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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	Screening Level	No. of Inputs	No. of Bits	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	Control Type	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Output Polarity	Minimum Supply Voltage (Vsup)	Maximum Power Supply Current (ICC)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
CD74HC4050MTE4	Texas Instruments	BUFFER	MILITARY	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1		TR	4.5	2/6	50 pF	SMALL OUTLINE	SOP16,.25	130 ns	4 Amp	Gates	1.27 mm	125 Cel		-55 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	1	6 V	1.75 mm	3.9 mm	Not Qualified		2 V		CMOS-TTL LEVEL TRANSLATOR	e4	30	260	9.9 mm	HC/UH
MC74VHC1GT50DFT1	Onsemi	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	1.8	3.3/5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	25.5 ns	8 Amp	Gates	.65 mm	125 Cel		-55 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm	Not Qualified		1.65 V			e0	30	235	2 mm	AHC/VHC
NL17SZ17DBVT1G	Onsemi	BUFFER	MILITARY	GULL WING	5	TSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS		1		TR	3.3		50 pF	SMALL OUTLINE, VERY THIN PROFILE	TSOP5/6,.11,37	15.6 ns	24 Amp		.95 mm	125 Cel		-55 Cel	MATTE TIN	DUAL		R-PDSO-G5	1	5.5 V	1.1 mm	1.5 mm			1.65 V	.01 mA		e3	30	260	3 mm	LVC/LCX/Z
MC74VHC1GT50DF2G	Onsemi	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	5	3.3/5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	25.5 ns	8 Amp	Gates	.65 mm	125 Cel		-55 Cel	TIN	DUAL		R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm	Not Qualified		1.65 V			e3		260	2 mm	AHC/VHC/H/U/V
74AUP1T34GW	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	1.2	1.2/3.3	30 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	33.5 ns	1.7 Amp	Gates	.65 mm	125 Cel		-40 Cel	Tin (Sn)	DUAL		R-PDSO-G5	1	3.6 V	1.1 mm	1.25 mm	Not Qualified		1.1 V			e3	30	260	2.05 mm	AUP/ULP/V
74LVC2G07GW	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2	CMOS		1			1.8	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	8.4 ns	24 Amp	Gates	.65 mm	125 Cel	OPEN-COLLECTOR	-40 Cel	Tin (Sn)	DUAL		R-PDSO-G6	1	5.5 V	1.1 mm	1.25 mm	Not Qualified		1.65 V			e3	30	260	2 mm	LVC/LCX/Z
DM5407J/883C	National Semiconductor	BUFFER	MILITARY	THROUGH-HOLE	14	DIP	RECTANGULAR	CERAMIC	NO	NO	6	TTL	MIL-STD-883 Class C	1			5	5		IN-LINE	DIP14,.3			Gates	2.54 mm	125 Cel	OPEN-COLLECTOR	-55 Cel	Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T14					Not Qualified					e0				TTL/H/L
HCF4010M013TR	STMicroelectronics	BUFFER	MILITARY	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1		TR	5	5/15	50 pF	SMALL OUTLINE	SOP16,.25	200 ns		Gates	1.27 mm	125 Cel	OPEN-DRAIN	-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G16	3	20 V	1.75 mm	3.9 mm	Not Qualified		3 V		HIGH TO LOW LEVEL TRANSLATOR	e4	30	260	9.9 mm	4000/14000/40000
SN7407NSRG4	Texas Instruments	BUFFER	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	TTL		1		TR	5	5	50 pF	SMALL OUTLINE	SOP14,.3	30 ns	40 Amp	Gates	1.27 mm	70 Cel	OPEN-COLLECTOR	0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14	1	5.25 V	2 mm	5.3 mm	Not Qualified		4.75 V	41 mA		e4	30	260	10.3 mm	TTL/H/L
