BUS EXCHANGER Bus Driver & Transceivers 1,018

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	No. of Inputs	No. of Bits	Translation	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Count Direction	Output Characteristics	Trigger Type	Minimum Operating Temperature	Terminal Finish	Terminal Position	No. of Ports	Control Type	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Output Polarity	Minimum Supply Voltage (Vsup)	Maximum Power Supply Current (ICC)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	Family
CBT3253D,112	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4	N/A		5	5		SMALL OUTLINE	SOP16,.25	.25 ns		Other Logic ICs	1.27 mm	85 Cel	BIDIRECTIONAL	3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2	ENABLE LOW	R-PDSO-G16	1	5.5 V	1.75 mm	3.9 mm	Not Qualified	TRUE	4.5 V	.003 mA		e4	30	4	260	9.9 mm	CBT/FST/QS/5C/B
CBT3253D,118	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4			5		50 pF	SMALL OUTLINE	SOP16,.25	.25 ns			1.27 mm	85 Cel	BIDIRECTIONAL	3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	5	ENABLE LOW	R-PDSO-G16		5.5 V	1.75 mm	3.9 mm	Not Qualified	TRUE	4.5 V			e4		4		9.9 mm	CBT/FST/QS/5C/B
CBTV4010EE	NXP Semiconductors	BUS EXCHANGER	OTHER	BALL	64	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			10			2.5	2.5		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA64,11X11,20	.14 ns		Bus Driver/Transceivers	.5 mm	85 Cel		3-STATE		0 Cel		BOTTOM	2		S-PBGA-B64		2.7 V	1.2 mm	7 mm	Not Qualified	TRUE	2.3 V							7 mm	4000/14000/40000
CBT3253APW	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4	N/A		5	5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	.25 ns		Other Logic ICs	.65 mm	85 Cel	BIDIRECTIONAL	3-STATE		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	2	ENABLE LOW	R-PDSO-G16	1	5.5 V	1.1 mm	4.4 mm	Not Qualified	TRUE	4.5 V	.003 mA		e4	30	4	260	5 mm	CBT/FST/QS/5C/B
935294123115	NXP Semiconductors	BUS EXCHANGER		NO LEAD	20	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		4		TR, 7 INCH	3.3		50 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.1X.18,20				.5 mm	85 Cel	BIDIRECTIONAL	3-STATE		-40 Cel		QUAD	3		R-PQCC-N20		3.6 V	1 mm	2.5 mm		TRUE	3 V	2.5 mA						4.5 mm	CBT/FST/QS/5C/B
CBTS3253DB,112	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4			5	5	50 pF	SMALL OUTLINE, SHRINK PITCH	SSOP16,.3	.25 ns		Other Logic ICs	.65 mm	85 Cel	BIDIRECTIONAL	3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	5	ENABLE LOW	R-PDSO-G16	1	5.5 V	2 mm	5.3 mm	Not Qualified	TRUE	4.5 V			e4		4	260	6.2 mm	CBT/FST/QS/5C/B
CBT3253DS,112	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4	N/A		5	5	50 pF	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	.25 ns		Other Logic ICs	.635 mm	85 Cel	BIDIRECTIONAL	3-STATE		-40 Cel		DUAL	5	ENABLE LOW	R-PDSO-G16	1	5.5 V	1.73 mm	3.9 mm	Not Qualified	TRUE	4.5 V	.003 mA			30	4	260	4.9 mm	CBT/FST/QS/5C/B
CBT3253APW,118	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4	N/A		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	.25 ns			.65 mm	85 Cel	BIDIRECTIONAL	3-STATE		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	2	ENABLE LOW	R-PDSO-G16	1	5.5 V	1.1 mm	4.4 mm	Not Qualified	TRUE	4.5 V	.003 mA		e4	30	4	260	5 mm	CBT/FST/QS/5C/B
CBTS3253PW,112	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4			5	5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	.25 ns		Other Logic ICs	.65 mm	85 Cel	BIDIRECTIONAL	3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	5	ENABLE LOW	R-PDSO-G16	1	5.5 V	1.1 mm	4.4 mm	Not Qualified	TRUE	4.5 V			e4		4	260	5 mm	CBT/FST/QS/5C/B
