Military Digital-to-Analog Converters 1,864

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

5962-8780201RA

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

4

CMOS

MIL-STD-883

8

20 µs

13 mA

0.3906 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

e0

260 °C (500 °F)

0.953 in (24.195 mm)

Binary

PM7224BX/883

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

BICMOS

38535Q/M;38534H;883B

8

5 µs

6 mA

0.39 %

12/15, GND/-5 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

Binary

AD7226TE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

4

BICMOS

MIL-STD-883 Class B

8

20 µs

13 mA

0.3906 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

Chip Carrier

LCC20,.35SQ

Other Converters

3 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary

AD7845TQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

1

CMOS

MIL-STD-883 Class B

12

5 µs

10 mA

0.0183 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP24,.3

Other Converters

2.5 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

e0

-10 V

Binary, Offset Binary

AD7547SQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

12

2 µs

2 mA

0.0244 %

Parallel, Word

12 V

12/15 V

In-Line

DIP24,.3

Other Converters

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

e0

Binary

AD7224TQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

BICMOS

8

20 µs

6 mA

0.391 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

AD7522TQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

MIL-STD-883 Class B

10

0.1953 %

Serial, Parallel, Word

15 V

5,15 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

1.49 in (37.85 mm)

Binary

5962-9557901MLX

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

12

0.0122 %

Parallel, Word

15 V

-15 V

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T24

No

Binary

ADDAC85MILCBI-I/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

Bipolar

38535Q/M;38534H;883B

12

0.018 %

15 V

±15 V

-15 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

Complementary Binary, Complementary Offset Binary

AD7541ASD

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

12

2 mA

0.024 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

DAC100CCQ5/883C

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

Hybrid

38535Q/M;38534H;883B

10

375 ns

8.33 mA

0.2 %

15 V

±15 V

-15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Complementary Binary

DAC8413AT/883

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

4

BICMOS

38535Q/M;38534H;883B

12

12 mA

0.0183 %

Parallel, Word

15 V

5/±15 V

-15 V

In-Line

DIP28,.6

Other Converters

6 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

Binary

5962-01-364-9362

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

Bipolar

12

4 µs

0.018 %

±12/±15 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

1

No

Complementary Binary, Complementary Offset Binary

AD7541SQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

12

1 µs

2 mA

0.024 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

5962R8993201VFX

Analog Devices

Digital to Analog converter

Military

Flat

16

DFP

Rectangular

Ceramic, Metal-Sealed Cofired

18 V

Yes

1

8

Parallel, 8 Bits

15 V

-15 V

Flatpack

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-CDFP-F16

Yes

-10 V

Binary

PM7548BR

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

15 V

No

1

CMOS

12

1 µs

3 mA

0.012 %

Parallel, 8 Bits

15 V

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

Binary, Offset Binary

5962-9091101MXA

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

Bipolar

MIL-STD-883

12

183 mA

0.0427 %

Parallel, Word

5 V

-5.2 V

-5.2 V

In-Line

DIP28,.6

Other Converters

22 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

Binary

HDH-0802

Analog Devices

Digital to Analog converter

Military

Pin/Peg

24

DIP

Rectangular

Metal

.512 V

No

1

Bipolar

8

0.0977 %

Parallel, 8 Bits

15 V

-15 V

In-Line

DIP24,.6

Other Converters

200 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-MDIP-P24

0.175 in (4.45 mm)

0.6 in (15.24 mm)

No

e0

-.512 V

1.272 in (32.32 mm)

Binary, Offset Binary

5962-8770101RX

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

MIL-STD-883

8

Parallel, 8 Bits

5 V

In-Line

180 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

0.953 in (24.195 mm)

Binary, Offset Binary

5962-8965701LB

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

12

2 mA

Parallel, Word

15 V

In-Line

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

5962-8851001XC

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

11 V

No

4

CMOS

38535Q/M;38534H;883B

12

15 µs

35 mA

0.0183 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-11 V

Binary

PM7541BX/883C

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

1 µs

2 mA

0.024 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

DAC1508A-8Q

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

.5 V

No

1

Bipolar

8

0.19 %

Parallel, 8 Bits

5 V

5,-15 V

-15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T16

No

e0

-5 V

Binary

DAC08SQ5/38510

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

Bipolar

8

0 ns

7.8 mA

0.19 %

Parallel, 8 Bits

15 V

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

Binary

AD568SQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

.512 V

No

1

Bipolar

12

32 mA

0.0183 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP24,.3

Other Converters

50 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-.512 V

Binary, Offset Binary

AD7111TQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

8

1 mA

Parallel, 8 Bits

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

Binary

AD561-000C

Analog Devices

Digital to Analog converter

Military

No Lead

16

DIE

Rectangular

Yes

1

MIL-PRF-38534 Class K

10

Parallel, Word

5 V

-15 V

Uncased Chip

125 °C (257 °F)

-55 °C (-67 °F)

Upper

R-XUUC-N16

0.106 in (2.69 mm)

0.153 in (3.88 mm)