TC7SET34FU,LJ(CT	Toshiba	BUFFER	INDUSTRIAL	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1			5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		12 ns			.65 mm	85 Cel		-40 Cel		DUAL		R-PDSO-G5		5.5 V	1.1 mm	1.25 mm			4.5 V		SEATED HT-CALCULATED				2 mm	AHCT/VHCT/VT
74HC7014D	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	6	CMOS		1				3.3/5	50 pF	SMALL OUTLINE	SOP14,.25	715 ns	4 Amp	Gates	1.27 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G14	1	6 V	1.75 mm	3.9 mm	Not Qualified		3 V			e4	30	260	8.65 mm	HC/UH
CD74HC4050PWRE4	Texas Instruments	BUFFER	MILITARY	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1		TR	4.5	2/6	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	130 ns	4 Amp	Gates	.65 mm	125 Cel		-55 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	1	6 V	1.2 mm	4.4 mm	Not Qualified		2 V		CMOS-TTL LEVEL TRANSLATOR	e4	30	260	5 mm	HC/UH
SN74LVC3G17YZPR	Texas Instruments	BUFFER	INDUSTRIAL	BALL	8	VFBGA	RECTANGULAR	UNSPECIFIED	YES	YES	3	CMOS		1		TR	1.8	3.3	50 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA8,2X4,20	9.2 ns	32 Amp	Gates	.5 mm	85 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		R-XBGA-B8	1	5.5 V	.5 mm	.9 mm	Not Qualified		1.65 V	.01 mA		e1	NOT SPECIFIED	260	1.9 mm	LVC/LCX/Z
7407N	Signetics	BUFFER	COMMERCIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY		NO	6	TTL		1			5			IN-LINE		30 ns				70 Cel	OPEN-COLLECTOR	0 Cel		DUAL		R-PDIP-T14		5.25 V			Not Qualified		4.75 V		IOH = 250UA @ VOH = 30V; IOL = 40MA @ VOL = 0.7V					TTL/H/L
74HCT2G17GW-Q100	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	AEC-Q100	1			5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		45 ns			.65 mm	125 Cel		-40 Cel		DUAL		R-PDSO-G6		5.5 V	1.1 mm	1.25 mm			4.5 V						2 mm	HCT
SN74AUP1T17DCKR	Texas Instruments	BUFFER	INDUSTRIAL	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS		1	1	TR	2.5	2.5/3.3	30 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	10.8 ns	4 Amp	Gates	.65 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G5	1	3.6 V	1.1 mm	1.25 mm	Not Qualified		2.3 V	.0036 mA		e4	NOT SPECIFIED	260	2 mm	AUP/ULP/V
74HC7014D-T	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6	CMOS		1			5			SMALL OUTLINE		715 ns			1.27 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14	1	6 V	1.75 mm	3.9 mm	Not Qualified		3 V			e4			8.65 mm	HC/UH
74LVC2G34DW-7	Diodes Incorporated	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2	CMOS		1		TR	1.8	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	10.8 ns	24 Amp	Gate	.65 mm	125 Cel		-40 Cel	MATTE TIN	DUAL		R-PDSO-G6	1	5.5 V	1.1 mm	1.25 mm	Not Qualified		1.65 V			e3	30	260	2 mm	LVC/LCX/Z
MC74VHC1G07DTT1G	Onsemi	BUFFER	MILITARY	GULL WING	5	TSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	3	2/5.5	50 pF	SMALL OUTLINE, THIN PROFILE	TSOP5/6,.11,37	14.5 ns	8 Amp	Gates	.95 mm	125 Cel	OPEN-DRAIN	-55 Cel	MATTE TIN	DUAL		R-PDSO-G5	1	5.5 V	1.1 mm	1.5 mm	Not Qualified		2 V	50 mA		e3	30	260	3 mm	AHC/VHC/H/U/V
