BUFFER Logic Gates 2,400+

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Part RoHS Manufacturer Logic IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Schmitt Trigger Surface Mount No. of Functions Technology Screening Level No. of Inputs No. of Bits Translation Packing Method Nominal Supply Voltage / Vsup (V) Power Supplies (V) Load Capacitance (CL) Package Style (Meter) Package Equivalence Code Propagation Delay (tpd) Maximum I (ol) Sub-Category Terminal Pitch Maximum Operating Temperature Output Characteristics Minimum Operating Temperature Terminal Finish Terminal Position Control Type Minimum fmax JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Width Qualification Output Polarity Minimum Supply Voltage (Vsup) Maximum Power Supply Current (ICC) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Family

NLV27WZ16DFT2G

Onsemi

BUFFER

MILITARY

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

NO

YES

2

CMOS

AEC-Q100

1

TR

2.3

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP6,.08

10.2 ns

32 Amp

.65 mm

125 Cel

-55 Cel

MATTE TIN

DUAL

R-PDSO-G6

1

5.5 V

1.1 mm

1.25 mm

Not Qualified

1.65 V

100 mA

e3

30

260

2 mm

LVC/LCX/Z

PSN74LV1T34QDCKRQ1

Texas Instruments

BUFFER

GULL WING

5

TSSOP

RECTANGULAR

PLASTIC/EPOXY

NO

YES

1

CMOS

AEC-Q100

1

1.8

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP5/6,.08

18.3 ns

8 Amp

.65 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G5

5.5 V

1.1 mm

1.25 mm

1.6 V

.01 mA

2 mm

LV/LV-A/LVX/H

SN74AUP1T34DRYR

Texas Instruments

BUFFER

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1

TR, 7 INCH

1.2

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.04,20

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-N6

3.6 V

.6 mm

1 mm

.9 V

1.45 mm

AUP/ULP/V

SN74AUP1T57DCKR

Texas Instruments

BUFFER

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1

2.5

30 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

45.65 ns

6 Amp

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G6

3.6 V

1.1 mm

1.25 mm

2.3 V

.0052 mA

2 mm

AUP/ULP/V

SN74LS07DG4

Texas Instruments

BUFFER

COMMERCIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

NO

YES

6

TTL

1

5

15 pF

SMALL OUTLINE

SOP14,.25

30 ns

40 Amp

Gates

1.27 mm

70 Cel

OPEN-COLLECTOR

0 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G14

1

5.25 V

1.75 mm

3.9 mm

Not Qualified

4.75 V

45 mA

e4

30

260

8.65 mm

LS

SN74LVC1G34DRYR

Texas Instruments

BUFFER

AUTOMOTIVE

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

NO

YES

1

CMOS

1

TR

3.3

3.3

50 pF

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.04,20

9.9 ns

32 Amp

Gates

.5 mm

125 Cel

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

DUAL

R-PDSO-N6

1

5.5 V

.6 mm

1 mm

Not Qualified

1.65 V

.001 mA

e4

NOT SPECIFIED

260

1.45 mm

LVC/LCX/Z

SN74LVC2G34DBV

Texas Instruments

BUFFER

AUTOMOTIVE

GULL WING

6

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

