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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	Screening Level	No. of Inputs	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Minimum Supply Voltage (Vsup)	Maximum Power Supply Current (ICC)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
SN7417DRE4	Texas Instruments	BUFFER	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	TTL		1	TR	5	5		SMALL OUTLINE	SOP14,.25	30 ns	40 Amp	Gates	1.27 mm	70 Cel	OPEN-COLLECTOR	0 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1	5.25 V	1.75 mm	3.9 mm	Not Qualified	4.75 V	41 mA		e4	30	260	8.65 mm	TTL/H/L
SN7417DRG4	Texas Instruments	BUFFER	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	TTL		1	TR	5	5		SMALL OUTLINE	SOP14,.25	30 ns	40 Amp	Gates	1.27 mm	70 Cel	OPEN-COLLECTOR	0 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1	5.25 V	1.75 mm	3.9 mm	Not Qualified	4.75 V	41 mA		e4	30	260	8.65 mm	TTL/H/L
SN74LV07ADBR	Texas Instruments	BUFFER	AUTOMOTIVE	GULL WING	14	SSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1	TR	2.5	3.3	50 pF	SMALL OUTLINE, SHRINK PITCH	SSOP14,.3	18 ns	16 Amp	Gates	.65 mm	125 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G14	1	5.5 V	2 mm	5.3 mm	Not Qualified	2 V	.02 mA		e4	NOT SPECIFIED	260	6.2 mm	LV/LV-A/LVX/H
74LCX07SJX	Onsemi	BUFFER	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1	TR	2.5	3.3	50 pF	SMALL OUTLINE	SOP14,.3	4.4 ns	24 Amp	Gates	1.27 mm	85 Cel	OPEN-DRAIN	-40 Cel	MATTE TIN	DUAL	R-PDSO-G14	1	5.5 V	2.1 mm	5.3 mm	Not Qualified	2 V			e3	30	260	10.2 mm	LVC/LCX/Z
74LVC2G07GS,132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	NO	YES	2	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	8.4 ns	24 Amp	Gates	.35 mm	125 Cel	OPEN-COLLECTOR	-40 Cel	TIN	DUAL	S-PDSO-N6	1	5.5 V	.35 mm	1 mm	Not Qualified	1.65 V			e3	30	260	1 mm	LVC/LCX/Z
SN74AUP1T34DSFR	Texas Instruments	BUFFER		NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1	TR, 7 INCH	1.2			SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14				.35 mm	85 Cel		-40 Cel		DUAL	S-PDSO-N6		3.6 V	.4 mm	1 mm		.9 V						1 mm	AUP/ULP/V
SN74LVC1G07DRYRG4	Texas Instruments	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	3.3	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC8,.04,20	8.6 ns	32 Amp	Gates	.5 mm	125 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	DUAL	R-PDSO-N6	1	5.5 V	.6 mm	1 mm	Not Qualified	1.65 V	.01 mA		e4	NOT SPECIFIED	260	1.45 mm	LVC/LCX/Z
74AUP1G07GW-Q100H	Nexperia	BUFFER											AEC-Q100		TR, 7 INCH																1									30	260
74AUP2G34GN,132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	SON	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	1.1	1.2/3.3	30 pF	SMALL OUTLINE	SOLCC6,.04,12	20.8 ns	1.7 Amp	Gates	.3 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N6	1	3.6 V	.35 mm	.9 mm	Not Qualified	.8 V			e3	30	260	1 mm	AUP/ULP/V
74LVC2G34GXZ	Nexperia	BUFFER	AUTOMOTIVE	NO LEAD	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1	TR, 7 INCH	1.8			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		10.8 ns				125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-N6	1	5.5 V	.35 mm	.8 mm		1.65 V	.004 mA		e4	30	260	1 mm	LVC/LCX/Z
74LVC3G17DP-Q100H	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	AEC-Q100	1		1.8			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		13.1 ns			.65 mm	125 Cel		-40 Cel		DUAL	S-PDSO-G8		5.5 V	1.1 mm	3 mm		1.65 V						3 mm	LVC/LCX/Z
SN74LV07APW	Texas Instruments	BUFFER	AUTOMOTIVE	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1	TUBE	2.5	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	18 ns	16 Amp	Gates	.65 mm	125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1	5.5 V	1.2 mm	4.4 mm	Not Qualified	2 V	.02 mA		e4	30	260	5 mm	LV/LV-A/LVX/H
