BUS EXCHANGER Bus Driver & Transceivers 1,018

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	No. of Inputs	No. of Bits	Translation	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Count Direction	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	No. of Ports	Control Type	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Output Polarity	Minimum Supply Voltage (Vsup)	Maximum Power Supply Current (ICC)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	Family
935270186118	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	12				2			5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.25 ns			.5 mm	85 Cel		3-STATE	-40 Cel		DUAL	4		R-PDSO-G56		5.5 V	1.2 mm	6.1 mm	Not Qualified	TRUE	4.5 V				NOT SPECIFIED		NOT SPECIFIED	14 mm
935270391112	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	12				2			5			SMALL OUTLINE, SHRINK PITCH		.25 ns			.635 mm	85 Cel		3-STATE	-40 Cel		DUAL	4		R-PDSO-G56		5.5 V	2.8 mm	7.5 mm	Not Qualified	TRUE	4 V				NOT SPECIFIED		NOT SPECIFIED	18.425 mm
935260345518	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			12			2.5			SMALL OUTLINE, SHRINK PITCH		6.2 ns			.635 mm	85 Cel		3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	3		R-PDSO-G56		2.7 V	2.8 mm	7.5 mm		TRUE	2.3 V		USER SELECTABLE 3.3V VCC	e4				18.425 mm	ALVT
935270444112	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				12			5			SMALL OUTLINE, SHRINK PITCH		.25 ns			.635 mm	85 Cel		3-STATE	-40 Cel		DUAL	4		R-PDSO-G56		5.5 V	2.8 mm	7.5 mm	Not Qualified	TRUE	4.5 V				NOT SPECIFIED		NOT SPECIFIED	18.425 mm
935260344112	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			12	N/A	TUBE	2.5		50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	6.2 ns	64 Amp		.5 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel		DUAL	3	ENABLE LOW	R-PDSO-G56		2.7 V	1.2 mm	6.25 mm	Not Qualified	TRUE	2.3 V		USER SELECTABLE 3.3V VCC		NOT SPECIFIED		NOT SPECIFIED	14.15 mm	ALVT
935260345118	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			12	N/A	TR, 13 INCH	2.5		50 pF	SMALL OUTLINE, SHRINK PITCH	SSOP56,.4	6.2 ns	64 Amp		.635 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel		DUAL	3	ENABLE LOW	R-PDSO-G56		2.7 V	2.8 mm	7.5 mm	Not Qualified	TRUE	2.3 V		USER SELECTABLE 3.3V VCC		NOT SPECIFIED		NOT SPECIFIED	18.425 mm	ALVT
935270444118	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	12				2			5			SMALL OUTLINE, SHRINK PITCH		.25 ns			.635 mm	85 Cel		3-STATE	-40 Cel		DUAL	4		R-PDSO-G56		5.5 V	2.8 mm	7.5 mm	Not Qualified	TRUE	4.5 V				NOT SPECIFIED		NOT SPECIFIED	18.425 mm
935270443112	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	12				2			5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.25 ns			.5 mm	85 Cel		3-STATE	-40 Cel		DUAL	4		R-PDSO-G56		5.5 V	1.2 mm	6.1 mm	Not Qualified	TRUE	4.5 V				NOT SPECIFIED		NOT SPECIFIED	14 mm
935270385118	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				12			5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.25 ns			.5 mm	85 Cel		3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	4		R-PDSO-G56	1	5.5 V	1.2 mm	6.1 mm	Not Qualified	TRUE	4 V			e4				14 mm
935275803118	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1	N/A	TR, 13 INCH	2.5		15 pF	SMALL OUTLINE	SOP14,.25	.3 ns			1.27 mm	85 Cel	BIDIRECTIONAL	OPEN-DRAIN	-40 Cel		DUAL	2	COMMON CONTROL	R-PDSO-G14		3.6 V	1.75 mm	3.9 mm		TRUE	2.3 V	.1 mA	ALSO OPERATES AT 4.5 TO 5.5 SUPPLY					8.65 mm	9543