3.3

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSOP6,.11,37

9.6 ns

.95 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G6

5.5 V

1.45 mm

1.6 mm

1.65 V

2.9 mm

LVC/LCX/Z

TC74LCX07FT

Toshiba

BUFFER

INDUSTRIAL

GULL WING

14

TSSOP

RECTANGULAR

PLASTIC/EPOXY

NO

YES

6

CMOS

1

2.7

3.3

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP14,.25

4.4 ns

24 Amp

Gates

.65 mm

85 Cel

OPEN-DRAIN

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G14

3.6 V

1.2 mm

4.4 mm

Not Qualified

2 V

e4

5 mm

LVC/LCX/Z

74AHCT1G17GWH

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

5

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1

5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

11 ns

.65 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G5

5.5 V

1.1 mm

1.25 mm

4.5 V

2.05 mm

AHCT/VHCT/VT

74AXP1T34GMH

Nexperia

BUFFER

INDUSTRIAL

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1

1.2

SMALL OUTLINE, VERY THIN PROFILE

210 ns

.5 mm

85 Cel

3-STATE

-40 Cel

TIN

DUAL

R-PDSO-N6

1

2.75 V

.5 mm

1 mm

.7 V

e3

30

260

1.45 mm

AXP

74AXP1T34GSH

Nexperia

BUFFER

INDUSTRIAL

NO LEAD

6

VSON

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

1.2

SMALL OUTLINE, VERY THIN PROFILE

210 ns

.35 mm

85 Cel

3-STATE

-40 Cel

TIN

DUAL

S-PDSO-N6

1

2.75 V

.35 mm

1 mm

.7 V

e3

30

260

1 mm

AXP

74AXP2T3407GSX

Nexperia

BUFFER

INDUSTRIAL

NO LEAD

8

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

1.2

SMALL OUTLINE, VERY THIN PROFILE

225 ns

.35 mm

85 Cel

OPEN-DRAIN

-40 Cel

TIN

DUAL

R-PDSO-N8

1

2.75 V

.35 mm

1 mm

.7 V

e3

30

260

1.35 mm

AXP

74HC2G17GV,125

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

175 ns

.95 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G6

1

6 V

1.1 mm

1.5 mm

Not Qualified

2 V

e3

2.9 mm

HC/UH

74HC2G17GW

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

2

CMOS

1

TR

5

2/6

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP6,.08

175 ns

4 Amp

Gates

.65 mm

125 Cel

-40 Cel

Tin (Sn)

DUAL

R-PDSO-G6

1

6 V

1.1 mm

1.25 mm

Not Qualified

2 V

e3

30

260

2 mm

HC/UH

74LCX07FT

Toshiba

BUFFER

INDUSTRIAL

GULL WING

14

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

6

CMOS

1

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

22 ns

.65 mm

85 Cel

OPEN-DRAIN

-40 Cel

DUAL

R-PDSO-G14

5.5 V

1.2 mm

4.4 mm

1.65 V

30

260

5 mm

LVC/LCX/Z

74LCX07FT(AJ)

Toshiba

BUFFER

AUTOMOTIVE

GULL WING

14

TSSOP

RECTANGULAR

PLASTIC/EPOXY

NO

YES

6

CMOS

AEC-Q100

1

1.8

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP14,.25

24.5 ns

32 Amp

.65 mm

125 Cel

OPEN-DRAIN

-40 Cel

DUAL

R-PDSO-G14

5.5 V

1.2 mm

4.4 mm

1.65 V

5 mm

LVC/LCX/Z

74LVC2G17GV-Q100H

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

2

CMOS

AEC-Q100

1

1.8

SMALL OUTLINE, THIN PROFILE

TSOP6,.11,37

13.1 ns

.95 mm

125 Cel

-40 Cel

Tin (Sn)

