Military Digital-to-Analog Converters 1,864

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

AD7548TQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

38535Q/M;38534H;883B

12

2 µs

3 mA

0.012 %

Parallel, 8 Bits

15 V

5/15 V

In-Line

DIP20,.3

Other Converters

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

AD5324SRMZ-EP-RL7

Analog Devices

Digital to Analog converter

Military

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

12

0.2441 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

8 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel Palladium Gold

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e4

260 °C (500 °F)

.25 V

0.118 in (3 mm)

Binary

PM7224BRC/883C

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic

Yes

1

BICMOS

38535Q/M;38534H;883B

8

5 µs

6 mA

0.39 %

12/15, GND/-5 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-XQCC-N20

No

e0

Binary

AD7226TQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

4

BICMOS

MIL-STD-883 Class B

8

20 µs

13 mA

0.3906 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

In-Line

DIP20,.3

Other Converters

3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

5962-01-334-6946

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

Bipolar

38535Q/M;38534H;883B

8

3 µs

25 mA

0.15 %

5/15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T16

No

Binary

AD667/883B

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 V

Yes

1

12

0.0244 %

Parallel, Word

12 V

-12 V

Chip Carrier

3 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

-10 V

0.45 in (11.43 mm)

Binary, Offset Binary

5962-89481012C

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

12

2 mA

Parallel, Word

Chip Carrier

600 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

0.35 in (8.89 mm)

Binary

5962-01-287-3933

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

12

2 mA

0.05 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

Binary, Offset Binary

DAC8221BTC/883C

Analog Devices

Digital to Analog converter

Military

No Lead

24

QCCN

Rectangular

Ceramic, Metal-Sealed Cofired

Yes

2

CMOS

MIL-STD-883

12

1 µs

2 mA

0.0244 %

Parallel, Word

5 V

5/15 V

Chip Carrier

LCC28,.45SQ

Other Converters

450 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

R-CQCC-N24

No

e0

Binary, Offset Binary

AD7527GUD

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

1

CMOS

10

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

Binary

AD9713BSQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

Bipolar

38535Q/M;38534H;883B

12

188 mA

0.0488 %

Parallel, Word

5 V

5,-5.2 V

-5.2 V

In-Line

DIP28,.6

Other Converters

27 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

Binary

AD7228ATQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

8

BICMOS

MIL-STD-883 Class B

8

5 µs

0.7812 %

Parallel, 8 Bits

15 V

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

0 V

Binary, Offset Binary

AD7225TE

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

5 V

Yes

4

BICMOS

8

5 µs

12 mA

0.3906 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

Chip Carrier

LCC28,.45SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

-5 V

0.45 in (11.43 mm)

Binary

AD7535TQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883 Class B

14

1.5 µs

4 mA

0.0061 %

Parallel, Word

12 V

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

Binary, Offset Binary

AD394TM

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Metal

10 V

No

4

CMOS

MIL-STD-883 Class B

12

15 µs

28 mA

0.0244 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-MDIP-T28

0.205 in (5.21 mm)

0.6 in (15.24 mm)

No

e0

-10 V

1.57 in (39.88 mm)

Binary

5962-8865901XA

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

Bipolar

38535Q/M;38534H;883B

12

4 µs

25 mA

0.018 %

Parallel, Word

15 V

±12/±15 V

-15 V

In-Line

DIP28,.6

Other Converters

3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

Yes

e0

Binary

5962-01-160-4988

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Metal

No

1

Hybrid

38535Q/M;38534H;883B

12

35 ns

54 mA

0.012 %

15 V

±15 V

-15 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-MDIP-T24

No

Binary, Offset Binary

M38510/13301BEX

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

10

0.0488 %

Parallel, Word

5 V

-15 V

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-CDIP-T16

Yes

-2 V

Binary

PM7528BR

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

15 V

No

2

CMOS

8

0 ns

1 mA

0.195 %

Parallel, 8 Bits

15 V

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

Binary, Offset Binary

AD7248TD

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

5 V

No

1

CMOS

12

0.0244 %

Parallel, Word

12 V

-12 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-5 V

Binary

AD7545GUE

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

12

2 µs

2 mA

0.0122 %

Parallel, Word

5 V

5/15 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary

AD394TD

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

11 V

No

4

CMOS

12

15 µs

28 mA

0.0122 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead (Sn63Pb37)

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-11 V

Offset Binary

5962-8778902EX

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Bipolar

8

Parallel, 8 Bits

5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-CDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

0 V

0.75 in (19.05 mm)

Binary

AD7522UD

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

10

0.0977 %

Serial, Parallel, Word

15 V

5,15 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.6 in (15.24 mm)

No

e0

1.397 in (35.49 mm)

