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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	Screening Level	No. of Inputs	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Minimum Supply Voltage (Vsup)	Maximum Power Supply Current (ICC)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
SN74LVC2G07DCKTE4	Texas Instruments	BUFFER	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2	CMOS		1	TR	3.3	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	8.6 ns	24 Amp	Gates	.65 mm	85 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G6	1	5.5 V	1.1 mm	1.25 mm	Not Qualified	1.65 V			e4	30	260	2 mm	LVC/LCX/Z
SN74LVC1G07DRYR	Texas Instruments	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	3.3	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	8.6 ns	32 Amp	Gates	.5 mm	125 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	DUAL	R-PDSO-N6	1	5.5 V	.6 mm	1 mm	Not Qualified	1.65 V	.01 mA		e4	NOT SPECIFIED	260	1.45 mm	LVC/LCX/Z
SN74LVC1G07MDCKREP	Texas Instruments	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	5.7 ns	32 Amp	Gates	.65 mm	125 Cel	OPEN-DRAIN	-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm	Not Qualified	1.65 V	.01 mA		e4	NOT SPECIFIED	260	2 mm	LVC/LCX/Z
SN74LVC1G17DBV3	Texas Instruments	BUFFER	INDUSTRIAL	GULL WING	5	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS		1	TR	3.3	3.3	50 pF	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSOP5/6,.11,37	11 ns	24 Amp	Gates	.95 mm	85 Cel		-40 Cel	TIN BISMUTH	DUAL	R-PDSO-G5	1	5.5 V	1.45 mm	1.6 mm	Not Qualified	1.65 V	.01 mA		e6	30	260	2.9 mm	LVC/LCX/Z
SN74LVC1G07QDCKTQ1	Texas Instruments	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	AEC-Q100	1		3.3			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		9.8 ns	32 Amp		.65 mm	125 Cel	OPEN-DRAIN	-40 Cel	Matte Tin (Sn)	DUAL	R-PDSO-G5	2	5.5 V	1.1 mm	1.25 mm		1.65 V	.01 mA		e3	NOT SPECIFIED	260	2 mm	LVC/LCX/Z
SN74LVC1G07DRLR	Texas Instruments	BUFFER	AUTOMOTIVE	FLAT	5	VSOF	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	3.3	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	FL6,.047,20	8.6 ns	32 Amp	Gates	.5 mm	125 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	DUAL	R-PDSO-F5	1	5.5 V	.6 mm	1.2 mm	Not Qualified	1.65 V	.01 mA		e4	NOT SPECIFIED	260	1.6 mm	LVC/LCX/Z
SN74LVC3G34DCURE4	Texas Instruments	BUFFER	INDUSTRIAL	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	3.3	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	TSSOP8,.12,20	7.9 ns	24 Amp	Gates	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8	1	5.5 V	.9 mm	2 mm	Not Qualified	1.65 V			e4			2.3 mm	LVC/LCX/Z
SN74LVC07ADR	Texas Instruments	BUFFER	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE	SOP14,.25	5.6 ns	24 Amp	Gates	1.27 mm	125 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G14	1	5.5 V	1.75 mm	3.9 mm	Not Qualified	1.65 V	.04 mA		e4	NOT SPECIFIED	260	8.65 mm	LVC/LCX/Z
SN74LVC2G07MDCKTEP	Texas Instruments	BUFFER	MILITARY	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	5.7 ns	32 Amp	Gates	.65 mm	125 Cel	OPEN-DRAIN	-55 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G6	1	5.5 V	1.1 mm	1.25 mm	Not Qualified	1.65 V	.01 mA		e4	30	260	2 mm	LVC/LCX/Z
SN74LS07DR	Texas Instruments	BUFFER	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	TTL		1	TR	5		15 pF	SMALL OUTLINE	SOP14,.25	30 ns	40 Amp	Gate	1.27 mm	70 Cel	OPEN-COLLECTOR	0 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1	5.25 V	1.75 mm	3.9 mm	Not Qualified	4.75 V	45 mA		e4	30	260	8.65 mm	LS
SN74LVC1G34DCKRE4	Texas Instruments	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	3.3	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	9.9 ns	32 Amp	Gates	.65 mm	125 Cel	3-STATE	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm	Not Qualified	1.65 V	.001 mA		e4	NOT SPECIFIED	260	2 mm	LVC/LCX/Z