DUAL

R-PDSO-G6

5.5 V

1.1 mm

1.5 mm

Not Qualified

1.65 V

.04 mA

e3

2.9 mm

LVC/LCX/Z

74LVC2G34FZ4-7

Diodes Incorporated

BUFFER

AUTOMOTIVE

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

NO

YES

2

CMOS

1

TR

3.3

3.3

50 pF

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.04,20

10.8 ns

24 Amp

Gate

.5 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-N6

1

5.5 V

.4 mm

1 mm

Not Qualified

1.65 V

e4

30

260

1.4 mm

LVC/LCX/Z

74LVC2G34GS,132

NXP Semiconductors

BUFFER

AUTOMOTIVE

NO LEAD

6

VSON

SQUARE

PLASTIC/EPOXY

NO

YES

2

CMOS

1

TR

1.8

3.3

50 pF

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.04,14

10.8 ns

24 Amp

Gates

.35 mm

125 Cel

-40 Cel

TIN

DUAL

S-PDSO-N6

1

5.5 V

.35 mm

1 mm

Not Qualified

1.65 V

e3

30

260

1 mm

LVC/LCX/Z

74LVC3G17DP

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

YES

3

CMOS

1

TR

1.8

3.3

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.16

13.1 ns

24 Amp

Gates

.65 mm

125 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

S-PDSO-G8

1

5.5 V

1.1 mm

3 mm

Not Qualified

1.65 V

e4

30

260

3 mm

LVC/LCX/Z

CD4050BMJ/883B

National Semiconductor

BUFFER

MILITARY

THROUGH-HOLE

16

DIP

RECTANGULAR

CERAMIC

NO

NO

CMOS

38535Q/M;38534H;883B

5/15

IN-LINE

DIP16,.3

Gates

2.54 mm

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

DUAL

R-XDIP-T16

Not Qualified

e0

CD4050BMW/883C

National Semiconductor

BUFFER

MILITARY

THROUGH-HOLE

16

DIP

RECTANGULAR

CERAMIC

NO

NO

CMOS

MIL-STD-883 Class C

5/15

IN-LINE

DIP16,.3

Gates

2.54 mm

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

DUAL

R-XDIP-T16

Not Qualified

e0

CD4050BPW

Texas Instruments

BUFFER

MILITARY

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

NO

YES

6

CMOS

1

TUBE

10

5/15

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

140 ns

18 Amp

Gates

.65 mm

125 Cel

-55 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G16

1

18 V

1.2 mm

4.4 mm

Not Qualified

3 V

.12 mA

e4

NOT SPECIFIED

260

5 mm

4000/14000/40000

CD4050BPWRE4

Texas Instruments

BUFFER

MILITARY

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

NO

YES

6

CMOS

1

TR

10

5/15

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

140 ns

Gates

.65 mm

125 Cel

-55 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G16

1

15 V

1.2 mm

4.4 mm

Not Qualified

5 V

e4

30

260

5 mm

4000/14000/40000

JM38510/00803BCA

Texas Instruments

BUFFER

MILITARY

THROUGH-HOLE

14

DIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

NO

6

TTL

MIL-M-38510 Class B

1

TUBE

5

50 pF

IN-LINE

30 ns

30 Amp

2.54 mm

125 Cel

OPEN-COLLECTOR

-55 Cel

TIN LEAD

DUAL

R-GDIP-T14

5.5 V

5.08 mm

6.67 mm

Not Qualified

4.5 V

41 mA

e0

19.56 mm

TTL/H/L

MC14050BDR2

Onsemi

BUFFER

MILITARY

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

NO

YES

6

CMOS

1

TR

5

5/15

50 pF

SMALL OUTLINE

SOP16,.25

140 ns

Gates

1.27 mm

125 Cel

-55 Cel

Tin/Lead (Sn85Pb15)

