BUFFER Logic Gates 2,400+

Reset All

Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	Screening Level	No. of Inputs	No. of Bits	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	Control Type	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Output Polarity	Minimum Supply Voltage (Vsup)	Maximum Power Supply Current (ICC)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
CD4050BF3A	Texas Instruments	BUFFER	MILITARY	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	NO	6	CMOS	38535Q/M;38534H;883B	1		TUBE	10	5/15	50 pF	IN-LINE	DIP16,.3	140 ns	6.4 Amp	Gates	2.54 mm	125 Cel		-55 Cel	Tin/Lead (Sn/Pb)	DUAL		R-GDIP-T16		15 V	5.08 mm	7.62 mm	Not Qualified		5 V	.06 mA		e0	NOT SPECIFIED	NOT SPECIFIED	19.05 mm	4000/14000/40000
CD4050BF/3A	Rca Solid State	BUFFER	MILITARY	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC	NO	NO		CMOS	38535Q/M;38534H;883B					5/15		IN-LINE	DIP16,.3			Gates	2.54 mm	125 Cel		-55 Cel	Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T16					Not Qualified					e0
MC74LVX50DTG	Onsemi	BUFFER	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1		RAIL	2.7	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	16 ns	4 Amp	Gates	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14	1	3.6 V	1.2 mm	4.4 mm	Not Qualified		2 V			e4	30	260	5 mm	LV/LV-A/LVX/H
MC74VHC1GT50DBVT1G	Onsemi	BUFFER	MILITARY	GULL WING	5	TSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	3		50 pF	SMALL OUTLINE, THIN PROFILE	TSOP5/6,.11,37	14.5 ns	8 Amp		.95 mm	125 Cel		-55 Cel	MATTE TIN	DUAL		R-PDSO-G5	1	5.5 V	1.1 mm	1.5 mm			2 V	.04 mA		e3	30	260	3 mm	AHC/VHC
MC74VHC1GT50DFT2	Onsemi	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	1.8	3.3/5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	25.5 ns	8 Amp	Gates	.65 mm	125 Cel		-55 Cel	TIN LEAD	DUAL		R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm	Not Qualified		1.65 V			e0		235	2 mm	AHC/VHC
TC7SZ07FU	Toshiba	BUFFER	INDUSTRIAL	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1			1.8	3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	10.5 ns	24 Amp	Gates	.65 mm	85 Cel	OPEN-DRAIN	-40 Cel		DUAL		R-PDSO-G5		5.5 V	1.1 mm	1.25 mm	Not Qualified		1.65 V				NOT SPECIFIED	NOT SPECIFIED	2 mm	LVC/LCX/Z
TC7SZ07FU(TE85L,F)	Toshiba	BUFFER	INDUSTRIAL	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	5	3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	10.5 ns	24 Amp	Gates	.635 mm	85 Cel	OPEN-DRAIN	-40 Cel		DUAL		R-PDSO-G5		5.5 V			Not Qualified		1.65 V
TC7SZ07FU(TE85L,JF	Toshiba	BUFFER	INDUSTRIAL	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1			1.8		50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	10.5 ns	24 Amp		.65 mm	85 Cel		-40 Cel		DUAL		R-PDSO-G5		5.5 V	.95 mm	1.25 mm			1.65 V						2 mm	LVC/LCX/Z
74LVC3G34DC-Q100H	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3	CMOS	AEC-Q100	1		TR	3.3	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	TSSOP8,.12,20	10.8 ns	24 Amp	Gates	.5 mm	125 Cel		-40 Cel		DUAL		R-PDSO-G8		5.5 V	1 mm	2 mm	Not Qualified		1.65 V						2.3 mm	LVC/LCX/Z
NL27WZ07DTT1G	Onsemi	BUFFER	MILITARY	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2	CMOS		1		TR	1.8	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSOP6,.11,37	12 ns	24 Amp	Gates	.95 mm	125 Cel	OPEN-DRAIN	-55 Cel	MATTE TIN	DUAL		R-PDSO-G6	1	5.5 V	1.1 mm	1.5 mm	Not Qualified		1.65 V			e3	30	260	3 mm	27WZ
NLU1GT126MUTCG	Onsemi	BUFFER	MILITARY	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1	1	TR	5	1.8/5	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,16	16 ns	4 Amp	Bus Driver/Transceivers	.4 mm	125 Cel	3-STATE	-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	ENABLE HIGH	R-PDSO-N6	1	5.5 V	.55 mm	1 mm	Not Qualified	TRUE	1.65 V			e4	NOT SPECIFIED	NOT SPECIFIED	1.2 mm	1G