Binary

DAC8412BTC/883C

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

4

BICMOS

MIL-STD-883

12

12 mA

0.0366 %

Parallel, Word

5 V

5/±15 V

-5 V

Chip Carrier

LCC28,.45SQ

Other Converters

10 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

0.45 in (11.43 mm)

Binary

DAC-10BX/883

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

Bipolar

38535Q/M;38534H;883B

10

165 ns

15 mA

0.0488 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP18,.3

Other Converters

85 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

AD396TD

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

CMOS

14

15 µs

28 mA

0.0122 %

Parallel, 8 Bits

15 V

±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Offset Binary

AD7524SQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883 Class B

8

0 ns

2 mA

0.1953 %

Parallel, 8 Bits

5 V

5/15 V

In-Line

DIP16,.3

Other Converters

100 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

Binary

HDS-1250TM

Analog Devices

Digital to Analog converter

Military

Pin/Peg

24

DIP

Rectangular

Metal

.512 V

No

1

Hybrid

12

35 ns

54 mA

0.0366 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP24,.6

Other Converters

35 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-MDIP-P24

0.6 in (15.24 mm)

No

e0

-.512 V

1.272 in (32.3205 mm)

Binary, Offset Binary

5962-8851003XA

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

0 V

No

1

MIL-PRF-38534

12

0.0244 %

Parallel, Word

15 V

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-PDIP-T28

0.226 in (5.75 mm)

0.6 in (15.24 mm)

No

-10 V

1.575 in (40 mm)

Binary

AD7240SD

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

12

900 ns

2 mA

-0.0488 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T18

0.17 in (4.32 mm)

0.3 in (7.62 mm)

No

e0

0.9 in (22.865 mm)

Binary

DAC8043AZ

Analog Devices

Digital to Analog converter

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

15 V

No

1

CMOS

12

1 µs

500 μA

0.0122 %

Serial

5 V

5 V

In-Line

DIP8,.3

Other Converters

250 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

Offset Binary

5962-9176402MXA

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

9.9853 V

No

4

BICMOS

MIL-STD-883

12

15 µs

13 mA

0.0366 %

Parallel, Word

15 V

5/±15 V

-15 V

In-Line

DIP28,.6

Other Converters

6 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

Yes

e0

-9.9902 V

Binary

AD767SD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Bipolar

MIL-STD-883

12

4 µs

0.0122 %

Serial

15 V

-15 V

In-Line

DIP24,.3

3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T24

0.3 in (7.62 mm)

No

e0

-10 V

1.2 in (30.48 mm)

Binary, Offset Binary, 2's Complement Binary

5962-8851002XB

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

11 V

No

4

CMOS

12

0.0122 %

Parallel, Word

15 V

-15 V

In-Line

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-11 V

Binary

AD561/883B

Analog Devices

Digital to Analog converter

Military

10 V

1

MIL-STD-883 Class B

10

0.0244 %

Parallel, Word

5 V

-15 V

250 ns

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

No

e0

-2 V

Binary

PM7541AX/883C

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

1 µs

2 mA

0.012 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

AD395TM

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Metal

10 V

No

4

CMOS

MIL-STD-883 Class B

12

15 µs

28 mA

0.0244 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-MDIP-T28

0.205 in (5.21 mm)

0.6 in (15.24 mm)

No

e0

-10 V

1.57 in (39.88 mm)

Binary

AD7542GTQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 µs

2.5 mA

0.0122 %

Parallel, 4 Bits

5 V

5 V

In-Line

DIP16,.3

Other Converters

250 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

Binary, Offset Binary

PM7645AR

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

15 V

No

1

CMOS

12

1 µs

2 mA

0.012 %

Parallel, Word

15 V

15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

Binary, 2's Complement Binary

DAC8412AT/883

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

4

BICMOS

38535Q/M;38534H;883B

12

12 mA

0.0183 %

Parallel, Word

15 V

5/±15 V

-15 V

In-Line

DIP28,.6

Other Converters

6 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

Binary

AD667-000C

Analog Devices

Digital to Analog converter

Military

No Lead

28

DIE

Rectangular

Yes

1

MIL-PRF-38534 Class K

12

0.0122 %

Parallel, Word

15 V

-15 V

Uncased Chip

125 °C (257 °F)

-55 °C (-67 °F)

Upper

R-XUUC-N28

Binary

AD9700SD

Analog Devices

Digital to Analog converter

Military

Through-Hole

22

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

0 V

No

1

Bipolar

8

12 ns

155 mA

0.2 %

Parallel, 8 Bits

-5.2 V

-5.2 V

In-Line

DIP22,.3

Other Converters

10 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T22

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-.6375 V

Complementary Binary

AD7228AUQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

8

BICMOS

MIL-STD-883 Class B

8

5 µs

0.3906 %

Parallel, 8 Bits

15 V

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

0 V

Binary, Offset Binary

5962-9078502MLA

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

5 V

No

2

CMOS

MIL-STD-883

12

15 mA

0.0122 %

Parallel, Word

15 V

12/15,GND/-12/-15 V

-15 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

Yes

e0

-5 V

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.