NC7WZ07FHX	Onsemi	BUFFER	INDUSTRIAL	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	NO	YES	2	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	12.6 ns	24 Amp	Gates	.35 mm	85 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium (Ni/Pd)	DUAL	S-PDSO-N6	1	5.5 V	.55 mm	1 mm	Not Qualified	1.65 V			e4	NOT SPECIFIED	NOT SPECIFIED	1 mm	LVC/LCX/Z
SN74LS07DBR	Texas Instruments	BUFFER	COMMERCIAL	GULL WING	14	SSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	TTL		1	TR	5		15 pF	SMALL OUTLINE, SHRINK PITCH	SSOP14,.3	30 ns	40 Amp	Gates	.65 mm	70 Cel	OPEN-COLLECTOR	0 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1	5.25 V	2 mm	5.3 mm	Not Qualified	4.75 V	45 mA		e4	30	260	6.2 mm	LS
NL17SZ07DFT2G-F22038	Onsemi	BUFFER		GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	2.3		50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	9.5 ns	32 Amp		.65 mm	125 Cel	OPEN-DRAIN	-55 Cel	MATTE TIN	DUAL	R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm		1.65 V	100 mA		e3	30	260	2 mm	LVC/LCX/Z
SN74LVC2G17DSF2	Texas Instruments	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	YES	YES	2	CMOS		1	TR	3.3	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	9.3 ns	32 Amp	Gates	.35 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	S-PDSO-N6	1	5.5 V	.4 mm	1 mm	Not Qualified	1.65 V	.01 mA		e4	NOT SPECIFIED	260	1 mm	LVC/LCX/Z
SN74LVC2G07YZPR	Texas Instruments	BUFFER	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	UNSPECIFIED	NO	YES	2	CMOS		1	TR	3.3	3.3	50 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20	8.6 ns	32 Amp	Gates	.5 mm	125 Cel	OPEN-DRAIN	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	R-XBGA-B6	1	5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V	.01 mA		e1	NOT SPECIFIED	260	1.4 mm	LVC/LCX/Z
SN74LS07NSR	Texas Instruments	BUFFER	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	TTL		1	TR	5		15 pF	SMALL OUTLINE	SOP14,.3	30 ns	40 Amp	Gates	1.27 mm	70 Cel	OPEN-COLLECTOR	0 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1	5.25 V	2 mm	5.3 mm	Not Qualified	4.75 V	45 mA		e4	30	260	10.2 mm	LS
74LVC1G17GW	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS		1	TR	3	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	14 ns	24 Amp	Gates	.65 mm	125 Cel		-40 Cel	Tin (Sn)	DUAL	R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm	Not Qualified	1.65 V			e3	30	260	2.05 mm	LVC/LCX/Z
74LVC1G07GW-G	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	1.8	3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	8.4 ns	24 Amp	Gates	.65 mm	125 Cel	OPEN-COLLECTOR	-40 Cel	TIN	DUAL	R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm	Not Qualified	1.65 V			e3	30	260	2.05 mm	LVC/LCX/Z
74LVC1G07GW	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	1.8	3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	8.4 ns	24 Amp	Gates	.65 mm	125 Cel	OPEN-COLLECTOR	-40 Cel	Tin (Sn)	DUAL	R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm	Not Qualified	1.65 V			e3	30	260	2.05 mm	LVC/LCX/Z
SN74LVC2G17YZPR	Texas Instruments	BUFFER	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	UNSPECIFIED	YES	YES	2	CMOS		1	TR	3.3	3.3	50 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20	9.3 ns	32 Amp	Gates	.5 mm	85 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	R-XBGA-B6	1	5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V	.01 mA		e1	NOT SPECIFIED	260	1.4 mm	LVC/LCX/Z
74LVC1G07GW,165	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	1.8	3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	8.4 ns	24 Amp	Gates	.65 mm	125 Cel	OPEN-DRAIN	-40 Cel	Tin (Sn)	DUAL	R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm	Not Qualified	1.65 V			e3	30	260	2.05 mm	LVC/LCX/Z
M74VHC1GT50DTT1G	Onsemi	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	1.8	3.3/5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSOP5/6,.11,37	25.5 ns	8 Amp	Gates	.95 mm	125 Cel		-55 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G5	1	5.5 V	1.1 mm	1.5 mm	Not Qualified	1.65 V	.04 mA		e3	40	260	3 mm	AHC/VHC