NLV37WZ17USG	Onsemi	BUFFER	INDUSTRIAL	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	3	CMOS	AEC-Q100	1		TR	1.85	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	TSSOP8,.12,20	9.2 ns	32 Amp	Gates	.5 mm	125 Cel		-55 Cel	MATTE TIN	DUAL		R-PDSO-G8	1	5.5 V	.9 mm	2 mm	Not Qualified		1.65 V	100 mA		e3	30	260	2.3 mm	37WZ
SN74AUP1G07DBVR	Texas Instruments	BUFFER	INDUSTRIAL	GULL WING	5	LSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	1.1	1.2/3.3	30 pF	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSOP5/6,.11,37	14.7 ns	4 Amp	Gates	.95 mm	85 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G5	1	3.6 V	1.45 mm	1.6 mm	Not Qualified		.8 V	.0009 mA		e4	NOT SPECIFIED	260	2.9 mm	AUP/ULP/V
CD74HC4050E	Texas Instruments	BUFFER	MILITARY	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	6	CMOS		1		TUBE	4.5	2/6	50 pF	IN-LINE	DIP16,.3	130 ns	4 Amp	Gates	2.54 mm	125 Cel		-55 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDIP-T16		6 V	5.08 mm	7.62 mm	Not Qualified		2 V	.04 mA	CMOS-TTL LEVEL TRANSLATOR	e4			19.305 mm	HC
MC14050BDG	Onsemi	BUFFER	MILITARY	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1		RAIL	5	5/15	50 pF	SMALL OUTLINE	SOP16,.25	140 ns		Gates	1.27 mm	125 Cel		-55 Cel	MATTE TIN	DUAL		R-PDSO-G16	1	18 V	1.75 mm	3.9 mm	Not Qualified		3 V			e3	30	260	9.9 mm	4000/14000/40000
SN7407N3	Texas Instruments	BUFFER	COMMERCIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	6	TTL		1			5	5	50 pF	IN-LINE	DIP14,.3	30 ns		Gates	2.54 mm	70 Cel	OPEN-COLLECTOR	0 Cel		DUAL		R-PDIP-T14		5.25 V	5.08 mm	7.62 mm	Not Qualified		4.75 V	41 mA			NOT SPECIFIED	NOT SPECIFIED	19.305 mm	TTL/H/L
SN74LVC07AMPWREP	Texas Instruments	BUFFER	MILITARY	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1		TR	1.8	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	6.6 ns	24 Amp	Gates	.65 mm	125 Cel	OPEN-DRAIN	-55 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14	1	5.5 V	1.2 mm	4.4 mm	Not Qualified		1.65 V	.01 mA		e4	30	260	5 mm	LVC/LCX/Z
SN74LVC1G17DRYR	Texas Instruments	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS		1		TR	3.3	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	11 ns	24 Amp	Gates	.5 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-N6	1	5.5 V	.6 mm	1 mm	Not Qualified		1.65 V	.01 mA		e4	NOT SPECIFIED	260	1.45 mm	LVC/LCX/Z
SN74LVC2G07DSF2	Texas Instruments	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	2	CMOS		1		TR	1.8			SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	8.6 ns	32 Amp		.35 mm	125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-N6	1	5.5 V	.4 mm	1 mm			1.65 V	.01 mA		e4	30	260	1 mm	LVC/LCX/Z
74HCT3G07DP-Q100H	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	NO	YES	3	CMOS	AEC-Q100	1		TR	5	5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.16	32 ns	4 Amp	Gates	.65 mm	125 Cel	OPEN-DRAIN	-40 Cel		DUAL		S-PDSO-G8		5.5 V	1.1 mm	3 mm	Not Qualified		4.5 V						3 mm	HCT
74LVC1G07GV	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	1.8	3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSOP5/6,.11,37	8.4 ns	24 Amp	Gates	.95 mm	125 Cel	OPEN-COLLECTOR	-40 Cel	Tin (Sn)	DUAL		R-PDSO-G5	1	5.5 V	1.1 mm	1.5 mm	Not Qualified		1.65 V			e3	30	260	2.9 mm	LVC/LCX/Z
