Military Digital-to-Analog Converters 1,864

Reset All
Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

AD664TD-BIP

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

13 V

No

4

BICMOS

12

10 µs

19 mA

0.0183 %

Parallel, Word

15 V

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-13 V

Binary

AD7522UD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

10

0.05 %

5,15 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T28

No

e0

Binary

5962-01-302-3671

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

Bipolar

38535Q/M;38534H;883B

8

3 µs

25 mA

0.15 %

5/15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T16

No

Binary

5962R8993201VEX

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

18 V

No

1

8

Parallel, 8 Bits

15 V

-15 V

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T16

Yes

-10 V

Binary

AD7547TE

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

2

CMOS

12

2 µs

2 mA

0.0122 %

Parallel, Word

12 V

12/15 V

Chip Carrier

LCC28,.45SQ

Other Converters

800 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

Binary

DAC8426AR

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

4

CMOS

8

14 mA

0.1953 %

Parallel, 8 Bits

15 V

15 V

In-Line

DIP20,.3

Other Converters

3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

AD561SD

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Bipolar

10

16 mA

0.05 %

Parallel, Word

5 V

5,-15 V

-15 V

In-Line

DIP16,.3

Other Converters

250 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T16

0.14 in (3.553 mm)

0.3 in (7.62 mm)

No

e0

-2 V

0.8 in (20.32 mm)

Binary

DAC8229AR/883

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

8

0.1953 %

Parallel, 8 Bits

-5 V

In-Line

2 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

PM7541ABX/883

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

1 µs

2 mA

0.012 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

AD7225UE

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

5 V

Yes

4

BICMOS

8

5 µs

12 mA

0.1953 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

Chip Carrier

LCC28,.45SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

-5 V

0.45 in (11.43 mm)

Binary

AD7536TQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

MOS

14

2 µs

4 mA

0.006 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

1.399 in (35.54 mm)

Offset Binary

5962-87702062X

Analog Devices

Digital to Analog converter

Military

20

Ceramic, Glass-Sealed

1

CMOS

12

0.0488 %

Parallel, Word

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Dual

No

Binary, 2's Complement Binary

5962-8965703LX

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

MIL-STD-883

12

2 mA

Parallel, Word

15 V

In-Line

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

AD7521SD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

500 ns

2 mA

0.2 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

AD7224TE

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

BICMOS

8

20 µs

6 mA

0.391 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary

AD664SD-UNI/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

4

BIMOS

MIL-STD-883 Class B

12

10 µs

0.0244 %

Parallel, Word

15 V

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.165 in (4.191 mm)

0.6 in (15.24 mm)

No

e0

0 V

1.41 in (35.815 mm)

Binary

ADV7150KS85

Analog Devices

Digital to Analog converter

Military

Gull Wing

160

QFP

Square

Plastic/Epoxy

Yes

3

CMOS

10

500 mA

0.098 %

Parallel, Word

5 V

5 V

Flatpack

QFP160,1.2SQ

Other Converters

0.031 in (0.8 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-PQFP-G160

0.16 in (4.07 mm)

1.102 in (28 mm)

No

e0

1.102 in (28 mm)

Binary

5962-89481012X

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

38535Q/M;38534H;883B

12

2 mA

0.024 %

Parallel, Word

15 V

15 V

Chip Carrier

LCC20,.35SQ

Other Converters

600 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary

AD7548TD

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

1

BICMOS

12

3 mA

0.012 %

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T20

No

e0

Binary

AD7224TE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

BICMOS

MIL-STD-883 Class B

8

5 µs

6 mA

0.3906 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary

AD1508-9D/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

.5 V

No

1

MIL-STD-883 Class B

8

0.1 %

Parallel, 8 Bits

5 V

-15 V

In-Line

250 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-CDIP-T16

0.255 in (6.48 mm)

0.3 in (7.62 mm)

-5 V

0.775 in (19.69 mm)

Binary

AD7535TQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

14

1.5 µs

4 mA

0.0061 %

Parallel, Word

12 V

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.22 in (5.59 mm)

0.6 in (15.24 mm)

No

e0

1.399 in (35.54 mm)

Binary, Offset Binary

ADV7151KS110

Analog Devices

Digital to Analog converter

Military

Gull Wing

10

QFP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

10

8 ns

500 mA

0.098 %

Parallel, Word

5 V

5 V

Flatpack

QFP100,.7X.9

Other Converters

0.026 in (0.65 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

R-PQFP-G10

0.096 in (2.45 mm)

0.551 in (14 mm)

No

e0

0.787 in (20 mm)

