Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Maximum Analog Output Voltage | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | No. of Bits | Maximum Settling Time | Maximum Supply Current | Maximum Linearity Error (EL) | Input Format | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Nominal Settling Time (tstl) | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Minimum Analog Output Voltage | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
8 |
CMOS |
8 |
22 mA |
Parallel, 8 Bits |
15 V |
-5 V |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Binary |
||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Flat |
16 |
DFP |
Rectangular |
50k Rad(Si) |
Ceramic, Glass-Sealed |
18 V |
Yes |
1 |
MIL-PRF-38535 Class V |
8 |
15 V |
-15 V |
Flatpack |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-GDFP-F16 |
Yes |
-10 V |
Binary |
||||||||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
16 |
DIE |
Yes |
1 |
Bipolar |
10 |
16 mA |
0.05 % |
Parallel, Word |
5 V |
5,-15 V |
-15 V |
Uncased Chip |
DIE OR CHIP |
Other Converters |
250 ns |
125 °C (257 °F) |
-55 °C (-67 °F) |
Upper |
X-XUUC-N16 |
No |
Binary |
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Analog Devices |
Digital to Analog converter |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
10 V |
Yes |
1 |
Bipolar |
38535Q/M;38534H;883B |
8 |
5 µs |
25 mA |
0.29 % |
Parallel, 8 Bits |
5 V |
5/15 V |
Chip Carrier |
LCC20,.35SQ |
Other Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N20 |
0.1 in (2.54 mm) |
0.35 in (8.89 mm) |
Yes |
e0 |
0 V |
0.35 in (8.89 mm) |
Binary |
||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
4 |
BICMOS |
MIL-STD-883 Class B |
8 |
7 µs |
12 mA |
0.3906 % |
Parallel, 8 Bits |
15 V |
12/15, GND/-5 V |
-5 V |
In-Line |
DIP24,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
2 |
CMOS |
MIL-STD-883 |
12 |
1.5 µs |
2 mA |
0.0244 % |
Parallel, Word |
15 V |
12/15 V |
In-Line |
DIP24,.3 |
Other Converters |
800 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
2 |
BICMOS |
12 |
2 mA |
Parallel, 8 Bits |
Chip Carrier |
800 ns |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
No |
e0 |
0.45 in (11.43 mm) |
Binary, Offset Binary |
||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
10 V |
No |
4 |
CMOS |
8 |
0 ns |
1.5 mA |
0.0977 % |
Parallel, 8 Bits |
5 V |
5 V |
In-Line |
DIP28,.6 |
Other Converters |
190 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
-10 V |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
No |
1 |
MIL-PRF-38535 Class B |
12 |
Parallel, Word |
15 V |
-15 V |
In-Line |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T24 |
No |
e0 |
Binary |
||||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic |
No |
1 |
CMOS |
38535Q/M;38534H;883B |
10 |
In-Line |
DIP28,.6 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-XDIP-T28 |
No |
e0 |
Binary |
|||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
16 |
10 µs |
2.6 mA |
0.032 % |
Serial |
5 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP16,.25 |
Other Converters |
6 µs |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-PDSO-G16 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e0 |
0 V |
0.197 in (5 mm) |
Binary |
|||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
15 V |
No |
1 |
CMOS |
12 |
1 µs |
2 mA |
0.012 % |
Parallel, Word |
15 V |
5/15 V |
In-Line |
DIP20,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0 V |
Binary, 2's Complement Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic |
No |
1 |
CMOS |
1 mA |
0.05 % |
15 V |
15 V |
In-Line |
DIP16,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-XDIP-T16 |
e0 |
Binary Coded Decimal |
||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic |
No |
1 |
CMOS |
12 |
2 mA |
0.05 % |
15 V |
15 V |
In-Line |
DIP18,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-XDIP-T18 |
No |
e0 |
Binary, Offset Binary |
||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
MIL-STD-883 |
8 |
500 ns |
2 mA |
1.9531 % |
Parallel, 8 Bits |
5 V |
5/15 V |
In-Line |
DIP16,.3 |
Other Converters |
100 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T16 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
Yes |
e0 |
0.75 in (19.05 mm) |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic |
No |
1 |
CMOS |
8 |
4 mA |
5 V |
5 V |
In-Line |
DIP16,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-XDIP-T16 |
No |
e0 |
Complementary Binary |
|||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
15 V |
No |
1 |
CMOS |
38535Q/M;38534H;883B |
12 |
1 µs |
2 mA |
0.012 % |
Serial |
5 V |
