BUS EXCHANGER Bus Driver & Transceivers 1,018

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	No. of Inputs	No. of Bits	Translation	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Count Direction	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	No. of Ports	Control Type	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Output Polarity	Minimum Supply Voltage (Vsup)	Maximum Power Supply Current (ICC)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	Family
CBT3253AD,112	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4	N/A		5	5		SMALL OUTLINE	SOP16,.25	.25 ns	Other Logic ICs	1.27 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	2	ENABLE LOW	R-PDSO-G16	1	5.5 V	1.75 mm	3.9 mm	Not Qualified	TRUE	4.5 V	.003 mA	e4	30	4	260	9.9 mm	CBT/FST/QS/5C/B
CBTD16212DL	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		12			5	5		SMALL OUTLINE, SHRINK PITCH	SSOP56,.4	.25 ns	Other Logic ICs	.635 mm	85 Cel		3-STATE	-40 Cel		DUAL	4		R-PDSO-G56		5.5 V	2.8 mm	7.5 mm	Not Qualified	TRUE	4.5 V					260	18.425 mm	CBT/FST/QS/5C/B
CBT3253D	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4	N/A		5	5		SMALL OUTLINE	SOP16,.25	.25 ns	Other Logic ICs	1.27 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2	ENABLE LOW	R-PDSO-G16	1	5.5 V	1.75 mm	3.9 mm	Not Qualified	TRUE	4.5 V	.003 mA	e4	30	4	260	9.9 mm	CBT/FST/QS/5C/B
CBT3253ADB	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4	N/A		5	5		SMALL OUTLINE, SHRINK PITCH	SSOP16,.3	.25 ns	Other Logic ICs	.65 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	2	ENABLE LOW	R-PDSO-G16	1	5.5 V	2 mm	5.3 mm	Not Qualified	TRUE	4.5 V	.003 mA	e4	30	4	260	6.2 mm	CBT/FST/QS/5C/B
CBT16212DL,112	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		12			5	5		SMALL OUTLINE, SHRINK PITCH	SSOP56,.4	.25 ns	Other Logic ICs	.635 mm	85 Cel		3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	4		R-PDSO-G56	2	5.5 V	2.8 mm	7.5 mm	Not Qualified	TRUE	4 V		e4	30		260	18.425 mm	CBT/FST/QS/5C/B
CBTS3253D,118	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4			5		50 pF	SMALL OUTLINE	SOP16,.25	.25 ns		1.27 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	5	ENABLE LOW	R-PDSO-G16	1	5.5 V	1.75 mm	3.9 mm	Not Qualified	TRUE	4.5 V		e4		4		9.9 mm	CBT/FST/QS/5C/B
CBTS3253DS,118	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4			5		50 pF	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	.25 ns		.635 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	5	ENABLE LOW	R-PDSO-G16	1	5.5 V	1.73 mm	3.9 mm	Not Qualified	TRUE	4.5 V		e4		4		4.9 mm	CBT/FST/QS/5C/B
CBT3253ADB,112	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4	N/A		5	5		SMALL OUTLINE, SHRINK PITCH	SSOP16,.3	.25 ns	Other Logic ICs	.65 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	2	ENABLE LOW	R-PDSO-G16	1	5.5 V	2 mm	5.3 mm	Not Qualified	TRUE	4.5 V	.003 mA	e4	30	4	260	6.2 mm	CBT/FST/QS/5C/B
CBT3253AD,118	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4	N/A		5			SMALL OUTLINE	SOP16,.25	.25 ns		1.27 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	2	ENABLE LOW	R-PDSO-G16	1	5.5 V	1.75 mm	3.9 mm	Not Qualified	TRUE	4.5 V	.003 mA	e4	30	4	260	9.9 mm	CBT/FST/QS/5C/B
CBTD16212DGG	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		24			5	5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	.25 ns	Other Logic ICs	.5 mm	85 Cel		3-STATE	-40 Cel		DUAL	4		R-PDSO-G56		5.5 V	1.2 mm	6.1 mm	Not Qualified	TRUE	4.5 V			40		260	14 mm	CBT/FST/QS/5C/B
CBT3253DS	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4	N/A		5	5		SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	.25 ns	Other Logic ICs	.635 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel		DUAL	2	ENABLE LOW	R-PDSO-G16	1	5.5 V	1.73 mm	3.9 mm	Not Qualified	TRUE	4.5 V	.003 mA		30	4	260	4.9 mm	CBT/FST/QS/5C/B
CBTD16213DL,518	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			12			5			SMALL OUTLINE, SHRINK PITCH		.25 ns		.635 mm	85 Cel		3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	4		R-PDSO-G56		5.5 V	2.8 mm	7.5 mm	Not Qualified	TRUE	4.5 V		e4				18.425 mm	CBT/FST/QS/5C/B
