Military Digital-to-Analog Converters 1,864

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

AD7549SE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-STD-883 Class B

12

1.5 µs

5 mA

0.0244 %

Parallel, 4 Bits

15 V

15 V

Chip Carrier

LCC20,.35SQ

Other Converters

800 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary, Offset Binary

AD7543SD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

2 µs

0.024 %

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary

AD7840TQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

BICMOS

38535Q/M;38534H;883B

14

4 µs

15 mA

0.006 %

5 V

±5 V

-5 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

2's Complement

AD7111UE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

38535Q/M;38534H;883B

8

4 mA

Parallel, 8 Bits

5 V

5 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary

AD7533TQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883 Class B

10

800 ns

2 mA

0.1 %

Parallel, Word

15 V

15 V

In-Line

DIP16,.3

Other Converters

600 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

Binary

5962-87702062A

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Glass-Sealed

Yes

1

CMOS

MIL-STD-883

12

2 mA

0.012207 %

Parallel, Word

5 V

Chip Carrier

LCC20(UNSPEC)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N20

No

Binary

AD395TD

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Hybrid

12

15 µs

28 mA

0.012 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Binary

PM7545BRC/883C

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

15 V

Yes

1

CMOS

38535Q/M;38534H;883B

12

1 µs

2 mA

0.012 %

Parallel, Word

15 V

5/15 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0 V

0.35 in (8.89 mm)

Binary, 2's Complement Binary

AD7244JR/883B

Analog Devices

Digital to Analog converter

Military

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

2

BICMOS

MIL-STD-883 Class B

14

4 µs

27 mA

0.0122 %

Serial

5 V

-5 V

Small Outline

SOP28,.4

2.5 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-PDSO-G28

0.104 in (2.65 mm)

0.295 in (7.5 mm)

0.705 in (17.9 mm)

Binary

AD7226TE

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

5 V

Yes

4

BICMOS

8

20 µs

13 mA

0.3906 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

Chip Carrier

LCC20,.35SQ

Other Converters

3 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

-5 V

0.35 in (8.89 mm)

Binary

M38510/11301BEX

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

Bipolar

8

0.19 %

Parallel, 8 Bits

15 V

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

0.75 in (19.05 mm)

Binary

AD7542SE

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

12

2 µs

2.5 mA

0.0122 %

Parallel, 4 Bits

5 V

5 V

Chip Carrier

LCC20,.35SQ

Other Converters

250 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary, Offset Binary

5962-9176403XX

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

9.9853 V

No

4

BICMOS

12

0.0183 %

Parallel, Word

15 V

-15 V

In-Line

6 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

-9.9902 V

Binary

PM7541AX/883

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

1 µs

2 mA

0.012 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

AD7520TD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

No

1

CMOS

MIL-STD-883 Class B

10

500 ns

2 mA

0.0977 %

Parallel, Word

15 V

15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T

No

e0

Binary

5962-01-206-0586

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

Bipolar

8

3 µs

25 mA

0.15 %

5/15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T16

No

Binary

5962-8965702LX

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

MIL-STD-883

12

2 mA

Parallel, Word

15 V

In-Line

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

AD7845TQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

1

CMOS

12

5 µs

10 mA

0.0244 %

Parallel, Word

12 V

±15 V

-12 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-10 V

Binary

5962-89481022A

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-STD-883

12

2 mA

0.0244 %

Parallel, Word

15 V

15 V

Chip Carrier

LCC20,.35SQ

Other Converters

600 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary, Offset Binary

PM7524AQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

15 V

No

1

MOS

8

0 ns

1 mA

0.05 %

Parallel, 8 Bits

15 V

5/15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.75 in (19.05 mm)