74LVC2G07DW-7	Diodes Incorporated	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2	CMOS		1	TR	3.3	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	8.4 ns	24 Amp	Gate	.65 mm	125 Cel	OPEN-DRAIN	-40 Cel	MATTE TIN	DUAL	R-PDSO-G6	1	5.5 V	1.1 mm	1.25 mm	Not Qualified	1.65 V			e3	30	260	2 mm	LVC/LCX/Z
NLU2G16MUTCG	Onsemi	BUFFER	MILITARY	NO LEAD	6	VSON	RECTANGULAR	UNSPECIFIED	NO	YES	2	CMOS		1	TR	3	1.8/5	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,16	14.5 ns	.05 Amp	Gates	.4 mm	125 Cel		-55 Cel	NICKEL PALLADIUM GOLD	DUAL	R-XDSO-N6	1	5.5 V	.55 mm	1 mm	Not Qualified	1.65 V			e4	30	260	1.2 mm	2G
SN74LV07APWT	Texas Instruments	BUFFER	AUTOMOTIVE	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1	TR	2.5	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	18 ns	16 Amp	Gates	.65 mm	125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1	5.5 V	1.2 mm	4.4 mm	Not Qualified	2 V	.02 mA		e4	30	260	5 mm	LV/LV-A/LVX/H
74AHCV17APWJ	Nexperia	BUFFER	AUTOMOTIVE	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	6	CMOS		1	TR, 13 INCH	5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		23.6 ns			.65 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1	5.5 V	1.1 mm	4.4 mm		1.8 V			e4	30	260	5 mm	AHCT/VHCT/VT
SN7407NP3	Texas Instruments	BUFFER	COMMERCIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	6	TTL		1		5	5	50 pF	IN-LINE	DIP14,.3	30 ns		Gates	2.54 mm	70 Cel	OPEN-COLLECTOR	0 Cel		DUAL	R-PDIP-T14		5.25 V	5.08 mm	7.62 mm	Not Qualified	4.75 V	41 mA	IOL = 40MA @ VOL = 0.7V; IOH = 0.25MA @ VOH = 30V		NOT SPECIFIED	NOT SPECIFIED	19.305 mm	TTL/H/L
TC7SET17F(TE85L,F)	Toshiba	BUFFER	INDUSTRIAL	GULL WING	5	TSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS		1	TR	5	5	50 pF	SMALL OUTLINE, THIN PROFILE	TSOP5/6,.11,37	12.4 ns	8 Amp	Gates	.95 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G5		5.5 V			Not Qualified	4.5 V
74HC4050D,652	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1		5	2/6	50 pF	SMALL OUTLINE	SOP16,.25	26 ns	4 Amp	Gates	1.27 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16	1	6 V			Not Qualified	2 V		CMOS-TTL LEVEL TRANSLATOR	e4	30	260		HC/UH
74HC4050DB,112	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1	TUBE	5	2/6	50 pF	SMALL OUTLINE, SHRINK PITCH	SSOP16,.3	26 ns	4 Amp	Gates	.65 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16	1	6 V	2 mm	5.3 mm	Not Qualified	2 V		CMOS-TTL LEVEL TRANSLATOR	e4	30	260	6.2 mm	HC/UH
MM74HC4050N	National Semiconductor	BUFFER	INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	6	CMOS		1		5	2/6	50 pF	IN-LINE	DIP16,.3	20 ns	4 Amp	Gates	2.54 mm	85 Cel		-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T16		6 V	5.08 mm	7.62 mm	Not Qualified	2 V		WITH EXTENDED INPUT VOLTAGE	e0			19.34 mm	HC/UH
NC7SP17P5X_NL	Fairchild Semiconductor	BUFFER	INDUSTRIAL	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS		1	TR	1.1	1.2/3.3	30 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	46.3 ns	.5 Amp	Gates	.65 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-G5	1	3.6 V	1.1 mm	1.25 mm	Not Qualified	.9 V			e3	30	260	2 mm	P
NC7SV17P5X	Onsemi	BUFFER	INDUSTRIAL	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS		1	TR	1.1	1.2/3.3	15 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	14.9 ns	2 Amp	Gates	.65 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-G5	1	3.6 V	1.1 mm	1.25 mm	Not Qualified	.9 V			e3	30	260	2 mm	AUP/ULP/V