CBT16213DGG	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	12			2			5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.25 ns		.5 mm	85 Cel		3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	4		R-PDSO-G56		5.5 V	1.2 mm	6.1 mm	Not Qualified	TRUE	4 V		e4				14 mm	CBT/FST/QS/5C/B
CBTS3253D,112	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4			5	5	50 pF	SMALL OUTLINE	SOP16,.25	.25 ns	Other Logic ICs	1.27 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	5	ENABLE LOW	R-PDSO-G16	1	5.5 V	1.75 mm	3.9 mm	Not Qualified	TRUE	4.5 V		e4		4		9.9 mm	CBT/FST/QS/5C/B
CBT3253DS,118	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4			5		50 pF	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	.25 ns		.635 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel		DUAL	5	ENABLE LOW	R-PDSO-G16		5.5 V	1.73 mm	3.9 mm	Not Qualified	TRUE	4.5 V				4		4.9 mm	CBT/FST/QS/5C/B
CBTD16213DGG,118	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			12			5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.25 ns		.5 mm	85 Cel		3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	4		R-PDSO-G56		5.5 V	1.2 mm	6.1 mm	Not Qualified	TRUE	4.5 V		e4				14 mm	CBT/FST/QS/5C/B
CBT16212DGG,118	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			24			5	5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	.25 ns	Other Logic ICs	.5 mm	85 Cel		3-STATE	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	4		R-PDSO-G56	1	5.5 V	1.2 mm	6.1 mm	Not Qualified	TRUE	4 V		e4	30		260	14 mm	CBT/FST/QS/5C/B
CBTD16212DL,112	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		12			5	5		SMALL OUTLINE, SHRINK PITCH	SSOP56,.4	.25 ns	Other Logic ICs	.635 mm	85 Cel		3-STATE	-40 Cel		DUAL	4		R-PDSO-G56		5.5 V	2.8 mm	7.5 mm	Not Qualified	TRUE	4.5 V					260	18.425 mm	CBT/FST/QS/5C/B
CBT3253APW,112	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4	N/A		5	5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	.25 ns	Other Logic ICs	.65 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	2	ENABLE LOW	R-PDSO-G16	1	5.5 V	1.1 mm	4.4 mm	Not Qualified	TRUE	4.5 V	.003 mA	e4	30	4	260	5 mm	CBT/FST/QS/5C/B
CBT3253DB	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4	N/A		5	5		SMALL OUTLINE, SHRINK PITCH	SSOP16,.3	.25 ns	Other Logic ICs	.65 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel		DUAL	2	ENABLE LOW	R-PDSO-G16	1	5.5 V	2 mm	5.3 mm	Not Qualified	TRUE	4.5 V	.003 mA		30	4	260	6.2 mm	CBT/FST/QS/5C/B
CBTD16212DGG-T	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			24			5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.25 ns		.5 mm	85 Cel		3-STATE	-40 Cel		DUAL	4		R-PDSO-G56		5.5 V	1.2 mm	6.1 mm	Not Qualified	TRUE	4.5 V			NOT SPECIFIED		NOT SPECIFIED	14 mm	CBT/FST/QS/5C/B
CBT3253ADS,112	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4	N/A		5	5		SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	.25 ns	Other Logic ICs	.635 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	2	ENABLE LOW	R-PDSO-G16	1	5.5 V	1.73 mm	3.9 mm	Not Qualified	TRUE	4.5 V	.003 mA	e4	30	4	260	4.9 mm	CBT/FST/QS/5C/B
CBT3253PW,118	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4			5		50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	.25 ns		.65 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	5	ENABLE LOW	R-PDSO-G16		5.5 V	1.1 mm	4.4 mm	Not Qualified	TRUE	4.5 V		e4		4		5 mm	CBT/FST/QS/5C/B
CBTS3253D	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4			5	5	50 pF	SMALL OUTLINE	SOP16,.25	.25 ns	Other Logic ICs	1.27 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	5	ENABLE LOW	R-PDSO-G16		5.5 V	1.75 mm	3.9 mm	Not Qualified	TRUE	4.5 V		e4		4		9.9 mm	CBT/FST/QS/5C/B
CBT3253PW	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4	N/A		5	5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	.25 ns	Other Logic ICs	.65 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2	ENABLE LOW	R-PDSO-G16	1	5.5 V	1.1 mm	4.4 mm	Not Qualified	TRUE	4.5 V	.003 mA	e4	30	4	260	5 mm	CBT/FST/QS/5C/B
CBTD16213DL	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS		12			5	5		SMALL OUTLINE, SHRINK PITCH	SSOP56,.4	.25 ns	Other Logic ICs	.635 mm	85 Cel		3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	4		R-PDSO-G56		5.5 V	2.8 mm	7.5 mm	Not Qualified	TRUE	4.5 V		e4			260	18.425 mm	CBT/FST/QS/5C/B