74HCT2G17GW-Q100,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	AEC-Q100	1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		45 ns			.65 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G6		5.5 V	1.1 mm	1.25 mm		4.5 V						2 mm	HCT
74LVC2G34GW/C,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	10.8 ns	24 Amp	Gates	.65 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G6		5.5 V	1.1 mm	1.25 mm	Not Qualified	1.65 V			e3			2 mm	LVC/LCX/Z
SN74ALS1035DR	Texas Instruments	BUFFER	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	TTL		1	TR	5	5	50 pF	SMALL OUTLINE	SOP14,.25	30 ns	24 Amp	Gate	1.27 mm	70 Cel	OPEN-COLLECTOR	0 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G14	1	5.5 V	1.75 mm	3.9 mm	Not Qualified	4.5 V	14 mA	IOH = 0.1MA @ VOH = 5.5V; IOL = 12MA @ VOL = 0.4V	e4	NOT SPECIFIED	260	8.65 mm	ALS
SN74AUP1T34DCKR	Texas Instruments	BUFFER		GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1	TR, 7 INCH	1.2			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08				.65 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G5		3.6 V	1.1 mm	1.25 mm		.9 V						2 mm	AUP/ULP/V
CD4050BDR	Texas Instruments	BUFFER	MILITARY	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1	TR	10	5/15	50 pF	SMALL OUTLINE	SOP16,.25	140 ns	18 Amp	Gates	1.27 mm	125 Cel		-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16	1	15 V	1.75 mm	3.9 mm	Not Qualified	5 V	.12 mA		e4	NOT SPECIFIED	260	9.9 mm	4000/14000/40000
74LVC3G17DC,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	3	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	TSSOP8,.12,20	13.1 ns	24 Amp	Gates	.5 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G8	1	5.5 V	1 mm	2 mm	Not Qualified	1.65 V			e4	30	260	2.3 mm	LVC/LCX/Z
74LVC3G17DP,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	YES	3	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.16	13.1 ns	24 Amp	Gates	.65 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	S-PDSO-G8	1	5.5 V	1.1 mm	3 mm	Not Qualified	1.65 V			e4	30	260	3 mm	LVC/LCX/Z
NC7WZ17P6	Onsemi	BUFFER	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	2	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	15.8 ns	24 Amp	Gates	.65 mm	85 Cel		-40 Cel	TIN	DUAL	R-PDSO-G6	1	5.5 V	1.1 mm	1.25 mm	Not Qualified	1.65 V			e3	30	260	2 mm	LVC/LCX/Z
SN74LVC2G07DSFR	Texas Instruments	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	NO	YES	2	CMOS		1	TR	3.3	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	8.6 ns	32 Amp	Gates	.35 mm	125 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	S-PDSO-N6	1	5.5 V	.4 mm	1 mm	Not Qualified	1.65 V	.01 mA		e4	NOT SPECIFIED	260	1 mm	LVC/LCX/Z
SN74LVC2G34DRLR	Texas Instruments	BUFFER	AUTOMOTIVE	FLAT	6	VSOF	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	FL6,.047,20	9.6 ns	32 Amp	Gates	.5 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	DUAL	R-PDSO-F6	1	5.5 V	.6 mm	1.2 mm	Not Qualified	1.65 V	.01 mA		e4	NOT SPECIFIED	260	1.6 mm	LVC/LCX/Z
SN74LVC1G17MDCKREP	Texas Instruments	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS		1	TR	3.3	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	11 ns	32 Amp	Gates	.65 mm	125 Cel		-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm	Not Qualified	1.65 V	.01 mA		e4	NOT SPECIFIED	260	2 mm	LVC/LCX/Z
TC7SZ07AFSL3J(T	Toshiba	BUFFER		FLAT	5	VSOF	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1		1.8		50 pF	SMALL OUTLINE, VERY THIN PROFILE	FL5/6,.03,14	12 ns	32 Amp		.35 mm	125 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-F5		5.5 V	.5 mm	.8 mm		1.65 V	50 mA					1 mm	LVC/LCX/Z
CD74HC4050M96	Texas Instruments	BUFFER	MILITARY	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1	TR	4.5	2/6	50 pF	SMALL OUTLINE	SOP16,.25	130 ns	4 Amp	Gates	1.27 mm	125 Cel		-55 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	1	6 V	1.75 mm	3.9 mm	Not Qualified	2 V	.04 mA	CMOS-TTL LEVEL TRANSLATOR	e4	30	260	9.9 mm	HC