SN74LS07DE4	Texas Instruments	BUFFER	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	TTL		1		5		15 pF	SMALL OUTLINE	SOP14,.25	30 ns	40 Amp	Gates	1.27 mm	70 Cel	OPEN-COLLECTOR	0 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1	5.25 V	1.75 mm	3.9 mm	Not Qualified	4.75 V	45 mA		e4	30	260	8.65 mm	LS
SN74LVC3G07DCTRG4	Texas Instruments	BUFFER	AUTOMOTIVE	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP8,.16	7.8 ns	32 Amp	Gates	.65 mm	125 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G8	1	5.5 V	1.3 mm	2.8 mm	Not Qualified	1.65 V	.01 mA		e4	NOT SPECIFIED	260	2.95 mm	LVC/LCX/Z
74AXP1T34GS,125	NXP Semiconductors	BUFFER	INDUSTRIAL	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1		1.2			SMALL OUTLINE, VERY THIN PROFILE		210 ns			.35 mm	85 Cel		-40 Cel		DUAL	S-PDSO-N6		2.75 V	.35 mm	1 mm		.7 V						1 mm	AXP
74LVC1G17GV-Q100	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	AEC-Q100	1		3.3			SMALL OUTLINE, SHRINK PITCH		14 ns			.95 mm	125 Cel		-40 Cel	PURE TIN	DUAL	R-PDSO-G5	1	5.5 V	1.9 mm	1.5 mm		1.65 V						2.9 mm	LVC/LCX/Z
74LVC2G17GW-Q100	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	2	CMOS	AEC-Q100	1		1.8			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	13.1 ns			.65 mm	125 Cel		-40 Cel	Pure Tin (Sn)	DUAL	R-PDSO-G6	1	5.5 V	1.1 mm	1.25 mm		1.65 V	.04 mA					2 mm	LVC/LCX/Z
74LVC2G34GM,115	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	10.8 ns	24 Amp	Gates	.5 mm	125 Cel		-40 Cel	Tin (Sn)	DUAL	R-PDSO-N6	1	5.5 V	.5 mm	1 mm	Not Qualified	1.65 V			e3	30	260	1.45 mm	LVC/LCX/Z
74LVC2G34GW-Q100	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	AEC-Q100	1		3.3			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		10.8 ns			.65 mm	125 Cel		-40 Cel	PURE TIN	DUAL	R-PDSO-G6	1	5.5 V	1.1 mm	1.25 mm		1.65 V						2 mm	LVC/LCX/Z
74LVC2G34W6-7	Diodes Incorporated	BUFFER	AUTOMOTIVE	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSOP6,.11,37	10.8 ns	24 Amp	Gate	.95 mm	125 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-G6	1	5.5 V	1.35 mm	1.6 mm	Not Qualified	1.65 V			e3	30	260	2.85 mm	LVC/LCX/Z
CD4050BM	Texas Instruments	BUFFER	MILITARY	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1		10	5/15	50 pF	SMALL OUTLINE	SOP16,.4	140 ns		Gates	1.27 mm	125 Cel		-55 Cel		DUAL	R-PDSO-G16		15 V	1.75 mm	3.9 mm	Not Qualified	5 V		CMOS-TTL LEVEL TRANSLATOR		NOT SPECIFIED	NOT SPECIFIED	9.9 mm	4000/14000/40000
HEF4050BT	NXP Semiconductors	BUFFER	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1		5	5/15	50 pF	SMALL OUTLINE	SOP16,.25	110 ns	.36 Amp	Gates	1.27 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16	1	15 V	1.75 mm	3.9 mm	Not Qualified	3 V		CMOS-TTL LEVEL TRANSLATOR	e4	30	260	9.9 mm	4000/14000/40000
MC14050BCPG	Onsemi	BUFFER	MILITARY	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	6	CMOS		1	RAIL	5	5/15	50 pF	IN-LINE	DIP16,.3	140 ns		Gates	2.54 mm	125 Cel		-55 Cel	Tin (Sn)	DUAL	R-PDIP-T16		18 V	4.44 mm	7.62 mm	Not Qualified	3 V			e3			19.175 mm	4000/14000/40000
NL27WZ17MU1TCG	Onsemi	BUFFER	MILITARY	NO LEAD	6	VSON	RECTANGULAR	UNSPECIFIED	YES	YES	2	CMOS		1	TR	2.3		50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	15.6 ns	32 Amp		.5 mm	125 Cel		-55 Cel	NICKEL SILVER GOLD PALLADIUM	DUAL	R-XDSO-N6	1	5.5 V	.55 mm	1 mm		1.65 V	100 mA			30	260	1.45 mm	LVC/LCX/Z
SN74AUC1G17DRLR	Texas Instruments	BUFFER	INDUSTRIAL	FLAT	5	VSOF	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS		1	TR	1.2	1.2/2.5	15 pF	SMALL OUTLINE, VERY THIN PROFILE	FL6,.047,20	3.9 ns	9 Amp	Gates	.5 mm	85 Cel	3-STATE	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	DUAL	R-PDSO-F5	1	2.7 V	.6 mm	1.2 mm	Not Qualified	.8 V	.01 mA		e4	NOT SPECIFIED	260	1.6 mm	AUC