CBT16212DL,518	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			12			5	5		SMALL OUTLINE, SHRINK PITCH	SSOP56,.4	.25 ns	Other Logic ICs	.635 mm	85 Cel		3-STATE	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	4		R-PDSO-G56	2	5.5 V	2.8 mm	7.5 mm	Not Qualified	TRUE	4 V		e4	30		260	18.425 mm	CBT/FST/QS/5C/B
CBTD16212DL-T	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			12			5			SMALL OUTLINE, SHRINK PITCH		.25 ns		.635 mm	85 Cel		3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	4		R-PDSO-G56		5.5 V	2.8 mm	7.5 mm	Not Qualified	TRUE	4.5 V		e4				18.425 mm	CBT/FST/QS/5C/B
CBT3253DB,112	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4	N/A		5	5		SMALL OUTLINE, SHRINK PITCH	SSOP16,.3	.25 ns	Other Logic ICs	.65 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel		DUAL	2	ENABLE LOW	R-PDSO-G16	1	5.5 V	2 mm	5.3 mm	Not Qualified	TRUE	4.5 V	.003 mA		30	4	260	6.2 mm	CBT/FST/QS/5C/B
CBT16212DL	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		12			5	5		SMALL OUTLINE, SHRINK PITCH	SSOP56,.4	.25 ns	Other Logic ICs	.635 mm	85 Cel		3-STATE	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	4		R-PDSO-G56	2	5.5 V	2.8 mm	7.5 mm	Not Qualified	TRUE	4 V		e4	30		260	18.425 mm	CBT/FST/QS/5C/B
CBT3253ADB,118	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4	N/A		5			SMALL OUTLINE, SHRINK PITCH	SSOP16,.3	.25 ns		.65 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	2	ENABLE LOW	R-PDSO-G16	1	5.5 V	2 mm	5.3 mm	Not Qualified	TRUE	4.5 V	.003 mA	e4	30	4	260	6.2 mm	CBT/FST/QS/5C/B
CBTS3253DB,118	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4			5		50 pF	SMALL OUTLINE, SHRINK PITCH	SSOP16,.3	.25 ns		.65 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	5	ENABLE LOW	R-PDSO-G16	1	5.5 V	2 mm	5.3 mm	Not Qualified	TRUE	4.5 V		e4		4		6.2 mm	CBT/FST/QS/5C/B
CBT16212DL,512	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		12			5	5		SMALL OUTLINE, SHRINK PITCH	SSOP56,.4	.25 ns	Other Logic ICs	.635 mm	85 Cel		3-STATE	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	4		R-PDSO-G56	2	5.5 V	2.8 mm	7.5 mm	Not Qualified	TRUE	4 V		e4	30		260	18.425 mm	CBT/FST/QS/5C/B
CBTD16213DL,512	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS		12			5	5		SMALL OUTLINE, SHRINK PITCH	SSOP56,.4	.25 ns	Other Logic ICs	.635 mm	85 Cel		3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	4		R-PDSO-G56		5.5 V	2.8 mm	7.5 mm	Not Qualified	TRUE	4.5 V		e4			260	18.425 mm	CBT/FST/QS/5C/B
CBT3253ADS,118	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4	N/A		5			SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	.25 ns		.635 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	2	ENABLE LOW	R-PDSO-G16	1	5.5 V	1.73 mm	3.9 mm	Not Qualified	TRUE	4.5 V	.003 mA	e4	30	4	260	4.9 mm	CBT/FST/QS/5C/B
CBTV4010EE,551	NXP Semiconductors	BUS EXCHANGER	OTHER	BALL	64	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			10			2.5			GRID ARRAY, THIN PROFILE, FINE PITCH		.14 ns		.5 mm	85 Cel		3-STATE	0 Cel	TIN LEAD	BOTTOM	2		S-PBGA-B64	3	2.7 V	1.2 mm	7 mm	Not Qualified	TRUE	2.3 V		e0				7 mm	4000/14000/40000
CBTV4010EE,557	NXP Semiconductors	BUS EXCHANGER	OTHER	BALL	64	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			10			2.5	2.5		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA64,11X11,20	.14 ns	Bus Driver/Transceivers	.5 mm	85 Cel		3-STATE	0 Cel	TIN LEAD	BOTTOM	2		S-PBGA-B64	3	2.7 V	1.2 mm	7 mm	Not Qualified	TRUE	2.3 V		e0				7 mm	4000/14000/40000
CBT3253ADS	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4	N/A		5	5		SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	.25 ns	Other Logic ICs	.635 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	2	ENABLE LOW	R-PDSO-G16	1	5.5 V	1.73 mm	3.9 mm	Not Qualified	TRUE	4.5 V	.003 mA	e4	30	4	260	4.9 mm	CBT/FST/QS/5C/B
CBT16212DGG-T	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			24			5	5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	.25 ns	Other Logic ICs	.5 mm	85 Cel		3-STATE	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	4		R-PDSO-G56		5.5 V	1.2 mm	6.1 mm	Not Qualified	TRUE	4 V		e4				14 mm	CBT/FST/QS/5C/B