74HCT2G17GW-Q100H	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	AEC-Q100	1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		45 ns			.65 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G6		5.5 V	1.1 mm	1.25 mm		4.5 V						2 mm	HCT
NC7NZ34K8X	Onsemi	BUFFER	INDUSTRIAL	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	TSSOP8,.12,20	8.8 ns	24 Amp	Gates	.5 mm	85 Cel		-40 Cel	TIN	DUAL	R-PDSO-G8	1	5.5 V	.9 mm	2 mm	Not Qualified	1.65 V			e3	30	260	2.3 mm	LVC/LCX/Z
NL27WZ16DFT2G	Onsemi	BUFFER	MILITARY	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2	CMOS		1	TR	2.3		50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	10.2 ns	32 Amp		.65 mm	125 Cel		-55 Cel	MATTE TIN	DUAL	R-PDSO-G6	1	5.5 V	1.1 mm	1.25 mm	Not Qualified	1.65 V	100 mA		e3	30	260	2 mm	LVC/LCX/Z
SN74LVC3G34DCUTG4	Texas Instruments	BUFFER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	3.3	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	TSSOP8,.12,20	7.9 ns	32 Amp	Gates	.5 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G8	1	5.5 V	.9 mm	2 mm	Not Qualified	1.65 V	.01 mA		e4	NOT SPECIFIED	260	2.3 mm	LVC/LCX/Z
SN74LVC2G34MDCKREP	Texas Instruments	BUFFER	MILITARY	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	11.5 ns	32 Amp	Gates	.65 mm	125 Cel	3-STATE	-55 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G6	1	5.5 V	1.1 mm	1.25 mm	Not Qualified	1.65 V	.01 mA		e4	30	260	2 mm	LVC/LCX/Z
CD4050BD	Texas Instruments	BUFFER	MILITARY	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1	TUBE	10	5/15	50 pF	SMALL OUTLINE	SOP16,.25	140 ns	18 Amp	Gates	1.27 mm	125 Cel		-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16	1	18 V	1.75 mm	3.9 mm	Not Qualified	3 V	.12 mA		e4	NOT SPECIFIED	260	9.9 mm	4000/14000/40000
SN7407DR	Texas Instruments	BUFFER	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	TTL		1	TR	5	5	50 pF	SMALL OUTLINE	SOP14,.25	30 ns	40 Amp	Gates	1.27 mm	70 Cel	OPEN-COLLECTOR	0 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1	5.25 V	1.75 mm	3.91 mm	Not Qualified	4.75 V	41 mA		e4	30	260	8.65 mm	TTL/H/L
SN74LVC1G07DRLRG4	Texas Instruments	BUFFER	AUTOMOTIVE	FLAT	5	VSOF	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	3.3	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	FL6,.047,20	8.6 ns	32 Amp	Gates	.5 mm	125 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	DUAL	R-PDSO-F5	1	5.5 V	.6 mm	1.2 mm	Not Qualified	1.65 V	.01 mA		e4	NOT SPECIFIED	260	1.6 mm	LVC/LCX/Z
CD4050BDWR	Texas Instruments	BUFFER	MILITARY	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1	TR	10	5/15	50 pF	SMALL OUTLINE	SOP16,.4	140 ns	18 Amp	Gates	1.27 mm	125 Cel		-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16	1	15 V	2.65 mm	7.5 mm	Not Qualified	5 V	.12 mA		e4	NOT SPECIFIED	260	10.3 mm	4000/14000/40000
CD4050BE	Texas Instruments	BUFFER	MILITARY	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	6	CMOS		1	TUBE	10	5/15	50 pF	IN-LINE	DIP16,.3	140 ns	18 Amp	Gates	2.54 mm	125 Cel		-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDIP-T16		15 V	5.08 mm	7.62 mm	Not Qualified	5 V	.12 mA	CMOS-TTL LEVEL TRANSLATOR	e4	NOT SPECIFIED	NOT SPECIFIED	19.305 mm	4000/14000/40000
NL37WZ17USG	Onsemi	BUFFER	INDUSTRIAL	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	3	CMOS		1	TR	1.85	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	TSSOP8,.12,20	9.2 ns	32 Amp	Gates	.5 mm	125 Cel		-55 Cel	NICKEL SILVER GOLD PALLADIUM	DUAL	R-PDSO-G8	1	5.5 V	.9 mm	2 mm	Not Qualified	1.65 V	100 mA			30	260	2.3 mm	37WZ
74LVC2G07GV,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSOP6,.11,37	8.4 ns	24 Amp	Gates	.95 mm	125 Cel	OPEN-DRAIN	-40 Cel	Tin (Sn)	DUAL	R-PDSO-G6	1	5.5 V	1.1 mm	1.5 mm	Not Qualified	1.65 V			e3	30	260	2.9 mm	LVC/LCX/Z

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.