SN74AUP1G17DCKRE4	Texas Instruments	BUFFER	INDUSTRIAL	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS		1	TR	1.2	1.2/3.3	30 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	19.8 ns	1.7 Amp	Gates	.65 mm	85 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G5	1	3.6 V	1.1 mm	1.25 mm	Not Qualified	.8 V			e4	30	260	2 mm	AUP/ULP/V
SN74AUP1G17DCKRG4	Texas Instruments	BUFFER	INDUSTRIAL	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS		1	TR	1.2	1.2/3.3	30 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	19.8 ns	4 Amp	Gates	.65 mm	85 Cel	3-STATE	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G5	1	3.6 V	1.1 mm	1.25 mm	Not Qualified	.8 V	.0009 mA		e4	NOT SPECIFIED	260	2 mm	AUP/ULP/V
SN74LS07NE4	Texas Instruments	BUFFER	COMMERCIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	6	TTL		1		5			IN-LINE	DIP14,.3	30 ns	40 Amp	Gates	2.54 mm	70 Cel	OPEN-COLLECTOR	0 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T14		5.25 V	5.08 mm	7.62 mm	Not Qualified	4.75 V	45 mA		e4			19.305 mm	LS
SN74LVC1G34DBVTE4	Texas Instruments	BUFFER	AUTOMOTIVE	GULL WING	5	LSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	3.3	3.3	50 pF	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSOP5/6,.11,37	9.9 ns	32 Amp	Gates	.95 mm	125 Cel	3-STATE	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G5	1	5.5 V	1.45 mm	1.6 mm	Not Qualified	1.65 V	.001 mA		e4	NOT SPECIFIED	260	2.9 mm	LVC/LCX/Z
SN74LVC1G34YFPR	Texas Instruments	BUFFER	INDUSTRIAL	BALL	4	VFBGA	SQUARE	UNSPECIFIED	NO	YES	1	CMOS		1	TR	3.3	3.3	50 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA4,2X2,16	9.9 ns	32 Amp	Gates	.4 mm	85 Cel	3-STATE	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	S-XBGA-B4	1	5.5 V	.5 mm	.8 mm	Not Qualified	1.65 V	.001 mA		e1	NOT SPECIFIED	260	.8 mm	LVC/LCX/Z
SN74LVC3G07DCUTG4	Texas Instruments	BUFFER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	TSSOP8,.12,20	7.8 ns	32 Amp	Gates	.5 mm	125 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G8	1	5.5 V	.9 mm	2 mm	Not Qualified	1.65 V	.01 mA		e4	NOT SPECIFIED	260	2.3 mm	LVC/LCX/Z
TC7SZ07FU(T5LJFT)	Toshiba	BUFFER
74AHC1G07GW-Q100H	Nexperia	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	AEC-Q100	1	TR, 7 INCH	5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		12.5 ns			.65 mm	125 Cel	OPEN-DRAIN	-40 Cel	TIN	DUAL	R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm		2 V			e3	30	260	2.05 mm	AHC/VHC/H/U/V
74AUP2G34GW,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1			1.2/3.3	30 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	20.8 ns	1.7 Amp	Gates	.65 mm	125 Cel		-40 Cel	Tin (Sn)	DUAL	R-PDSO-G6	1	3.6 V	1.1 mm	1.25 mm	Not Qualified	.8 V			e3	30	260	2 mm	AUP/ULP/V
74HC2G17GW-G	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		175 ns			.65 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G6	1	6 V	1.1 mm	1.25 mm	Not Qualified	2 V			e3			2 mm	HC/UH
74LVCE1G07W5-7	Diodes Incorporated	BUFFER	INDUSTRIAL	GULL WING	5	LSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	1.5	3.3		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSOP5/6,.11,37	9.9 ns	24 Amp	Gates	.95 mm	85 Cel	OPEN-DRAIN	-40 Cel	MATTE TIN	DUAL	R-PDSO-G5	1	5.5 V	1.45 mm	1.6 mm	Not Qualified	1.4 V			e3	30	260	3 mm	LVC/LCX/Z
CD4050BCMX	National Semiconductor	BUFFER	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6	CMOS		1		5		50 pF	SMALL OUTLINE		110 ns			1.27 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G16		15 V	1.75 mm	3.9 mm	Not Qualified	3 V		IOH = 0.72MA @ VOH = 4.6V; IOL = 3.2MA @ VOL = 0.4V; WITH EXTENDED INPUT VOLTAGE				9.9 mm	4000/14000/40000

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.