5 V |
In-Line |
DIP16,.3 |
Other Converters |
380 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T16 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0 V |
0.75 in (19.05 mm) |
Binary, Offset Binary |
|||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
1 |
CMOS |
MIL-STD-883 |
12 |
0.0122 % |
Parallel, Word |
5 V |
Chip Carrier |
125 °C (257 °F) |
-55 °C (-67 °F) |
Quad |
S-CQCC-N28 |
No |
Binary |
|||||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
No |
1 |
CMOS |
MIL-STD-883 Class B |
12 |
1 µs |
2 mA |
0.0122 % |
Parallel, Word |
15 V |
15 V |
In-Line |
DIP18,.3 |
Other Converters |
1 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T18 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.96 in (24.38 mm) |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
3 V |
No |
1 |
BICMOS |
MIL-STD-883 Class B |
14 |
4 µs |
15 mA |
0.0122 % |
Serial, Parallel, Word |
5 V |
±5 V |
-5 V |
In-Line |
DIP24,.3 |
Other Converters |
2.5 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
-3 V |
2's Complement Binary |
|||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Military |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
16 |
Serial |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
6 µs |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G16 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.197 in (5 mm) |
Binary |
||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
12 |
2 µs |
2 mA |
0.0122 % |
Parallel, Word |
5 V |
5/15 V |
In-Line |
DIP20,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.953 in (24.195 mm) |
Binary |
|||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
1 |
CMOS |
MIL-STD-883 |
12 |
0.0122 % |
Serial, Parallel, Word |
15 V |
Chip Carrier |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Quad |
S-CQCC-N20 |
0.1 in (2.54 mm) |
0.35 in (8.89 mm) |
0.35 in (8.89 mm) |
Binary, Offset Binary |
||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
8 |
500 ns |
2 mA |
0.0488 % |
Parallel, 8 Bits |
5 V |
5/15 V |
In-Line |
DIP16,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-GDIP-T16 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
0.84 in (21.34 mm) |
Binary, Offset Binary |
|||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
15 V |
No |
1 |
CMOS |
12 |
1 µs |
2 mA |
0.012 % |
Parallel, Word |
15 V |
5/15 V |
In-Line |
DIP20,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0 V |
Binary, 2's Complement Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
2 |
BICMOS |
MIL-STD-883 Class B |
12 |
1.5 µs |
2 mA |
0.0122 % |
Parallel, Word |
15 V |
12/15 V |
Chip Carrier |
LCC28,.45SQ |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
No |
e0 |
0.45 in (11.43 mm) |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
4 |
BICMOS |
38535Q/M;38534H;883B |
12 |
12 mA |
0.0366 % |
Parallel, Word |
15 V |
5/±15 V |
-15 V |
Chip Carrier |
LCC28,.45SQ |
Other Converters |
6 µs |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
No |
e0 |
0.45 in (11.43 mm) |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Gull Wing |
10 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
CMOS |
10 |
8 ns |
500 mA |
0.098 % |
Parallel, Word |
5 V |
5 V |
Flatpack |
QFP100,.7X.9 |
Other Converters |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
R-PQFP-G10 |
0.096 in (2.45 mm) |
0.551 in (14 mm) |
No |
e0 |
0.787 in (20 mm) |
Binary |
|||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
No |
1 |
Bipolar |
38535Q/M;38534H;883B |
12 |
7 µs |
0.018 % |
15 V |
±15 V |
-15 V |
In-Line |
DIP24,.6 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T24 |
No |
Complementary Binary, Complementary Offset Binary |
||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
10 V |
Yes |
1 |
Bipolar |
8 |
3 µs |
25 mA |
0.29 % |
Parallel, 8 Bits |
5 V |
5/15 V |
Chip Carrier |
LCC20,.35SQ |
Other Converters |
2 µs |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N20 |
0.1 in (2.54 mm) |
0.35 in (8.89 mm) |
No |
e0 |
0 V |
0.35 in (8.89 mm) |
Binary |
||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
12 |
0.0244 % |
Parallel, 4 Bits |
15 V |
In-Line |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
1 |
No |
e0 |
Binary, Offset Binary |
|||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
Bipolar |
MIL-STD-883 |
12 |
183 mA |
0.0305 % |
Parallel, Word |
5 V |
5,-5.2 V |
-5.2 V |
In-Line |
DIP28,.6 |
Other Converters |
22 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
MIL-STD-883 |
12 |
188 mA |
0.0427 % |
Parallel, Word |
5 V |
-5.2 V |
In-Line |
27 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin/Lead (Sn63Pb37) |