935260344118	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			12	N/A	TR, 13 INCH	2.5		50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	6.2 ns	64 Amp		.5 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel		DUAL	3	ENABLE LOW	R-PDSO-G56		2.7 V	1.2 mm	6.25 mm	Not Qualified	TRUE	2.3 V		USER SELECTABLE 3.3V VCC		NOT SPECIFIED		NOT SPECIFIED	14.15 mm	ALVT
935270187112	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	12				2			5			SMALL OUTLINE, SHRINK PITCH		.25 ns			.635 mm	85 Cel		3-STATE	-40 Cel		DUAL	4		R-PDSO-G56		5.5 V	2.8 mm	7.5 mm	Not Qualified	TRUE	4.5 V				NOT SPECIFIED		NOT SPECIFIED	18.425 mm
BT16260DGG-T	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			12			5		50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	5.8 ns	64 Amp		.5 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel		DUAL	3	ENABLE LOW	R-PDSO-G56		5.5 V	1.2 mm	6.25 mm	Not Qualified	TRUE	4.5 V							14.15 mm	ABT
935260345512	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			12			2.5			SMALL OUTLINE, SHRINK PITCH		6.2 ns			.635 mm	85 Cel		3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	3		R-PDSO-G56		2.7 V	2.8 mm	7.5 mm		TRUE	2.3 V		USER SELECTABLE 3.3V VCC	e4				18.425 mm	ALVT
935270443118	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	12				2			5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.25 ns			.5 mm	85 Cel		3-STATE	-40 Cel		DUAL	4		R-PDSO-G56		5.5 V	1.2 mm	6.1 mm	Not Qualified	TRUE	4.5 V				NOT SPECIFIED		NOT SPECIFIED	14 mm
935283305118	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1	N/A	TR, 13 INCH	2.5		15 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	.3 ns			.65 mm	85 Cel	BIDIRECTIONAL	OPEN-DRAIN	-40 Cel		DUAL	2	COMMON CONTROL	R-PDSO-G14		3.6 V	1.1 mm	4.4 mm		TRUE	2.3 V	.1 mA	ALSO OPERATES AT 4.5 TO 5.5 SUPPLY					5 mm	9543
74CBTLV3257D,118	NXP Semiconductors	BUS EXCHANGER	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1	4			2.5	2.5/3.3	50 pF	SMALL OUTLINE	SOP16,.25	.25 ns		Other Logic ICs	1.27 mm	125 Cel	BIDIRECTIONAL	3-STATE	-40 Cel		DUAL	3	ENABLE LOW	R-PDSO-G16	1	3.6 V	1.75 mm	3.9 mm	Not Qualified	TRUE	2.3 V	.05 mA			30	2	260	9.9 mm	CBTLV/3B
74CBTLV3257D	NXP Semiconductors	BUS EXCHANGER	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1	4			2.5		50 pF	SMALL OUTLINE	SOP16,.25	.25 ns			1.27 mm	125 Cel	BIDIRECTIONAL	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	3	ENABLE LOW	R-PDSO-G16	1	3.6 V	1.75 mm	3.9 mm	Not Qualified	TRUE	2.3 V	.05 mA		e4		2		9.9 mm	CBTLV/3B
74CBTLV3253D	NXP Semiconductors	BUS EXCHANGER	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS			4	N/A		3.3			SMALL OUTLINE	SOP16,.25	.25 ns			1.27 mm	125 Cel	BIDIRECTIONAL	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2	ENABLE LOW	R-PDSO-G16	1	3.6 V	1.75 mm	3.9 mm	Not Qualified	TRUE	2.3 V	.05 mA		e4				9.9 mm	CBTLV/3B
74CBTLV3257PW-Q100	NXP Semiconductors	BUS EXCHANGER	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	1	4			2.5		50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	.25 ns			.65 mm	125 Cel	BIDIRECTIONAL	3-STATE	-40 Cel		DUAL	3	ENABLE LOW	R-PDSO-G16		3.6 V	1.1 mm	4.4 mm		TRUE	2.3 V	.05 mA				2		5 mm	CBTLV/3B
74CBTLV3253PW-Q100,118	NXP Semiconductors	BUS EXCHANGER	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	AEC-Q100		4	N/A	TR, 13 INCH	2.5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	.25 ns			.65 mm	125 Cel	BIDIRECTIONAL	3-STATE	-40 Cel		DUAL	2	ENABLE LOW	R-PDSO-G16		3.6 V	1.1 mm	4.4 mm		TRUE	2.3 V	.05 mA						5 mm	CBTLV/3B
74CBTLV3257DS	NXP Semiconductors	BUS EXCHANGER	AUTOMOTIVE	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1	4			2.5		50 pF	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	.25 ns			.635 mm	125 Cel	BIDIRECTIONAL	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	3	ENABLE LOW	R-PDSO-G16	1	3.6 V	1.73 mm	3.9 mm	Not Qualified	TRUE	2.3 V	.05 mA		e4		2		4.9 mm	CBTLV/3B
