FBGA Other Function Interface ICs 38

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Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

NTS0104UK-Q100Z

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

AEC-Q100

1.8/3.3,2.5/5

GRID ARRAY, FINE PITCH

BGA12,3X4,16

Other Interface ICs

.4 mm

125 Cel

-40 Cel

BOTTOM

R-PBGA-B12

Not Qualified

MAX3007EBP

Maxim Integrated

INDUSTRIAL

BALL

20

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA20,4X5,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B20

1

Not Qualified

e0

MAX13044EEBC+

Analog Devices

INDUSTRIAL

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

2.5/3.3

GRID ARRAY, FINE PITCH

BGA12,3X4,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

BOTTOM

R-PBGA-B12

Not Qualified

e3

MAX13045EEBC+

Analog Devices

INDUSTRIAL

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

2.5/3.3

GRID ARRAY, FINE PITCH

BGA12,3X4,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

BOTTOM

R-PBGA-B12

Not Qualified

e3

NTB0104UK-Q100Z

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

AEC-Q100

1.2/3.6,1.8/5

GRID ARRAY, FINE PITCH

BGA12,3X4,16

Other Interface ICs

.4 mm

125 Cel

-40 Cel

BOTTOM

R-PBGA-B12

Not Qualified

IP4853CX24/LF/P,13

NXP Semiconductors

OTHER

BALL

24

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.8 V

1.8

GRID ARRAY, FINE PITCH

BGA24,5X5,16

Other Interface ICs

.4 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B24

Not Qualified

IP4853CX24,135

NXP Semiconductors

OTHER

BALL

24

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.8 V

1.8

GRID ARRAY, FINE PITCH

BGA24,5X5,16

Other Interface ICs

.4 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B24

Not Qualified

IP4853CX24/LF/T3

NXP Semiconductors

OTHER

BALL

24

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.8 V

1.8

GRID ARRAY, FINE PITCH

BGA24,5X5,16

Other Interface ICs

.4 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B24

Not Qualified

IP4853CX24/P,135

NXP Semiconductors

OTHER

BALL

24

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.8 V

1.8

GRID ARRAY, FINE PITCH

BGA24,5X5,16

Other Interface ICs

.4 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B24

Not Qualified

PI2EQX4402NBX

Diodes Incorporated

COMMERCIAL

BALL

84

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.8 V

1.8

GRID ARRAY, FINE PITCH

BGA84,10X10,32

Other Interface ICs

.8 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

S-PBGA-B84

Not Qualified

e0

PI2EQX3202NBX

Diodes Incorporated

COMMERCIAL

BALL

84

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.8 V

1.8

GRID ARRAY, FINE PITCH

BGA84,10X10,32

Other Interface ICs

.8 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B84

Not Qualified

PI2EQX3202NBEX

Diodes Incorporated

COMMERCIAL

BALL

84

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.8 V

1.8

GRID ARRAY, FINE PITCH

BGA84,10X10,32

Other Interface ICs

.8 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B84

Not Qualified

MAX3372EEBL

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

8

FBGA

SQUARE

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA8,3X3,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B8

1

Not Qualified

e0

MAX3393EEBC

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA12,3X4,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

Not Qualified

e0

MAX3376EEBL

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

8

FBGA

SQUARE

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA8,3X3,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B8

1

Not Qualified

e0

MAX3395EEBC-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA12,3X4,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B12

Not Qualified

e0

MAX3373EEBL

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

8

FBGA

SQUARE

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA8,3X3,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B8

Not Qualified

MAX3001EEBP

Maxim Integrated

INDUSTRIAL

BALL

20

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA20,4X5,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B20

1

Not Qualified

e0

MAX3392EEBC

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA12,3X4,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

Not Qualified

e0

MAX3003EBP

Maxim Integrated

INDUSTRIAL

BALL

20

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA20,4X5,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B20

1

Not Qualified

e0

MAX3374EEBL

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

8

FBGA

SQUARE

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA8,3X3,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B8

1

Not Qualified

e0

MAX13043EEBC+

Maxim Integrated

INDUSTRIAL

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

2.5/3.3

GRID ARRAY, FINE PITCH

BGA12,3X4,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

Not Qualified

e1

30

260

MAX3390EEBC

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA12,3X4,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

Not Qualified

e0

MAX3379EEBC

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA12,3X4,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

Not Qualified

e0

MAX3377EEBC

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA12,3X4,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

Not Qualified

e0

MAX3013EBP+T

Maxim Integrated

INDUSTRIAL

BALL

20

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

1.8/3.3

GRID ARRAY, FINE PITCH

BGA20,4X5,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B20

Not Qualified

MAX3375EEBL

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

8

FBGA

SQUARE

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA8,3X3,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

Tin/Lead (Sn63Pb37)

BOTTOM

S-PBGA-B8

1

Not Qualified

e0

MAX3394EEBL

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

9

FBGA

SQUARE

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA9,3X3,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

S-PBGA-B9

Not Qualified

e0

MAX3000EEBP

Maxim Integrated

INDUSTRIAL

BALL

20

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA20,4X5,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B20

Not Qualified

MAX13013EBT+T

Maxim Integrated

INDUSTRIAL

BALL

6

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

1.8/3.3

GRID ARRAY, FINE PITCH

BGA6,2X3,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B6

1

Not Qualified

e1

30

260

TC7LX1101WBG(EL)

Toshiba

INTERFACE CIRCUIT

INDUSTRIAL

BALL

6

FBGA

RECTANGULAR

PLASTIC

YES

CMOS

1.2/3.6

GRID ARRAY, FINE PITCH

BGA6,2X3,16

Other Interface ICs

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B6

Not Qualified

T3GE9WBG(EL)

Toshiba

OTHER

BALL

24

FBGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

1.8,2.9

GRID ARRAY, FINE PITCH

BGA24,5X5,16

Other Interface ICs

.4 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B24

Not Qualified

T3GF3WBG(EL)

Toshiba

OTHER

BALL

25

FBGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

1.8 V

1.8

GRID ARRAY, FINE PITCH

BGA25,5X5,16

Other Interface ICs

.4 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B25

Not Qualified

TC7LX1108WBG(EL)

Toshiba

INTERFACE CIRCUIT

INDUSTRIAL

BALL

24

FBGA

SQUARE

PLASTIC

YES

CMOS

1.5/3.3

GRID ARRAY, FINE PITCH

BGA24,5X5,16

Other Interface ICs

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B24

Not Qualified

TC7LX1204WBG(EL)

Toshiba

INTERFACE CIRCUIT

INDUSTRIAL

BALL

24

FBGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

1.2/3.3

GRID ARRAY, FINE PITCH

BGA24,5X5,16

Other Interface ICs

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B24

Not Qualified

TC7LX1102WBG(EL)

Toshiba

INTERFACE CIRCUIT

INDUSTRIAL

BALL

8

FBGA

RECTANGULAR

PLASTIC

YES

CMOS

1.2/3.3

GRID ARRAY, FINE PITCH

BGA8,2X4,16

Other Interface ICs

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B8

Not Qualified

TC7LX1104WBG(EL)

Toshiba

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

1.2/3.6

GRID ARRAY, FINE PITCH

BGA12,3X4,16

Other Interface ICs

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B12

Not Qualified

UPD16520AFH-2Q1-E4-A

Renesas Electronics

COMMERCIAL

BALL

42

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

2/5.5

GRID ARRAY, FINE PITCH

BGA42,5X9,20

Other Interface ICs

.5 mm

70 Cel

-20 Cel

BOTTOM

R-PBGA-B42

Not Qualified

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.