Binary, Offset Binary

AD7541TE

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic

Yes

1

CMOS

12

1 µs

2 mA

0.012 %

15 V

15 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-XQCC-N20

No

e0

Binary, Offset Binary

DAC8412BT/883C

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

4

BICMOS

MIL-STD-883

12

12 mA

0.0366 %

Parallel, Word

5 V

5/±15 V

-5 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

Binary

AD7534SQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

38535Q/M;38534H;883B

14

1.5 µs

3 mA

0.012 %

Parallel, 8 Bits

12/15,GND/-0.3 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

AD7118UE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic

Yes

1

CMOS

38535Q/M;38534H;883B

6

2 mA

5/15 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-XQCC-N20

No

e0

Binary

DAC08AQ5/38510

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

Bipolar

38535Q/M;38534H;883B

8

0 ns

7.8 mA

0.1 %

Parallel, 8 Bits

15 V

±15 V

-15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

Binary, Offset Binary

PM7226BR

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

15 V

No

4

CMOS

8

5 µs

12 mA

0.391 %

Parallel, 8 Bits

12 V

12/15, GND/-5 V

-5 V

In-Line

DIP20,.3

Other Converters

3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-5 V

Binary

AD7536SQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

1

BICMOS

38535Q/M;38534H;883B

14

1.5 µs

4 mA

0.012 %

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

Offset Binary

5962-8866302LC

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

8

CMOS

8

22 mA

Parallel, 8 Bits

15 V

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

DAC8408AT/883

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

4

CMOS

MIL-STD-883

8

250 ns

1.5 mA

0.0977 %

Parallel, 8 Bits

5 V

5 V

In-Line

DIP28,.6

Other Converters

190 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Binary

AD7111UQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

BICMOS

MIL-STD-883 Class B

8

4 mA

Parallel, 8 Bits

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

Binary

AD9731-713D

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

10

0.1465 %

Parallel, 8 Bits

5 V

-5.2 V

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-CDIP-T28

Binary

AD7837SQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

2

BICMOS

12

10 mA

0.0244 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP24,.3

Other Converters

3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

e0

-10 V

Binary, Offset Binary

AD9701SE

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

-.9792 V

Yes

1

Bipolar

8

160 mA

0.3906 %

Parallel, 8 Bits

-5.2 V

-5.2 V

Chip Carrier

LCC28,.45SQ

Other Converters

12 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

-1.0078 V

0.45 in (11.43 mm)

Binary

5962-01-324-7665

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

10

800 ns

2 mA

0.1 %

15 V

15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T16

No

Binary, Offset Binary

PM7228ATC

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

15 V

Yes

1

CMOS

8

5 µs

16 mA

0.195 %

Parallel, 8 Bits

-5 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

-5 V

0.45 in (11.43 mm)

Binary, Offset Binary

PM7628ARC/883C

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic

Yes

2

CMOS

38535Q/M;38534H;883B

8

300 ns

2.5 mA

0.2 %

5/15 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-XQCC-N20

No

e0

Binary, Offset Binary

AD7846SD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

4 V

No

1

BICMOS

38535Q/M;38534H;883B

16

9 µs

5 mA

0.024 %

Parallel, Word

15 V

5,±15 V

-15 V

In-Line

DIP28,.6

Other Converters

6 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-3 V

Binary

5962-9164701MLX

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

2

CMOS

14

0.0122 %

Serial

5 V

-5 V

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-CDIP-T24

Yes

Binary

AD7544GTD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

Binary

AD667-703D

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

12

0.0183 %

Parallel, Word

15 V

-15 V

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-CDIP-T28

Binary

AD7834SQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

8.192 V

No

4

CMOS

14

15 mA

0.012 %

Serial

15 V

5,±15 V

-15 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-8.192 V

Binary

AD7237TQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

5 V

No

2

CMOS

12

12 µs

15 mA

0.012 %

Parallel, Word

15 V

12/15,GND/-12/-15 V

-15 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

-5 V

Offset Binary

HDH-1003

Analog Devices

Digital to Analog converter

Military

Pin/Peg

24

DIP

Rectangular

Metal

.512 V

No

1

Bipolar

10

0.0488 %

Parallel, Word

15 V

-15 V

In-Line

DIP24,.6

Other Converters

300 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-MDIP-P24

0.175 in (4.45 mm)

0.6 in (15.24 mm)

No

e0

-.512 V

1.272 in (32.32 mm)

Binary, Offset Binary

5962-01-253-9115

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

4

BICMOS

8

20 µs

24 mA

0.39 %

12/15, GND/-5 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T20

No

Binary

5962-89932012X

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

18 V

Yes

1

Bipolar

MIL-STD-883

8

0.19 %

Parallel, 8 Bits

15 V

-15 V

Chip Carrier

85 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

Yes

-10 V

0.35 in (8.89 mm)

Offset Binary

5962-8776301LB

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

BICMOS

12

2 mA

Parallel, 8 Bits

In-Line

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

DAC8426AR/883C

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

4

CMOS

38535Q/M;38534H;883B

8

14 mA

0.1953 %

Parallel, 8 Bits

15 V

15 V

In-Line

DIP20,.3

Other Converters

3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

DAC8248AW

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

1

CMOS

12

1 µs

2 mA

0.0122 %

Parallel, 8 Bits

5 V

5/15 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-10 V

Binary, Offset Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.