74ABTH16260DL-T	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			12			5			SMALL OUTLINE, SHRINK PITCH		5.8 ns			.635 mm	85 Cel		3-STATE	-40 Cel		DUAL	3		R-PDSO-G56		5.5 V	2.8 mm	7.5 mm	Not Qualified	TRUE	4.5 V							18.425 mm	ABT
74CBTLV3253PW-Q10J	NXP Semiconductors	BUS EXCHANGER	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	AEC-Q100		4	N/A		2.5	2.5/3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	.25 ns		Other Logic ICs	.65 mm	125 Cel	BIDIRECTIONAL	3-STATE	-40 Cel		DUAL	2	ENABLE LOW	R-PDSO-G16		3.6 V	1.1 mm	4.4 mm	Not Qualified	TRUE	2.3 V	.05 mA						5 mm	CBTLV/3B
74CBTLV3253PW-Q100	NXP Semiconductors	BUS EXCHANGER	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	AEC-Q100		4	N/A		2.5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	.25 ns			.65 mm	125 Cel	BIDIRECTIONAL	3-STATE	-40 Cel		DUAL	2	ENABLE LOW	R-PDSO-G16	1	3.6 V	1.1 mm	4.4 mm		TRUE	2.3 V	.05 mA						5 mm	CBTLV/3B
74CBTLV3257DS,118	NXP Semiconductors	BUS EXCHANGER	AUTOMOTIVE	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1	4			2.5	2.5/3.3	50 pF	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	.25 ns		Other Logic ICs	.635 mm	125 Cel	BIDIRECTIONAL	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	3	ENABLE LOW	R-PDSO-G16	1	3.6 V	1.73 mm	3.9 mm	Not Qualified	TRUE	2.3 V	.05 mA		e4	30	2	260	4.9 mm	CBTLV/3B
74CBTLV3257BQ	NXP Semiconductors	BUS EXCHANGER	AUTOMOTIVE	NO LEAD	16	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1	4			2.5		50 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.1X.14,20	.25 ns			.5 mm	125 Cel	BIDIRECTIONAL	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	3	ENABLE LOW	R-PQCC-N16	1	3.6 V	1 mm	2.5 mm	Not Qualified	TRUE	2.3 V	.05 mA		e4		2		3.5 mm	CBTLV/3B
74ABT16260DL-T	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	12	BICMOS			1	N/A		5		50 pF	SMALL OUTLINE, SHRINK PITCH	SSOP56,.4	5.8 ns	64 Amp		.635 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel		DUAL	3	ENABLE LOW	R-PDSO-G56		5.5 V	2.8 mm	7.5 mm	Not Qualified	TRUE	4.5 V							18.425 mm	ABT
74ALVT16260DGG,118	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			12	N/A	TR, 13 INCH	2.5		50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	6.2 ns	64 Amp		.5 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	3	ENABLE LOW	R-PDSO-G56	1	2.7 V	1.2 mm	6.25 mm	Not Qualified	TRUE	2.3 V		USER SELECTABLE 3.3V VCC	e4				14.15 mm	ALVT
74ALVT16260DGG-T	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			12			2.5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		6.2 ns			.5 mm	85 Cel		3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	3		R-PDSO-G56	1	2.7 V	1.2 mm	6.25 mm	Not Qualified	TRUE	2.3 V		USER SELECTABLE 3.3V VCC	e4				14.15 mm	ALVT
74CBTLV3253DS	NXP Semiconductors	BUS EXCHANGER	AUTOMOTIVE	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS			4	N/A		3.3			SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	.25 ns			.635 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel		DUAL	2	ENABLE LOW	R-PDSO-G16	1	3.6 V	1.73 mm	3.9 mm	Not Qualified	TRUE	2.3 V	.01 mA						4.9 mm	CBTLV/3B
74ALVT16260DGG,112	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		12	12	N/A	TUBE	2.5		50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	6.2 ns	64 Amp		.5 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel		DUAL	3	ENABLE LOW	R-PDSO-G56		2.7 V	1.2 mm	6.25 mm	Not Qualified	TRUE	2.3 V		USER SELECTABLE 3.3V VCC			1		14.15 mm	ALVT