CD4050BDWRE4	Texas Instruments	BUFFER	MILITARY	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1		TR	10	5/15	50 pF	SMALL OUTLINE	SOP16,.4	140 ns		Gates	1.27 mm	125 Cel		-55 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	1	15 V	2.65 mm	7.5 mm	Not Qualified		5 V			e4	30	260	10.3 mm	4000/14000/40000
CD4050BEE4	Texas Instruments	BUFFER	MILITARY	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	6	CMOS		1		TUBE	10	5/15	50 pF	IN-LINE	DIP16,.3	140 ns	18 Amp	Gate	2.54 mm	125 Cel		-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDIP-T16		15 V	5.08 mm	7.62 mm	Not Qualified		5 V	.12 mA		e4	NOT SPECIFIED	NOT SPECIFIED	19.305 mm	4000/14000/40000
NC7WZ16L6XF012	Onsemi	BUFFER	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1			1.8			SMALL OUTLINE, VERY THIN PROFILE		10.6 ns			.5 mm	85 Cel		-40 Cel		DUAL		R-PDSO-N6		5.5 V	.55 mm	1 mm			1.65 V						1.45 mm	LVC/LCX/Z
NC7WZ16L6X_NL	Fairchild Semiconductor	BUFFER	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1			1.8			SMALL OUTLINE, VERY THIN PROFILE		10.6 ns			.5 mm	85 Cel		-40 Cel		DUAL		R-PDSO-N6		5.5 V	.55 mm	1 mm	Not Qualified		1.65 V						1.45 mm	LVC/LCX/Z
SN74LVC1G34DBVTG4	Texas Instruments	BUFFER	AUTOMOTIVE	GULL WING	5	LSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	3.3	3.3	50 pF	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSOP5/6,.11,37	9.9 ns	32 Amp	Gates	.95 mm	125 Cel	3-STATE	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G5	1	5.5 V	1.45 mm	1.6 mm	Not Qualified		1.65 V	.001 mA		e4	NOT SPECIFIED	260	2.9 mm	LVC/LCX/Z
SN74LVC3G34DCTRG4	Texas Instruments	BUFFER	AUTOMOTIVE	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3	CMOS		1		TR	3.3	3.3	50 pF	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP8,.16	7.9 ns	32 Amp	Gates	.65 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G8	1	5.5 V	1.3 mm	2.8 mm	Not Qualified		1.65 V	.01 mA		e4	NOT SPECIFIED	260	2.95 mm	LVC/LCX/Z
74HC4050D-Q100J	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS	AEC-Q100	1		TR	5	2/6	50 pF	SMALL OUTLINE	SOP16,.25	130 ns	4 Amp	Gates	1.27 mm	125 Cel		-40 Cel		DUAL		R-PDSO-G16		6 V	1.75 mm	3.9 mm	Not Qualified		2 V						9.9 mm	HC/UH
NLV74VHC1GT50DTT1G	Onsemi	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS	AEC-Q100	1		TR	5		50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSOP5/6,.11,37	25.5 ns	8 Amp		.95 mm	125 Cel		-55 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G5	1	5.5 V	1.1 mm	1.5 mm			1.65 V	.04 mA		e3	30	260	3 mm	AHC/VHC/H/U/V
SN74LV07ADR	Texas Instruments	BUFFER	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1		TR	2.5	3.3	50 pF	SMALL OUTLINE	SOP14,.25	18 ns	16 Amp	Gates	1.27 mm	125 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G14	1	5.5 V	1.75 mm	3.9 mm	Not Qualified		2 V	.02 mA		e4	NOT SPECIFIED	260	8.65 mm	LV/LV-A/LVX/H