CBT3253AD	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4	N/A		5	5		SMALL OUTLINE	SOP16,.25	.25 ns		Other Logic ICs	1.27 mm	85 Cel	BIDIRECTIONAL	3-STATE		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	2	ENABLE LOW	R-PDSO-G16	1	5.5 V	1.75 mm	3.9 mm	Not Qualified	TRUE	4.5 V	.003 mA		e4	30	4	260	9.9 mm	CBT/FST/QS/5C/B
CBT16212DGG	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		24			5	5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	.25 ns		Other Logic ICs	.5 mm	85 Cel		3-STATE		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	4		R-PDSO-G56	1	5.5 V	1.2 mm	6.1 mm	Not Qualified	TRUE	4 V			e4	30		260	14 mm	CBT/FST/QS/5C/B
CBTS3253DS,112	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4			5	5	50 pF	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	.25 ns		Other Logic ICs	.635 mm	85 Cel	BIDIRECTIONAL	3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	5	ENABLE LOW	R-PDSO-G16	1	5.5 V	1.73 mm	3.9 mm	Not Qualified	TRUE	4.5 V			e4		4	260	4.9 mm	CBT/FST/QS/5C/B
CBTD16213DGG	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS		12			5	5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	.25 ns		Other Logic ICs	.5 mm	85 Cel		3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	4		R-PDSO-G56		5.5 V	1.2 mm	6.1 mm	Not Qualified	TRUE	4.5 V			e4				14 mm	CBT/FST/QS/5C/B
CBTS3253PW	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4			5	5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	.25 ns		Other Logic ICs	.65 mm	85 Cel	BIDIRECTIONAL	3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	5	ENABLE LOW	R-PDSO-G16		5.5 V	1.1 mm	4.4 mm	Not Qualified	TRUE	4.5 V			e4		4	260	5 mm	CBT/FST/QS/5C/B
CBT16212DL-T	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			12			5	5		SMALL OUTLINE, SHRINK PITCH	SSOP56,.4	.25 ns		Other Logic ICs	.635 mm	85 Cel		3-STATE		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	4		R-PDSO-G56		5.5 V	2.8 mm	7.5 mm	Not Qualified	TRUE	4 V			e4				18.425 mm	CBT/FST/QS/5C/B
CBTD16212DGG,112	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		24			5	5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	.25 ns		Other Logic ICs	.5 mm	85 Cel		3-STATE		-40 Cel	TIN LEAD	DUAL	4		R-PDSO-G56		5.5 V	1.2 mm	6.1 mm	Not Qualified	TRUE	4.5 V			e0				14 mm	CBT/FST/QS/5C/B
CBTD16213DL-T	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2			12			5			SMALL OUTLINE, SHRINK PITCH		.25 ns			.635 mm	85 Cel		3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	4		R-PDSO-G56		5.5 V	2.8 mm	7.5 mm	Not Qualified	TRUE	4.5 V			e4				18.425 mm	CBT/FST/QS/5C/B
CBT3253PW,112	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	1	4	N/A		5	5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	.25 ns		Other Logic ICs	.65 mm	85 Cel	BIDIRECTIONAL	3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2	ENABLE LOW	R-PDSO-G16	1	5.5 V	1.1 mm	4.4 mm	Not Qualified	TRUE	4.5 V	.003 mA		e4	30	4	260	5 mm	CBT/FST/QS/5C/B
CBT16212DGG,112	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		24			5	5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	.25 ns		Other Logic ICs	.5 mm	85 Cel		3-STATE		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	4		R-PDSO-G56	1	5.5 V	1.2 mm	6.1 mm	Not Qualified	TRUE	4 V			e4	30		260	14 mm	CBT/FST/QS/5C/B