74ABT16260DL,512	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	12	BICMOS			1	N/A		5	5	50 pF	SMALL OUTLINE, SHRINK PITCH	SSOP56,.4	5.8 ns	64 Amp	Other Logic ICs	.635 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel		DUAL	3	ENABLE LOW	R-PDSO-G56	1	5.5 V	2.8 mm	7.5 mm	Not Qualified	TRUE	4.5 V							18.425 mm	ABT
74ALVT16260DL,112	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			12			2.5			SMALL OUTLINE, SHRINK PITCH		6.2 ns			.635 mm	85 Cel		3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	3		R-PDSO-G56		2.7 V	2.8 mm	7.5 mm		TRUE	2.3 V		USER SELECTABLE 3.3V VCC	e4				18.425 mm	ALVT
74CBTLV3253BQ,115	NXP Semiconductors	BUS EXCHANGER	AUTOMOTIVE	NO LEAD	16	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS			4	N/A	TR, 7 INCH	3.3	2.5/3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.1X.14,20	.25 ns		Other Logic ICs	.5 mm	125 Cel	BIDIRECTIONAL	3-STATE	-40 Cel		QUAD	2	ENABLE LOW	R-PQCC-N16	1	3.6 V	1 mm	2.5 mm	Not Qualified	TRUE	2.3 V	.05 mA			30		260	3.5 mm	CBTLV/3B
74CBTLV3253D-Q100J	NXP Semiconductors	BUS EXCHANGER	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	AEC-Q100		4	N/A		2.5	2.5/3.3		SMALL OUTLINE	SOP16,.25	.25 ns		Other Logic ICs	1.27 mm	125 Cel	BIDIRECTIONAL	3-STATE	-40 Cel		DUAL	2	ENABLE LOW	R-PDSO-G16		3.6 V	1.75 mm	3.9 mm	Not Qualified	TRUE	2.3 V	.05 mA						9.9 mm	CBTLV/3B
CBTL02043BBQ	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	NO LEAD	20	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			4		TR, 7 INCH	3.3		50 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.1X.18,20				.5 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	3		R-PQCC-N20	1	3.6 V	1 mm	2.5 mm	Not Qualified	TRUE	3 V	2.5 mA		e4				4.5 mm	CBT/FST/QS/5C/B
74ALVT16260DGG	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			12			2.5	2.5/3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	6.2 ns		Other Logic ICs	.5 mm	85 Cel		3-STATE	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	3		R-PDSO-G56	1	2.7 V	1.2 mm	6.25 mm	Not Qualified	TRUE	2.3 V		USER SELECTABLE 3.3V VCC	e4	30		260	14.15 mm	ALVT
74CBTLV3257DS-Q100	NXP Semiconductors	BUS EXCHANGER	AUTOMOTIVE	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	1	4			2.5		50 pF	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	.25 ns			.635 mm	125 Cel	BIDIRECTIONAL	3-STATE	-40 Cel		DUAL	3	ENABLE LOW	R-PDSO-G16		3.6 V	1.73 mm	3.9 mm		TRUE	2.3 V	.05 mA				2		4.9 mm	CBTLV/3B
CBTL02043BBQ,115	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	NO LEAD	20	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			4		TR, 7 INCH	3.3		50 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.1X.18,20				.5 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel	MATTE TIN	QUAD	3		R-PQCC-N20	1	3.6 V	1 mm	2.5 mm		TRUE	3 V	2.5 mA		e3	30		260	4.5 mm	CBT/FST/QS/5C/B
74ABT16260DGG-T	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			12			5		50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	5.8 ns	64 Amp		.5 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel		DUAL	3	ENABLE LOW	R-PDSO-G56		5.5 V	1.2 mm	6.25 mm	Not Qualified	TRUE	4.5 V							14.15 mm	ABT
74CBTLV3253BQ	NXP Semiconductors	BUS EXCHANGER	AUTOMOTIVE	NO LEAD	16	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS			4	N/A		3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.1X.14,20	.25 ns			.5 mm	125 Cel	BIDIRECTIONAL	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	2	ENABLE LOW	R-PQCC-N16	1	3.6 V	1 mm	2.5 mm	Not Qualified	TRUE	2.3 V	.05 mA		e4				3.5 mm	CBTLV/3B