Binary

5962-8850901XC

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

4

Hybrid

38535Q/M;38534H;883B

12

8 µs

120 mA

0.0244 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP28,.6

Other Converters

4 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Binary

5962-8770002EB

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883

8

1.9531 %

Parallel, 8 Bits

5 V

In-Line

100 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

Binary

HDS-0810EM

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Metal

No

1

Bipolar

8

10 ns

-5.2 V

-5.2 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-MDIP-T24

No

e0

Binary

AD7521SQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

500 ns

2 mA

0.2 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

8300201JC

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Bipolar

38535Q/M;38534H;883B

12

7 µs

0.0183 %

Parallel, Word

15 V

5,±15 V

-15 V

In-Line

DIP24,.6

Other Converters

5 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T24

0.138 in (3.5 mm)

0.6 in (15.24 mm)

No

e0

-10 V

1.21 in (30.73 mm)

Binary

AD667SE

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 V

Yes

1

Bipolar

12

4 µs

0.0183 %

Parallel, Word

12 V

-12 V

Chip Carrier

LCC28,.45SQ

3 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel Palladium Gold

Quad

S-CQCC-N28

0.09 in (2.29 mm)

0.45 in (11.43 mm)

No

e4

-10 V

0.45 in (11.43 mm)

Binary, Offset Binary, 2's Complement Binary

5962-91764023X

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

9.9853 V

Yes

4

BICMOS

12

0.0366 %

Parallel, Word

15 V

-15 V

Chip Carrier

6 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

-9.9902 V

0.45 in (11.43 mm)

Binary

5962-8770102RX

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

MIL-STD-883

8

Parallel, 8 Bits

5 V

In-Line

180 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

0.953 in (24.195 mm)

Binary, Offset Binary

AD7111UD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

8

4 mA

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Complementary Binary

AD7524UE

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

8

0 ns

2 mA

0.0488 %

Parallel, 8 Bits

5 V

5/15 V

Chip Carrier

LCC20,.35SQ

Other Converters

500 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary

AD7524SRZ-EP-RL7

Analog Devices

Digital to Analog converter

Military

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

8

0.1953 %

Parallel, Word

5 V

Small Outline

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

30 s

260 °C (500 °F)

0.39 in (9.9 mm)

Binary

AD667SD

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Bipolar

12

4 µs

0.0183 %

Parallel, Word

12 V

-12 V

In-Line

DIP28,.6

3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-10 V

1.41 in (35.815 mm)

Binary, Offset Binary, 2's Complement Binary

5962-91764043X

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

9.9853 V

Yes

4

BICMOS

12

0.0366 %

Parallel, Word

15 V

-15 V

Chip Carrier

6 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

-9.9902 V

0.45 in (11.43 mm)

Binary

5962-9164701MLA

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

2

CMOS

MIL-STD-883

14

4 µs

28 mA

0.0122 %

Serial

5 V

±5 V

-5 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T24

Yes

e0

Binary

AD7525UD

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

1 mA

0.025 %

15 V

15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary Coded Decimal

DAC01BY/883C

Analog Devices

Digital to Analog converter

Military

Through-Hole

14

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

11.89 V

No

1

Bipolar

MIL-STD-883 Class C

6

3 µs

9.3 mA

0.45 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP14,.3

Other Converters

1.5 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-CDIP-T14

No

e0

-11.89 V

Binary

AD7543SQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 µs

2.5 mA

0.024 %

Serial

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

Binary

5962-89657023B

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

2

CMOS

12

2 mA

Parallel, Word

15 V

Chip Carrier

800 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

0.45 in (11.43 mm)

Binary, Offset Binary

5962-8770205RA

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883

12

2 mA

0.012207 %

Parallel, Word

5 V

In-Line

DIP20(UNSPEC)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-CDIP-T20

No

Binary

5962-9078501MLX

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

5 V

No

2

CMOS

12

0.0122 %

Parallel, Word

15 V

-15 V

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T24

Yes

-5 V

Binary

5962-01-331-5637

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

2

CMOS

38535Q/M;38534H;883B

8

600 ns

2 mA

0.2 %

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T20

1

No

Binary, Offset Binary

AD7544SD

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

1

CMOS

12

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

Binary

5962R0820101VZA

Analog Devices

Digital to Analog converter

Military

Flat

28

DFP

Rectangular

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

Yes

1

BICMOS

MIL-PRF-38535 Class V

16

35 ns

40 mA

0.0183 %

Parallel, Word

5 V

±5 V

-5 V

Flatpack

FL28,.5

Other Converters

35 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-CDFP-F28

No

Binary

DAC08Q/883

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

18 V

No

1

Bipolar

MIL-STD-883

8

150 ns

7.8 mA

0.19 %

Parallel, 8 Bits

15 V

±15 V

-15 V

In-Line

DIP16,.3

Other Converters

85 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-10 V

0.75 in (19.05 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.