CBT16212DL,118	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		12			5	5		SMALL OUTLINE, SHRINK PITCH	SSOP56,.4	.25 ns		Other Logic ICs	.635 mm	85 Cel		3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	4		R-PDSO-G56	2	5.5 V	2.8 mm	7.5 mm	Not Qualified	TRUE	4 V			e4	30		260	18.425 mm	CBT/FST/QS/5C/B
CBTD16212DL,118	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			12			5			SMALL OUTLINE, SHRINK PITCH		.25 ns			.635 mm	85 Cel		3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	4		R-PDSO-G56		5.5 V	2.8 mm	7.5 mm	Not Qualified	TRUE	4.5 V			e4				18.425 mm	CBT/FST/QS/5C/B
BH16260DL	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		12			5		50 pF	SMALL OUTLINE, SHRINK PITCH	SSOP56,.4	5.8 ns	64 Amp		.635 mm	85 Cel	BIDIRECTIONAL	3-STATE		-40 Cel		DUAL	3	ENABLE LOW	R-PDSO-G56		5.5 V	2.8 mm	7.5 mm	Not Qualified	TRUE	4.5 V							18.425 mm	ABT
935260344512	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		12			2.5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		6.2 ns			.5 mm	85 Cel		3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	3		R-PDSO-G56		2.7 V	1.2 mm	6.25 mm		TRUE	2.3 V		USER SELECTABLE 3.3V VCC	e4				14.15 mm	ALVT
AV16260DGG-T	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56		RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		12	N/A		2.5		50 pF			6.2 ns	24 Amp			85 Cel	BIDIRECTIONAL	3-STATE		-40 Cel		DUAL	3	ENABLE LOW	R-PDSO-G56		2.7 V			Not Qualified	TRUE	2.3 V		USER SELECTABLE 3.3V VCC						ALVT
935270187118	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	12			2			5			SMALL OUTLINE, SHRINK PITCH		.25 ns			.635 mm	85 Cel		3-STATE		-40 Cel		DUAL	4		R-PDSO-G56		5.5 V	2.8 mm	7.5 mm	Not Qualified	TRUE	4.5 V				NOT SPECIFIED		NOT SPECIFIED	18.425 mm
935270391518	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		12			5			SMALL OUTLINE, SHRINK PITCH		.25 ns			.635 mm	85 Cel		3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	4		R-PDSO-G56		5.5 V	2.8 mm	7.5 mm		TRUE	4 V			e4				18.425 mm	CBT/FST/QS/5C/B
PCA9543AD,112	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			1		TUBE	5		15 pF	SMALL OUTLINE	SOP14,.25	.3 ns			1.27 mm	85 Cel	BIDIRECTIONAL		POSITIVE EDGE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2	COMMON CONTROL	R-PDSO-G14	1	5.5 V	1.75 mm	3.9 mm		TRUE	4.5 V	.1 mA	ALSO OPERATES AT 2.3 TO 3.6 V SUPPLY	e4	30		260	8.65 mm	9543
AV16260DL-T	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56		RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		12	N/A		2.5		50 pF			6.2 ns	24 Amp			85 Cel	BIDIRECTIONAL	3-STATE		-40 Cel		DUAL	3	ENABLE LOW	R-PDSO-G56		2.7 V			Not Qualified	TRUE	2.3 V		USER SELECTABLE 3.3V VCC						ALVT
AV16260DL	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56		RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		12	N/A		2.5		50 pF			6.2 ns	24 Amp			85 Cel	BIDIRECTIONAL	3-STATE		-40 Cel		DUAL	3	ENABLE LOW	R-PDSO-G56		2.7 V			Not Qualified	TRUE	2.3 V		USER SELECTABLE 3.3V VCC						ALVT
935271264551	NXP Semiconductors	BUS EXCHANGER	OTHER	BALL	64	TFBGA	SQUARE	PLASTIC/EPOXY	YES	10			1			2.5			GRID ARRAY, THIN PROFILE, FINE PITCH		.14 ns			.5 mm	85 Cel		3-STATE		0 Cel		BOTTOM	2		S-PBGA-B64		2.7 V	1.2 mm	7 mm	Not Qualified	TRUE	2.3 V				NOT SPECIFIED		NOT SPECIFIED	7 mm	4000/14000/40000
BT16260DL	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		12			5		50 pF	SMALL OUTLINE, SHRINK PITCH	SSOP56,.4	5.8 ns	64 Amp		.635 mm	85 Cel	BIDIRECTIONAL	3-STATE		-40 Cel		DUAL	3	ENABLE LOW	R-PDSO-G56		5.5 V	2.8 mm	7.5 mm	Not Qualified	TRUE	4.5 V							18.425 mm	ABT