74LVC2G34GV,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2	CMOS		1		TR	1.8	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSOP6,.11,37	10.8 ns	24 Amp	Gates	.95 mm	125 Cel		-40 Cel	Tin (Sn)	DUAL		R-PDSO-G6	1	5.5 V	1.1 mm	1.5 mm	Not Qualified		1.65 V			e3	30	260	2.9 mm	LVC/LCX/Z
74LVCE1G07SE-7	Diodes Incorporated	BUFFER	INDUSTRIAL	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	1.5	3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	9.9 ns	24 Amp	Gates	.65 mm	85 Cel	OPEN-DRAIN	-40 Cel	MATTE TIN	DUAL		R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm	Not Qualified		1.4 V			e3	30	260	2 mm	LVC/LCX/Z
MC74VHC1GT50DFT1G	Onsemi	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1			1.8			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		25.5 ns			.65 mm	125 Cel		-55 Cel	MATTE TIN	DUAL		R-PDSO-G5		5.5 V	1.1 mm	1.25 mm	Not Qualified		1.65 V			e3			2 mm	AHC/VHC
MC74VHC1GT50DT1G	Onsemi	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	5	3.3/5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	25.5 ns	8 Amp	Gates	.95 mm	125 Cel		-55 Cel	TIN	DUAL		R-PDSO-G5	1	5.5 V	1.1 mm	2 mm	Not Qualified		1.65 V			e3		260	3 mm	AHC/VHC/H/U/V
74LVC2G17GM,115	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	YES	2	CMOS		1		TR	1.8	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	13.1 ns	24 Amp	Gates	.5 mm	125 Cel		-40 Cel	Tin (Sn)	DUAL		R-PDSO-N6	1	5.5 V	.5 mm	1 mm	Not Qualified		1.65 V			e3	30	260	1.45 mm	LVC/LCX/Z
NL17SH34P5T5G	Onsemi	BUFFER	MILITARY	FLAT	5	VSOF	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	5	1.8/5	50 pF	SMALL OUTLINE, VERY THIN PROFILE	FL6,.03,14	14.5 ns	4 Amp	Gates	.35 mm	125 Cel		-55 Cel	MATTE TIN	DUAL		R-PDSO-F5	1	5.5 V	.4 mm	.8 mm	Not Qualified		1.65 V			e3	30	260	1 mm	17SH
NL17SZ07XV5T2G-L22087	Onsemi	BUFFER	MILITARY	FLAT	5	VSOF	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	1.8	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	FL5/6,.047,20	12 ns	32 Amp	Gates	.5 mm	125 Cel	OPEN-DRAIN	-55 Cel	TIN	DUAL		R-PDSO-F5		5.5 V	.6 mm	1.2 mm	Not Qualified		1.65 V	100 mA		e3			1.6 mm	17SZ
NL37WZ07USG	Onsemi	BUFFER	INDUSTRIAL	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3	CMOS		1		TR	1.8	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	TSSOP8,.12,20	7.8 ns	24 Amp	Gates	.5 mm	85 Cel	OPEN-DRAIN	-40 Cel	NICKEL SILVER GOLD PALLADIUM	DUAL		R-PDSO-G8	1	5.5 V	.9 mm	2 mm	Not Qualified		1.65 V				30	260	2.3 mm	37WZ
SN74LV07APWRG4	Texas Instruments	BUFFER	AUTOMOTIVE	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1		TR	2.5	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	18 ns	16 Amp	Gates	.65 mm	125 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G14	1	5.5 V	1.2 mm	4.4 mm	Not Qualified		2 V	.02 mA		e4	NOT SPECIFIED	260	5 mm	LV/LV-A/LVX/H
SN74LVC3G07DCTR	Texas Instruments	BUFFER	AUTOMOTIVE	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3	CMOS		1		TR	1.8	3.3	50 pF	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP8,.16	7.8 ns	32 Amp	Gates	.65 mm	125 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G8	1	5.5 V	1.3 mm	2.8 mm	Not Qualified		1.65 V	.01 mA		e4	NOT SPECIFIED	260	2.95 mm	LVC/LCX/Z
74AHC1G07GV,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1			5	2/5.5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSOP5/6,.11,37	12.5 ns	4 Amp	Gates	.95 mm	125 Cel	OPEN-DRAIN	-40 Cel	Tin (Sn)	DUAL		R-PDSO-G5	1	5.5 V	1.1 mm	1.5 mm	Not Qualified		2 V			e3	30	260	2.9 mm	AHC
74AUP1T34GW-Q100	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	AEC-Q100	1			1.2			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		33.5 ns			.65 mm	125 Cel		-40 Cel		DUAL		R-PDSO-G5		3.6 V	1.1 mm	1.25 mm			1.1 V						2.05 mm	AUP/ULP/V