Binary

5962-8770206RA

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883

12

2 mA

0.012207 %

Parallel, Word

5 V

In-Line

DIP20(UNSPEC)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-CDIP-T20

No

Binary

AD7535SQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

38535Q/M;38534H;883B

14

1.5 µs

4 mA

0.012 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

Binary

AD9703TD

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

0 V

No

1

Bipolar

8

275 mA

0.2 %

Parallel, 8 Bits

-5.2 V

-5.2 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T24

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-.6375 V

Complementary Binary

5962-8778902EA

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Bipolar

38535Q/M;38534H;883B

8

5 µs

25 mA

0.15 %

Parallel, 8 Bits

5 V

5/15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

e0

0 V

0.75 in (19.05 mm)

Binary

AD9713BTE

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

Bipolar

12

188 mA

0.0427 %

Parallel, Word

5 V

5,-5.2 V

-5.2 V

Chip Carrier

LCC28,.45SQ

Other Converters

27 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

Binary

5962-87702032A

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-STD-883

12

0.0488 %

Parallel, Word

5 V

Chip Carrier

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQCC-N20

No

e4

Binary, 2's Complement Binary

5962-01-222-9565

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

Bipolar

38535Q/M;38534H;883B

8

0.19 %

5,-15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T16

No

Binary, Offset Binary

AD7228UE

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 V

Yes

1

MOS

8

5 µs

22 mA

0.195 %

Parallel, 8 Bits

12/15, GND/-5 V

-5 V

Chip Carrier

LCC28,.45SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0 V

0.45 in (11.43 mm)

Binary

AD9713BSE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

Bipolar

38535Q/M;38534H;883B

12

188 mA

0.0488 %

Parallel, Word

5 V

5,-5.2 V

-5.2 V

Chip Carrier

LCC28,.45SQ

Other Converters

27 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

Binary

AD7118UD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

14

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

6

2 mA

5/15 V

In-Line

DIP14,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T14

No

e0

Binary

AD669SQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

1

BICMOS

16

13 µs

18 mA

0.0061 %

Parallel, Word

15 V

5,±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Binary

AD9712BSE

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

Bipolar

12

183 mA

0.0488 %

Parallel, Word

-5.2 V

-5.2 V

Chip Carrier

LCC28,.45SQ

Other Converters

27 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

Binary

AD7545TE

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

12

2 µs

2 mA

0.0244 %

Parallel, Word

5 V

5/15 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary

AD390SDB

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

12

8 µs

0.0183 %

Parallel, Word

15 V

-15 V

In-Line

4 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-10 V

1.4 in (35.56 mm)

Offset Binary

AD7520UD

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

10

2 mA

0.05 %

Parallel, Word

15 V

15 V

In-Line

DIP16,.3

Other Converters

500 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T16

0.17 in (4.32 mm)

0.3 in (7.62 mm)

No

e0

0.79 in (20.07 mm)

Binary

DAC8222BTC/883

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

15 V

Yes

1

CMOS

MIL-STD-883

12

1 µs

2 mA

0.0244 %

Parallel, Word

5 V

5/15 V

Chip Carrier

LCC28,.45SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0 V

0.45 in (11.43 mm)

Binary, Offset Binary

5962-8965703LC

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

12

2 mA

Parallel, Word

15 V

In-Line

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

AD7549SD

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

2

CMOS

12

1.5 µs

5 mA

0.0244 %

Parallel, Word

15 V

15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T20

0.3 in (7.62 mm)

No

e0

1 in (25.4 mm)

Binary

AD768AF-EMX

Analog Devices

Digital to Analog converter

Military

Flat

28

DFP

Rectangular

Ceramic, Metal-Sealed Cofired

Yes

1

16

0.0183 %

Parallel, Word

5 V

-5 V

Flatpack

35 ns

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-CDFP-F28

Binary

5962-8866301LX

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

8

CMOS

38535Q/M;38534H;883B

8

7 µs

22 mA

0.39 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

AD7118TD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

14

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

6

2 mA

5/15 V

In-Line

DIP14,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T14

No

e0

Binary

AD664SD-BIP/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

4

BIMOS

MIL-STD-883 Class B

12

10 µs

0.0244 %

Parallel, Word

15 V

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.165 in (4.191 mm)

0.6 in (15.24 mm)

No

e0

-10 V

1.41 in (35.815 mm)

Binary

AD7837SCHIPS

Analog Devices

Digital to Analog converter

Military

No Lead

24

DIE

10 V

Yes

2

BICMOS

12

0.0244 %

Parallel, Word

15 V

-15 V

Uncased Chip

3 µs

125 °C (257 °F)

-55 °C (-67 °F)

Upper

X-XUUC-N24

No

-10 V

Binary, Offset Binary

5962-01-146-8383

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

10

500 ns

2 mA

0.2 %

15 V

15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T16

No

Binary, Offset Binary

PM7528ARC/883

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

15 V

Yes

2

CMOS

38535Q/M;38534H;883B

8

0 ns

1 mA

0.195 %

Parallel, 8 Bits

15 V

5/15 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0 V

0.35 in (8.89 mm)

Binary, Offset Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.