935260344518	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		12			2.5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		6.2 ns			.5 mm	85 Cel		3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	3		R-PDSO-G56		2.7 V	1.2 mm	6.25 mm		TRUE	2.3 V		USER SELECTABLE 3.3V VCC	e4				14.15 mm	ALVT
935260345112	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		12	N/A	TUBE	2.5		50 pF	SMALL OUTLINE, SHRINK PITCH	SSOP56,.4	6.2 ns	64 Amp		.635 mm	85 Cel	BIDIRECTIONAL	3-STATE		-40 Cel		DUAL	3	ENABLE LOW	R-PDSO-G56		2.7 V	2.8 mm	7.5 mm	Not Qualified	TRUE	2.3 V		USER SELECTABLE 3.3V VCC		NOT SPECIFIED		NOT SPECIFIED	18.425 mm	ALVT
BT16260DL-T	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		12			5		50 pF	SMALL OUTLINE, SHRINK PITCH	SSOP56,.4	5.8 ns	64 Amp		.635 mm	85 Cel	BIDIRECTIONAL	3-STATE		-40 Cel		DUAL	3	ENABLE LOW	R-PDSO-G56		5.5 V	2.8 mm	7.5 mm	Not Qualified	TRUE	4.5 V							18.425 mm	ABT
BT16260DGG	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		12			5		50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	5.8 ns	64 Amp		.5 mm	85 Cel	BIDIRECTIONAL	3-STATE		-40 Cel		DUAL	3	ENABLE LOW	R-PDSO-G56		5.5 V	1.2 mm	6.25 mm	Not Qualified	TRUE	4.5 V							14.15 mm	ABT
935275804118	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1	N/A	TR, 13 INCH	2.5		15 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	.3 ns			.65 mm	85 Cel	BIDIRECTIONAL	OPEN-DRAIN		-40 Cel		DUAL	2	COMMON CONTROL	R-PDSO-G14		3.6 V	1.1 mm	4.4 mm		TRUE	2.3 V	.1 mA	ALSO OPERATES AT 4.5 TO 5.5 SUPPLY					5 mm	9543
BH16260DGG-T	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		12			5		50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	5.8 ns	64 Amp		.5 mm	85 Cel	BIDIRECTIONAL	3-STATE		-40 Cel		DUAL	3	ENABLE LOW	R-PDSO-G56		5.5 V	1.2 mm	6.25 mm	Not Qualified	TRUE	4.5 V							14.15 mm	ABT
935271264518	NXP Semiconductors	BUS EXCHANGER	OTHER	BALL	64	TFBGA	SQUARE	PLASTIC/EPOXY	YES	10			1			2.5			GRID ARRAY, THIN PROFILE, FINE PITCH		.14 ns			.5 mm	85 Cel		3-STATE		0 Cel		BOTTOM	2		S-PBGA-B64		2.7 V	1.2 mm	7 mm	Not Qualified	TRUE	2.3 V				NOT SPECIFIED		NOT SPECIFIED	7 mm	4000/14000/40000
BH16260DL-T	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		12			5		50 pF	SMALL OUTLINE, SHRINK PITCH	SSOP56,.4	5.8 ns	64 Amp		.635 mm	85 Cel	BIDIRECTIONAL	3-STATE		-40 Cel		DUAL	3	ENABLE LOW	R-PDSO-G56		5.5 V	2.8 mm	7.5 mm	Not Qualified	TRUE	4.5 V							18.425 mm	ABT
935270391512	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		12			5			SMALL OUTLINE, SHRINK PITCH		.25 ns			.635 mm	85 Cel		3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	4		R-PDSO-G56		5.5 V	2.8 mm	7.5 mm		TRUE	4 V			e4				18.425 mm	CBT/FST/QS/5C/B
PCA9543BPW	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			1		TR, 13 INCH	5		15 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	.3 ns			.65 mm	85 Cel	BIDIRECTIONAL		POSITIVE EDGE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2	COMMON CONTROL	R-PDSO-G14	1	5.5 V	1.1 mm	4.4 mm		TRUE	4.5 V	.1 mA	ALSO OPERATES AT 2.3 TO 3.6 V SUPPLY	e4	30		260	5 mm	9543
935270385112	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	12			2			5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.25 ns			.5 mm	85 Cel		3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	4		R-PDSO-G56	1	5.5 V	1.2 mm	6.1 mm	Not Qualified	TRUE	4 V			e4				14 mm