74ABTH16260DL	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			12			5	5		SMALL OUTLINE, SHRINK PITCH	SSOP56,.4	5.8 ns		Other Logic ICs	.635 mm	85 Cel		3-STATE	-40 Cel		DUAL	3		R-PDSO-G56	1	5.5 V	2.8 mm	7.5 mm	Not Qualified	TRUE	4.5 V							18.425 mm	ABT
74ABT16260DL	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	12	BICMOS			1	N/A		5	5	50 pF	SMALL OUTLINE, SHRINK PITCH	SSOP56,.4	5.8 ns	64 Amp	Other Logic ICs	.635 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel		DUAL	3	ENABLE LOW	R-PDSO-G56		5.5 V	2.8 mm	7.5 mm	Not Qualified	TRUE	4.5 V				NOT SPECIFIED		NOT SPECIFIED	18.425 mm	ABT
74ALVT16260DL,518	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			12	N/A		2.5		50 pF	SMALL OUTLINE, SHRINK PITCH	SSOP56,.4	6.2 ns	64 Amp		.635 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel		DUAL	3	ENABLE LOW	R-PDSO-G56	2	2.7 V	2.8 mm	7.5 mm	Not Qualified	TRUE	2.3 V		USER SELECTABLE 3.3V VCC		40		260	18.425 mm	ALVT
74CBTLV3253BQ-Q100	NXP Semiconductors	BUS EXCHANGER	AUTOMOTIVE	NO LEAD	16	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	AEC-Q100		4	N/A		2.5			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.1X.14,20	.25 ns			.5 mm	125 Cel	BIDIRECTIONAL	3-STATE	-40 Cel		QUAD	2	ENABLE LOW	R-PQCC-N16	1	3.6 V	1 mm	2.5 mm		TRUE	2.3 V	.05 mA						3.5 mm	CBTLV/3B
74CBTLV3257BQ-Q100	NXP Semiconductors	BUS EXCHANGER	AUTOMOTIVE	NO LEAD	16	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	1	4			2.5		50 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.1X.14,20	.25 ns			.5 mm	125 Cel	BIDIRECTIONAL	3-STATE	-40 Cel		QUAD	3	ENABLE LOW	R-PQCC-N16		3.6 V	1 mm	2.5 mm		TRUE	2.3 V	.05 mA				2		3.5 mm	CBTLV/3B
74CBTLV3257PW	NXP Semiconductors	BUS EXCHANGER	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1	4			2.5		50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	.25 ns			.65 mm	125 Cel	BIDIRECTIONAL	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	3	ENABLE LOW	R-PDSO-G16	1	3.6 V	1.1 mm	4.4 mm	Not Qualified	TRUE	2.3 V	.05 mA		e4		2		5 mm	CBTLV/3B

Bus Driver & Transceivers

A bus driver is an electronic component that manages communication between different components or devices in a computer system. It serves as an intermediary between the CPU and other components, such as memory, input/output devices, and expansion cards. The bus driver receives signals from the CPU and routes them to the appropriate component based on the address and control signals provided.

The bus driver also manages the timing of data transfer between components and ensures that the data is transferred at the correct speed and in the correct format. It may also perform error checking and correction to ensure that the data is transferred accurately.

Transceivers, on the other hand, are electronic devices that transmit and receive data signals over a communication channel. They are commonly used in telecommunications, networking, and computer systems. Transceivers can be either analog or digital and may transmit data using various modulation schemes, such as amplitude modulation (AM), frequency modulation (FM), or phase modulation (PM).

In computer systems, transceivers are commonly used to transmit and receive data over network cables, such as Ethernet cables or fiber optic cables. They may also be used to transmit and receive data over wireless networks, such as Wi-Fi or Bluetooth.

Transceivers typically include a transmitter, a receiver, and a signal processing unit that modulates and demodulates the data signals. They may also include error correction and signal amplification circuitry to improve the quality of the transmitted data.