SN74LVC07AQPWRG4Q1	Texas Instruments	BUFFER	AUTOMOTIVE	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS	AEC-Q100	1		TR	1.8	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	3.5 ns	24 Amp	Gates	.65 mm	125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14	1	5.5 V	1.2 mm	4.4 mm	Not Qualified		1.65 V	.04 mA		e4	30	260	5 mm	LVC/LCX/Z
SN74LVC1G07DSF2	Texas Instruments	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1			3.3			SMALL OUTLINE, VERY THIN PROFILE		8.6 ns	32 Amp		.35 mm	125 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	DUAL		S-PDSO-N6	1	5.5 V	.4 mm	1 mm			1.65 V	.01 mA		e4	NOT SPECIFIED	260	1 mm	LVC/LCX/Z
74AUP1G07GW	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1			1.1	1.2/3.3	30 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	20.7 ns	1.7 Amp	Gates	.65 mm	125 Cel	OPEN-DRAIN	-40 Cel	Tin (Sn)	DUAL		R-PDSO-G5	1	3.6 V	1.1 mm	1.25 mm	Not Qualified		.8 V			e3	30	260	2.05 mm	AUP/ULP/V
74LVC2G34GV-Q100,1	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2	CMOS	AEC-Q100	1		TR	3.3	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSOP6,.11,37	10.8 ns	24 Amp	Gates	.95 mm	125 Cel		-40 Cel	Tin (Sn)	DUAL		R-PDSO-G6		5.5 V	1.1 mm	1.5 mm	Not Qualified		1.65 V			e3			2.9 mm	LVC/LCX/Z
DM5417J	National Semiconductor	BUFFER	MILITARY	THROUGH-HOLE	14	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	NO	6	TTL		1			5	5		IN-LINE	DIP14,.3	30 ns	30 Amp	Gates	2.54 mm	125 Cel	OPEN-COLLECTOR	-55 Cel	TIN LEAD	DUAL		R-GDIP-T14		5.5 V	5.08 mm	7.62 mm	Not Qualified		4.5 V	41 mA		e0				TTL/H/L
MC74VHC1G07DFT2G	Onsemi	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	3	2/5.5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	14.5 ns	8 Amp	Gates	.65 mm	125 Cel	OPEN-DRAIN	-55 Cel	MATTE TIN	DUAL		R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm	Not Qualified		2 V	50 mA		e3	30	260	2 mm	AHC/VHC/H/U/V
74HC4050DB,118	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	6	CMOS		1			5		50 pF	SMALL OUTLINE, SHRINK PITCH		26 ns			.65 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	1	6 V	2 mm	5.3 mm	Not Qualified		2 V		CMOS-TTL LEVEL TRANSLATOR	e4			6.2 mm	HC/UH
MC74VHC1GT50DTT1	Onsemi	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	1.8	3.3/5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSOP5/6,.11,37	25.5 ns	8 Amp	Gates	.95 mm	125 Cel		-55 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G5	1	5.5 V	1.1 mm	1.5 mm	Not Qualified		1.65 V			e0	30	235	3 mm	AHC/VHC
NLU1GT126CMUTCG	Onsemi	BUFFER	MILITARY	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1	1	TR	5	1.8/5	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	16 ns	4 Amp	Bus Driver/Transceivers	.35 mm	125 Cel	3-STATE	-55 Cel	Nickel/Gold/Palladium (Ni/Au/Pd)	DUAL	ENABLE HIGH	S-PDSO-N6	1	5.5 V	.55 mm	1 mm	Not Qualified	TRUE	1.65 V				30	260	1 mm	1G
SN7417DR	Texas Instruments	BUFFER	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	6	TTL		1		TR	5	5	50 pF	SMALL OUTLINE	SOP14,.25	30 ns	40 Amp	Gates	1.27 mm	70 Cel	OPEN-COLLECTOR	0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14	1	5.25 V	1.75 mm	3.91 mm	Not Qualified		4.75 V	41 mA		e4	30	260	8.65 mm	TTL/H/L

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.