.293 %

Binary, 2's Complement Binary

-5.2 V

Chip Carrier

85 °C (185 °F)

-2 V

Parallel, 8 Bits

-20 °C (-4 °F)

Tin Lead

Track

Quad

S-CQCC-J44

No

e0

ICL7109IQH

Maxim Integrated

Analog To Digital Converter

Other

J Bend

44

QCCJ

Square

Plastic/Epoxy

1

Yes

2.048 V

1

CMOS

13

0.024 %

5 V

Signed Plus Magnitude

±5 V

-5 V

Chip Carrier

LDCC44,.7SQ

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-20 °C (-4 °F)

Tin/Lead

Quad

S-PQCC-J44

No

e0

MX7572AQ12

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

12 mA

0.024 %

5 V

Offset Binary, Complementary Offset Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Dual

13 s

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

ICL7109IPL

Maxim Integrated

Analog To Digital Converter, Dual-Slope

Other

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

3.5 V

1

CMOS

12

0.0244 %

5 V

Binary

±5 V

-5 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-3.5 V

Parallel, Word

-20 °C (-4 °F)

Tin Lead

Dual

R-PDIP-T40

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

245 °C (473 °F)

2.05 in (52.075 mm)

AD7574A/D

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Other

1

0 mV

1

CMOS

8

5 V

Offset Binary

5 V

DIE OR CHIP

Analog to Digital Converters

85 °C (185 °F)

-25 °C (-13 °F)

No

MX7572CQ12

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

12 mA

0.012 %

5 V

Offset Binary, Complementary Offset Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Dual

13 s

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MX7572BQ12

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

12 mA

0.024 %

5 V

Offset Binary, Complementary Offset Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Dual

13 s

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MX7574BQ

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

CMOS

8

0.2 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T18

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MX7574AD

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

18

DIP

Rectangular

1

No

10 V

1

CMOS

8

0.3 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

In-Line

DIE OR CHIP

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, 8 Bits

-25 °C (-13 °F)

Gold Over Nickel

Dual

R-XDIP-T18

1

0.225 in (5.72 mm)

0.3 in (7.62 mm)

No

e4

MAX1151BIZS

Maxim Integrated

Analog To Digital Converter, Flash Method

Other

Gull Wing

80

QFP

Rectangular

Plastic/Epoxy

1

Yes

0 mV

750 MHz

1

CMOS

8

1.2 A

0.5859 %

Binary

-5.2 V

-5.2 V

Flatpack

QFP80,.7X.9,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Parallel, 8 Bits

-20 °C (-4 °F)

Tin Lead

Quad

R-PQFP-G80

0.134 in (3.4 mm)

0.551 in (14 mm)

No

e0

0.787 in (20 mm)

MAX1114AIBH-T

Maxim Integrated

Analog To Digital Converter, Flash Method

Other

J Bend

44

QCCJ

Square

Ceramic, Metal-Sealed Cofired

1

Yes

0 mV

150 MHz

1

CMOS

8

550 mA

0.293 %

Binary, 2's Complement Binary

-5.2 V

Chip Carrier

85 °C (185 °F)

-2 V

Parallel, 8 Bits

-20 °C (-4 °F)

Tin Lead

Track

Quad

S-CQCC-J44

No

e0

MAX1125AIBH-T

Maxim Integrated

Analog To Digital Converter, Flash Method

Other

J Bend

44

QCCJ

Square

Ceramic, Metal-Sealed Cofired

1

Yes

0 mV

300 MHz

1

CMOS

8

550 mA

0.293 %

Binary, 2's Complement Binary

-5.2 V

Chip Carrier

85 °C (185 °F)

-2 V

Parallel, 8 Bits

-20 °C (-4 °F)

Tin Lead

Track

Quad

S-CQCC-J44

No

e0

MAX1125BIBH-T

Maxim Integrated

Analog To Digital Converter, Flash Method

Other

J Bend

44

QCCJ

Square

Ceramic, Metal-Sealed Cofired

1

Yes

0 mV

300 MHz

1

CMOS

8

550 mA

0.3711 %

Binary, 2's Complement Binary

-5.2 V

Chip Carrier

85 °C (185 °F)

-2 V

Parallel, 8 Bits

-20 °C (-4 °F)

Tin Lead

Track

Quad

S-CQCC-J44

No

e0

MAX1114BIBH

Maxim Integrated

Analog To Digital Converter, Flash Method

Other

J Bend

44

QCCJ

Square

Ceramic, Metal-Sealed Cofired

1

Yes

0 mV

150 MHz

1

CMOS

8

550 mA

0.3711 %

Binary, 2's Complement Binary

-5.2 V

Chip Carrier

85 °C (185 °F)

-2 V

Parallel, 8 Bits

-20 °C (-4 °F)

Tin Lead

Track

Quad

S-CQCC-J44

No

e0

MX7574BD

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

18

DIP

Rectangular

1

No

10 V

1

CMOS

8

0.2 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, 8 Bits

-25 °C (-13 °F)

Gold Over Nickel

Dual

R-XDIP-T18

1

0.225 in (5.72 mm)

0.3 in (7.62 mm)

No

e4

ICL7109IQH-TD

Maxim Integrated

Analog To Digital Converter, Dual-Slope

Other

J Bend

44

QCCJ

Square

Plastic/Epoxy

1

Yes

3.5 V

1

CMOS

12

0.0244 %

5 V

Binary

±5 V

-5 V

Chip Carrier

LDCC44,.7SQ

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-3.5 V

Parallel, Word

-20 °C (-4 °F)

Tin Lead

Quad

S-PQCC-J44

0.18 in (4.57 mm)

0.653 in (16.585 mm)

No

e0

0.653 in (16.585 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.