74LVC1G34GS,132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	3.3	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	11 ns	24 Amp	Gates	.35 mm	125 Cel		-40 Cel	TIN	DUAL		S-PDSO-N6	1	5.5 V	.35 mm	1 mm	Not Qualified		1.65 V			e3	30	260	1 mm	LVC/LCX/Z
74LVC2G07GXZ	Nexperia	BUFFER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1		TR, 7 INCH	1.8			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		8.4 ns				125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM		R-PBCC-B6	1	5.5 V	.35 mm	.8 mm			1.65 V			e4	30	260	1 mm	LVC/LCX/Z
74LVC2G16GWH	Nexperia	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		2		TR, 7 INCH	1.8			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		10.8 ns			.65 mm	125 Cel		-40 Cel	TIN	DUAL		R-PDSO-G6	1	5.5 V	1.1 mm	1.25 mm			1.65 V			e3	30	260	2 mm	LVC/LCX/Z
MM74HC4050M	National Semiconductor	BUFFER	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1			5	2/6	50 pF	SMALL OUTLINE	SOP16,.25	20 ns	4 Amp	Gates	1.27 mm	85 Cel		-40 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G16		6 V	1.75 mm	3.9 mm	Not Qualified		2 V		WITH EXTENDED INPUT VOLTAGE	e0			9.9 mm	HC/UH
NC7NZ34L8X	Onsemi	BUFFER	INDUSTRIAL	NO LEAD	8	VQCCN	SQUARE	UNSPECIFIED	NO	YES	3	CMOS		1		TR	1.8	3.3	50 pF	CHIP CARRIER	LCC8,.06SQ,20	8.8 ns	24 Amp	Gates	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N8	1	5.5 V	.55 mm	1.6 mm	Not Qualified		1.65 V			e4	30	260	1.6 mm	LVC/LCX/Z
NL17SG34P5T5G	Onsemi	BUFFER	MILITARY	FLAT	5	VSOF	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	1.1	1.2/3.3	30 pF	SMALL OUTLINE, VERY THIN PROFILE	FL5/6,.03,14	22.4 ns	8 Amp	Gates	.35 mm	125 Cel		-55 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-F5	1	4.6 V	.4 mm	.8 mm	Not Qualified		.9 V	20 mA		e3	NOT SPECIFIED	NOT SPECIFIED	1 mm	LVP
SN5407J	Texas Instruments	BUFFER	MILITARY	THROUGH-HOLE	14	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	NO	6	TTL	MIL-PRF-38535	1		TUBE	5	5	50 pF	IN-LINE	DIP14,.3	30 ns	30 Amp	Gates	2.54 mm	125 Cel	OPEN-COLLECTOR	-55 Cel	TIN LEAD	DUAL		R-GDIP-T14		5.5 V	5.08 mm	7.62 mm	Not Qualified		4.5 V	41 mA	IOL = 30MA @ VOL = 0.7V; IOH = 0.25MA @ VOH = 30V	e0			19.56 mm	TTL/H/L
SN7407DE4	Texas Instruments	BUFFER	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	TTL		1		TUBE	5	5	50 pF	SMALL OUTLINE	SOP14,.25	30 ns	40 Amp	Gate	1.27 mm	70 Cel	OPEN-COLLECTOR	0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14	1	5.25 V	1.75 mm	3.91 mm	Not Qualified		4.75 V	41 mA		e4	30	260	8.65 mm	TTL/H/L
SN7407DG4	Texas Instruments	BUFFER	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	TTL		1		TUBE	5	5	50 pF	SMALL OUTLINE	SOP14,.25	30 ns	40 Amp	Gate	1.27 mm	70 Cel	OPEN-COLLECTOR	0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14	1	5.25 V	1.75 mm	3.91 mm	Not Qualified		4.75 V	41 mA		e4	30	260	8.65 mm	TTL/H/L
SN74AUC1G17DCKR	Texas Instruments	BUFFER	INDUSTRIAL	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS		1		TR	1.2	1.2/2.5	15 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	3.9 ns	9 Amp	Gate	.65 mm	85 Cel	3-STATE	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G5	1	2.7 V	1.1 mm	1.25 mm	Not Qualified		.8 V	.01 mA		e4	NOT SPECIFIED	260	2 mm	AUC
SN74LV07ADGVR	Texas Instruments	BUFFER	AUTOMOTIVE	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1		TR	2.5	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	18 ns	16 Amp	Gates	.4 mm	125 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G14	1	5.5 V	1.2 mm	3.6 mm	Not Qualified		2 V	.02 mA		e4	NOT SPECIFIED	260	4.4 mm	LV/LV-A/LVX/H
SN74LV07ANSR	Texas Instruments	BUFFER	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1		TR	2.5	3.3	50 pF	SMALL OUTLINE	SOP14,.3	18 ns	16 Amp	Gates	1.27 mm	125 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G14	1	5.5 V	2 mm	5.3 mm	Not Qualified		2 V	.02 mA		e4	NOT SPECIFIED	260	10.2 mm	LV/LV-A/LVX/H