CBTD16213DGG-T	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2			12			5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.25 ns		.5 mm	85 Cel		3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	4		R-PDSO-G56		5.5 V	1.2 mm	6.1 mm	Not Qualified	TRUE	4.5 V		e4				14 mm	CBT/FST/QS/5C/B
CBTS3253DB	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4			5	5	50 pF	SMALL OUTLINE, SHRINK PITCH	SSOP16,.3	.25 ns	Other Logic ICs	.65 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	5	ENABLE LOW	R-PDSO-G16		5.5 V	2 mm	5.3 mm	Not Qualified	TRUE	4.5 V		e4		4	260	6.2 mm	CBT/FST/QS/5C/B
935294122115	NXP Semiconductors	BUS EXCHANGER		NO LEAD	20	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		4		TR, 7 INCH	3.3		50 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.1X.18,20			.5 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	3		R-PQCC-N20	1	3.6 V	1 mm	2.5 mm		TRUE	3 V	2.5 mA	e4				4.5 mm	CBT/FST/QS/5C/B
CBT3253ADS-T	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	2	4			5		50 pF	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	.25 ns		.635 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel		DUAL	5	ENABLE LOW	R-PDSO-G16		5.5 V	1.73 mm	3.9 mm		TRUE	4.5 V				8		4.9 mm	CBT/FST/QS/5C/B
CBTD16213DGG,112	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS		12			5	5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	.25 ns	Other Logic ICs	.5 mm	85 Cel		3-STATE	-40 Cel	TIN LEAD	DUAL	4		R-PDSO-G56		5.5 V	1.2 mm	6.1 mm	Not Qualified	TRUE	4.5 V		e0				14 mm	CBT/FST/QS/5C/B
CBTD16212DGG,118	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			24			5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.25 ns		.5 mm	85 Cel		3-STATE	-40 Cel		DUAL	4		R-PDSO-G56		5.5 V	1.2 mm	6.1 mm	Not Qualified	TRUE	4.5 V			NOT SPECIFIED		NOT SPECIFIED	14 mm	CBT/FST/QS/5C/B
CBT16213DL	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			12			5			SMALL OUTLINE, SHRINK PITCH		.25 ns		.635 mm	85 Cel		3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	4		R-PDSO-G56		5.5 V	2.794 mm	7.5 mm	Not Qualified	TRUE	4 V		e4				18.415 mm	CBT/FST/QS/5C/B
CBT3253DB,118	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4			5		50 pF	SMALL OUTLINE, SHRINK PITCH	SSOP16,.3	.25 ns		.65 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel		DUAL	5	ENABLE LOW	R-PDSO-G16		5.5 V	2 mm	5.3 mm	Not Qualified	TRUE	4.5 V				4		6.2 mm	CBT/FST/QS/5C/B
CBTS3253PW,118	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4			5		50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	.25 ns		.65 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	5	ENABLE LOW	R-PDSO-G16	1	5.5 V	1.1 mm	4.4 mm	Not Qualified	TRUE	4.5 V		e4		4		5 mm	CBT/FST/QS/5C/B

Bus Driver & Transceivers

A bus driver is an electronic component that manages communication between different components or devices in a computer system. It serves as an intermediary between the CPU and other components, such as memory, input/output devices, and expansion cards. The bus driver receives signals from the CPU and routes them to the appropriate component based on the address and control signals provided.

The bus driver also manages the timing of data transfer between components and ensures that the data is transferred at the correct speed and in the correct format. It may also perform error checking and correction to ensure that the data is transferred accurately.

Transceivers, on the other hand, are electronic devices that transmit and receive data signals over a communication channel. They are commonly used in telecommunications, networking, and computer systems. Transceivers can be either analog or digital and may transmit data using various modulation schemes, such as amplitude modulation (AM), frequency modulation (FM), or phase modulation (PM).

In computer systems, transceivers are commonly used to transmit and receive data over network cables, such as Ethernet cables or fiber optic cables. They may also be used to transmit and receive data over wireless networks, such as Wi-Fi or Bluetooth.

Transceivers typically include a transmitter, a receiver, and a signal processing unit that modulates and demodulates the data signals. They may also include error correction and signal amplification circuitry to improve the quality of the transmitted data.