DUAL

R-PDSO-G16

18 V

1.75 mm

3.9 mm

Not Qualified

3 V

e0

30

235

9.9 mm

4000/14000/40000

MC14050BDTEL

Onsemi

BUFFER

MILITARY

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

NO

YES

6

CMOS

1

TR

5

5/15

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

140 ns

6 Amp

Gates

.65 mm

125 Cel

-55 Cel

TIN LEAD

DUAL

R-PDSO-G16

18 V

1.2 mm

4.4 mm

Not Qualified

3 V

e0

5 mm

4000/14000/40000

NC7NZ34L8X-L22185

Onsemi

BUFFER

INDUSTRIAL

NO LEAD

8

VQCCN

SQUARE

UNSPECIFIED

NO

YES

3

CMOS

1

TR

1.8

3.3

50 pF

CHIP CARRIER

LCC8,.06SQ,20

8.8 ns

24 Amp

Gates

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N8

5.5 V

.55 mm

1.6 mm

Not Qualified

1.65 V

e4

1.6 mm

LVC/LCX/Z

NL27WZ16DTT1G

Onsemi

BUFFER

MILITARY

GULL WING

6

LSSOP

RECTANGULAR

PLASTIC/EPOXY

NO

YES

2

CMOS

1

TR

2.3

50 pF

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSOP6,.11,37

10.2 ns

32 Amp

.95 mm

125 Cel

-55 Cel

MATTE TIN

DUAL

R-PDSO-G6

1

5.5 V

1.1 mm

1.5 mm

Not Qualified

1.65 V

100 mA

e3

30

260

3 mm

LVC/LCX/Z

NLV27WZ07DFT2G

Onsemi

BUFFER

MILITARY

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

NO

YES

2

CMOS

AEC-Q101

1

TR

2.3

3.3

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP6,.08

12 ns

24 Amp

Gates

.65 mm

125 Cel

OPEN-DRAIN

-55 Cel

MATTE TIN

DUAL

R-PDSO-G6

1

5.5 V

1.1 mm

1.25 mm

Not Qualified

1.65 V

.1 mA

e3

30

260

2 mm

27WZ

SN74AUP1G17DCKT

Texas Instruments

BUFFER

INDUSTRIAL

GULL WING

5

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

1

TR

1.2

1.2/3.3

30 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP5/6,.08

19.8 ns

4 Amp

Gates

.65 mm

85 Cel

3-STATE

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G5

1

3.6 V

1.1 mm

1.25 mm

Not Qualified

.8 V

.0009 mA

e4

NOT SPECIFIED

260

2 mm

AUP/ULP/V

SN74AUP1G17DSFR

Texas Instruments

BUFFER

INDUSTRIAL

NO LEAD

6

VSON

SQUARE

PLASTIC/EPOXY

YES

YES

1

CMOS

1

TR

1.1

1.2/3.3

30 pF

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.04,14

19.8 ns

4 Amp

Gates

.35 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

DUAL

S-PDSO-N6

1

3.6 V

.4 mm

1 mm

Not Qualified

.8 V

.0009 mA

e4

NOT SPECIFIED

260

1 mm

AUP/ULP/V

SN74AUP1G34DBVR

Texas Instruments

BUFFER

INDUSTRIAL

GULL WING

5

LSSOP

RECTANGULAR

PLASTIC/EPOXY

NO

YES

1

CMOS

1

TR

1.2

1.2/3.3

30 pF

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSOP5/6,.11,37

18.9 ns

4 Amp

Gates

.95 mm

85 Cel

3-STATE

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G5

1

3.6 V

1.45 mm

1.6 mm

Not Qualified

.8 V

.0009 mA

e4

NOT SPECIFIED

260

2.9 mm

AUP/ULP/V

SN74AUP1T34QDCKRQ1

Texas Instruments

BUFFER

GULL WING

5

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

1

TR

1.2

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP5/6,.08

.65 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G5

3.6 V

1.1 mm

1.25 mm

.9 V

2 mm

AUP/ULP/V

SN74LV07ADG4

Texas Instruments

BUFFER

AUTOMOTIVE

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

NO

YES

6

CMOS

1

TUBE

2.5

3.3

50 pF

SMALL OUTLINE

TSSOP14,.25,16

18 ns

16 Amp

Gates

1.27 mm

125 Cel

OPEN-DRAIN

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G14

1

5.5 V

1.75 mm

3.9 mm

Not Qualified

2 V

.02 mA

e4

NOT SPECIFIED

260

8.65 mm

LV/LV-A/LVX/H

SN74LV07APWRE4

Texas Instruments

BUFFER

AUTOMOTIVE