Dual |
R-GDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
Binary |
||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
MIL-STD-883 |
12 |
1.5 µs |
5 mA |
0.0244 % |
Parallel, 4 Bits |
15 V |
15 V |
In-Line |
DIP20,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
Yes |
e0 |
Binary, Offset Binary |
|||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
1 |
Bipolar |
MIL-STD-883 |
12 |
183 mA |
0.0305 % |
Parallel, Word |
5 V |
5,-5.2 V |
-5.2 V |
Chip Carrier |
LCC28,.45SQ |
Other Converters |
22 ns |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
No |
e0 |
0.45 in (11.43 mm) |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
1 |
CMOS |
MIL-STD-883 Class B |
12 |
2 µs |
2 mA |
0.0488 % |
Parallel, Word |
5 V |
5/15 V |
Chip Carrier |
LCC20,.35SQ |
Other Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N20 |
0.1 in (2.54 mm) |
0.35 in (8.89 mm) |
No |
e0 |
0.35 in (8.89 mm) |
Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
10 V |
No |
1 |
CMOS |
MIL-STD-883 |
12 |
0.05 % |
Parallel, Word |
15 V |
-15 V |
In-Line |
250 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
-5 V |
Binary, Offset Binary, 2's Complement Binary |
||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
No |
8 |
BICMOS |
38535Q/M;38534H;883B |
8 |
7 µs |
22 mA |
0.2 % |
12/15, GND/-5 V |
In-Line |
DIP24,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T24 |
No |
Binary |
|||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic |
No |
1 |
CMOS |
38535Q/M;38534H;883B |
10 |
800 ns |
2 mA |
0.05 % |
15 V |
15 V |
In-Line |
DIP16,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T16 |
No |
Binary, Offset Binary |
||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
15 V |
No |
1 |
CMOS |
MIL-STD-883 |
12 |
0.0122 % |
Parallel, Word |
5 V |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
0 V |
Binary, Offset Binary |
||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Pin/Peg |
24 |
Rectangular |
Metal |
.512 V |
No |
1 |
10 |
Parallel, Word |
Microelectronic Assembly |
25 ns |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-MDMA-P24 |
No |
e0 |
-.512 V |
Binary, Offset Binary |
|||||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
9.9853 V |
No |
4 |
BICMOS |
12 |
13 mA |
0.0183 % |
Parallel, Word |
15 V |
-15 V |
In-Line |
6 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin/Lead (Sn63Pb37) |
Dual |
R-GDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
-9.9902 V |
Binary |
||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
1 |
CMOS |
6 |
13 ns |
220 mA |
0.391 % |
Parallel, 8 Bits |
5 V |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Other Converters |
13 ns |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
0.18 in (4.57 mm) |
0.653 in (16.5862 mm) |
No |
e0 |
0.653 in (16.5862 mm) |
Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
2 |
BICMOS |
12 |
2 mA |
Parallel, 8 Bits |
Chip Carrier |
800 ns |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
No |
e0 |
0.45 in (11.43 mm) |
Binary, Offset Binary |
||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Metal |
No |
1 |
Bipolar |
MIL-STD-883 Class B (Modified) |
8 |
10 ns |
-5.2 V |
-5.2 V |
In-Line |
DIP24,.6 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-MDIP-T24 |
No |
e0 |
Binary |
||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
5 V |
No |
2 |
CMOS |
12 |
12 µs |
15 mA |
0.024 % |
Parallel, Word |
12 V |
12/15,GND/-12/-15 V |
-12 V |
In-Line |
DIP24,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin/Lead (Sn63Pb37) |
Dual |
R-GDIP-T24 |
0.225 in (5.715 mm) |
0.3 in (7.62 mm) |
No |
e0 |
-5 V |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
2 |
BICMOS |
38535Q/M;38534H;883B |
12 |
1.5 µs |
2 mA |
0.012 % |
Parallel, 8 Bits |
12/15 V |
Chip Carrier |
LCC28,.45SQ |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
No |
e0 |
0.45 in (11.43 mm) |
Binary, Offset Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
44 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
13 V |
Yes |
4 |
BICMOS |
MIL-STD-883 |
12 |
19 mA |
0.0244 % |
Parallel, Word |
15 V |
5,±12/±15 V |
-15 V |
Chip Carrier |
LCC44,.65SQ |
Other Converters |
10 µs |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N44 |
0.1 in (2.54 mm) |
0.651 in (16.5354 mm) |
Yes |
e0 |
-13 V |
0.651 in (16.5354 mm) |
Binary |
Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.
DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.
DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.
DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.