AV16260DGG	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56		RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		12	N/A		2.5		50 pF			6.2 ns	24 Amp			85 Cel	BIDIRECTIONAL	3-STATE		-40 Cel		DUAL	3	ENABLE LOW	R-PDSO-G56		2.7 V			Not Qualified	TRUE	2.3 V		USER SELECTABLE 3.3V VCC						ALVT
935270391118	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	12			2			5			SMALL OUTLINE, SHRINK PITCH		.25 ns			.635 mm	85 Cel		3-STATE		-40 Cel		DUAL	4		R-PDSO-G56		5.5 V	2.8 mm	7.5 mm	Not Qualified	TRUE	4 V				NOT SPECIFIED		NOT SPECIFIED	18.425 mm
BH16260DGG	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		12			5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		5.3 ns			.5 mm	85 Cel		3-STATE		-40 Cel		DUAL	3		R-PDSO-G56		5.5 V	1.2 mm	6.1 mm	Not Qualified	TRUE	4.5 V							14 mm	ABT
PCA9543BPW,118	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			1		TR, 13 INCH	5		15 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	.3 ns			.65 mm	85 Cel	BIDIRECTIONAL		POSITIVE EDGE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2	COMMON CONTROL	R-PDSO-G14	1	5.5 V	1.1 mm	4.4 mm		TRUE	4.5 V	.1 mA	ALSO OPERATES AT 2.3 TO 3.6 V SUPPLY	e4	30		260	5 mm	9543
935270186112	NXP Semiconductors	BUS EXCHANGER	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	12			2			5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.25 ns			.5 mm	85 Cel		3-STATE		-40 Cel		DUAL	4		R-PDSO-G56		5.5 V	1.2 mm	6.1 mm	Not Qualified	TRUE	4.5 V				NOT SPECIFIED		NOT SPECIFIED	14 mm
935271264557	NXP Semiconductors	BUS EXCHANGER	OTHER	BALL	64	TFBGA	SQUARE	PLASTIC/EPOXY	YES	10			1			2.5			GRID ARRAY, THIN PROFILE, FINE PITCH		.14 ns			.5 mm	85 Cel		3-STATE		0 Cel		BOTTOM	2		S-PBGA-B64		2.7 V	1.2 mm	7 mm	Not Qualified	TRUE	2.3 V				NOT SPECIFIED		NOT SPECIFIED	7 mm	4000/14000/40000

Bus Driver & Transceivers

A bus driver is an electronic component that manages communication between different components or devices in a computer system. It serves as an intermediary between the CPU and other components, such as memory, input/output devices, and expansion cards. The bus driver receives signals from the CPU and routes them to the appropriate component based on the address and control signals provided.

The bus driver also manages the timing of data transfer between components and ensures that the data is transferred at the correct speed and in the correct format. It may also perform error checking and correction to ensure that the data is transferred accurately.

Transceivers, on the other hand, are electronic devices that transmit and receive data signals over a communication channel. They are commonly used in telecommunications, networking, and computer systems. Transceivers can be either analog or digital and may transmit data using various modulation schemes, such as amplitude modulation (AM), frequency modulation (FM), or phase modulation (PM).

In computer systems, transceivers are commonly used to transmit and receive data over network cables, such as Ethernet cables or fiber optic cables. They may also be used to transmit and receive data over wireless networks, such as Wi-Fi or Bluetooth.

Transceivers typically include a transmitter, a receiver, and a signal processing unit that modulates and demodulates the data signals. They may also include error correction and signal amplification circuitry to improve the quality of the transmitted data.