SN74LVC07ARGYR	Texas Instruments	BUFFER	AUTOMOTIVE	NO LEAD	14	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	6	CMOS		1		TR	1.8	3.3	50 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC14/18,.14SQ,20	5.6 ns	24 Amp	Gates	.5 mm	125 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N14	2	5.5 V	1 mm	3.5 mm	Not Qualified		1.65 V	.04 mA		e4	NOT SPECIFIED	260	3.5 mm	LVC/LCX/Z
SN74LVC1G17DRYRG4	Texas Instruments	BUFFER	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS		1		TR	3.3	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	11 ns	24 Amp	Gates	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-N6	1	5.5 V	.6 mm	1 mm	Not Qualified		1.65 V			e4	30	260	1.45 mm	LVC/LCX/Z
74AHC1G07GV-Q100H	Nexperia	BUFFER	AUTOMOTIVE	GULL WING	5	TSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	AEC-Q100	1		TR, 7 INCH	5			SMALL OUTLINE, THIN PROFILE		12.5 ns			.95 mm	125 Cel	OPEN-DRAIN	-40 Cel	TIN	DUAL		R-PDSO-G5	1	5.5 V	1.1 mm	1.5 mm			2 V			e3	30	260	2.9 mm	AHC/VHC/H/U/V
74HC2G17GW-Q100H	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	AEC-Q100	1			5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		175 ns			.65 mm	125 Cel		-40 Cel		DUAL		R-PDSO-G6		6 V	1.1 mm	1.25 mm			2 V						2 mm	HC/UH
74HC2G34GW,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1			5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		125 ns			.65 mm	125 Cel		-40 Cel	Tin (Sn)	DUAL		R-PDSO-G6	1	6 V	1.1 mm	1.25 mm	Not Qualified		2 V			e3	30	260	2 mm	HC/UH
74HCT2G34GW-Q100,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	AEC-Q100	1			5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		29 ns			.65 mm	125 Cel		-40 Cel		DUAL		R-PDSO-G6		5.5 V	1.1 mm	1.25 mm			4.5 V						2 mm	HCT
74LVC1G34GW-Q100,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	AEC-Q100	1			3.3			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		11 ns			.65 mm	125 Cel		-40 Cel		DUAL		R-PDSO-G5		5.5 V	1.1 mm	1.25 mm			1.65 V						2.05 mm	LVC/LCX/Z
74LVC3G07DC,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3	CMOS		1			1.8	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	TSSOP8,.12,20	8.4 ns	24 Amp	Gates	.5 mm	125 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G8	1	5.5 V	1 mm	2 mm	Not Qualified		1.65 V			e4	30	260	2.3 mm	LVC/LCX/Z
CD4050BDTE4	Texas Instruments	BUFFER	MILITARY	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1		TR	10	5/15	50 pF	SMALL OUTLINE	SOP16,.25	140 ns		Gates	1.27 mm	125 Cel		-55 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	1	15 V	1.75 mm	3.9 mm	Not Qualified		5 V			e4	30	260	9.9 mm	4000/14000/40000
HEF4050BT-Q100J	NXP Semiconductors	BUFFER	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6	CMOS	AEC-Q100	1			5			SMALL OUTLINE		110 ns			1.27 mm	85 Cel		-40 Cel		DUAL		R-PDSO-G16		15 V	1.75 mm	3.9 mm			3 V						9.9 mm	4000/14000/40000
MC74VHC1GT50DFT2G	Onsemi	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1			1.8			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		25.5 ns			.65 mm	125 Cel		-55 Cel		DUAL		R-PDSO-G5		5.5 V	1.1 mm	1.25 mm	Not Qualified		1.65 V				NOT SPECIFIED	NOT SPECIFIED	2 mm	AHC/VHC
NC7WV07L6X	Onsemi	BUFFER		NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2	CMOS		1		TR	1.1	1.2/3.3	30 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	18.6 ns	18 Amp	Gates	.5 mm	85 Cel	OPEN-DRAIN	-40 Cel	GOLD NICKEL	DUAL		R-PDSO-N6	1	3.6 V	.55 mm	1 mm	Not Qualified		.9 V	.0009 mA		e4	30	260	1.45 mm	AUP/ULP/V
NC7WZ17FHX	Onsemi	BUFFER	INDUSTRIAL	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	YES	YES	2	CMOS		1		TR	1.8	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	15.8 ns	32 Amp	Gates	.35 mm	85 Cel		-40 Cel	NICKEL PALLADIUM	DUAL		S-PDSO-N6	1	5.5 V	.55 mm	1 mm	Not Qualified		1.65 V	100 mA		e4	30	260	1 mm	LVC/LCX/Z

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.