GULL WING

14

TSSOP

RECTANGULAR

PLASTIC/EPOXY

NO

YES

6

CMOS

1

TR

2.5

3.3

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP14,.25

18 ns

8 Amp

Gates

.65 mm

125 Cel

OPEN-DRAIN

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G14

1

5.5 V

1.2 mm

4.4 mm

Not Qualified

2 V

e4

30

260

5 mm

LV/LV-A/LVX/H

SN74LVC07ANSR

Texas Instruments

BUFFER

AUTOMOTIVE

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

NO

YES

6

CMOS

1

TR

1.8

3.3

50 pF

SMALL OUTLINE

SOP14,.3

5.6 ns

24 Amp

Gates

1.27 mm

125 Cel

OPEN-DRAIN

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G14

1

5.5 V

2 mm

5.3 mm

Not Qualified

1.65 V

.04 mA

e4

NOT SPECIFIED

260

10.2 mm

LVC/LCX/Z

74AHC1G07GW,125

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

5

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1

5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

12.5 ns

.65 mm

125 Cel

OPEN-DRAIN

-40 Cel

Tin (Sn)

DUAL

R-PDSO-G5

1

5.5 V

1.1 mm

1.25 mm

Not Qualified

2 V

e3

30

260

2.05 mm

AHC

74AUP1G07GX,125

NXP Semiconductors

BUFFER

AUTOMOTIVE

NO LEAD

5

SON

SQUARE

PLASTIC/EPOXY

NO

YES

1

CMOS

1

TR

1.1

1.2/3.3

30 pF

SMALL OUTLINE

LCC5(UNSPEC)

20.7 ns

1.7 Amp

Gates

.48 mm

125 Cel

OPEN-DRAIN

-40 Cel

TIN

DUAL

S-PDSO-N5

1

3.6 V

.35 mm

.8 mm

Not Qualified

.8 V

e3

30

260

.8 mm

AUP/ULP/V

74AUP1G17FW5-7

Diodes Incorporated

BUFFER

AUTOMOTIVE

NO LEAD

6

VSON

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

1.2

SMALL OUTLINE, VERY THIN PROFILE

20.1 ns

.35 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-N6

3.6 V

.5 mm

1 mm

.8 V

e4

260

1 mm

AUP/ULP/V

74AUP1T34GM,115

NXP Semiconductors

BUFFER

AUTOMOTIVE

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

NO

YES

2

CMOS

1

TR

1.2

1.2/3.3

30 pF

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.04,20

33.5 ns

1.7 Amp

Gates

.5 mm

125 Cel

-40 Cel

Tin (Sn)

DUAL

R-PDSO-N6

1

3.6 V

.5 mm

1 mm

Not Qualified

1.1 V

e3

30

260

1.45 mm

AUP/ULP/V

74HC3G07DC,125

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

8

VSSOP

RECTANGULAR

PLASTIC/EPOXY

NO

YES

3

CMOS

1

TR

5

2/6

50 pF

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

TSSOP8,.12,20

125 ns

4 Amp

Gates

.5 mm

125 Cel

OPEN-DRAIN

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G8

1

6 V

1 mm

2 mm

Not Qualified

2 V

e4

30

260

2.3 mm

HC/UH

74HC3G07DC-Q100,125

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

8

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3

CMOS

AEC-Q100

1

5

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

125 ns

.5 mm

125 Cel

OPEN-DRAIN

-40 Cel

DUAL

R-PDSO-G8

6 V

1 mm

2 mm

2 V

2.3 mm

HC/UH

74HC4050N

NXP Semiconductors

BUFFER

AUTOMOTIVE

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

NO

6

CMOS

1

5

2/6

50 pF

IN-LINE

DIP16,.3

130 ns

4 Amp

Gates

2.54 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDIP-T16

6 V

4.7 mm

7.62 mm

Not Qualified

2 V

CMOS-TTL LEVEL TRANSLATOR

e4

21.6 mm

HC/UH

74LCX07MX

Onsemi

BUFFER

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

NO

YES

6

CMOS

1

TR

2.5

3.3

50 pF

SMALL OUTLINE

SOP14,.25

4.4 ns

24 Amp

Gates

1.27 mm

85 Cel

OPEN-DRAIN

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G14

1

5.5 V

1.753 mm

3.9 mm

Not Qualified

2 V

e4

30

260

8.6235 mm

LVC/LCX/Z

74LVC07APW-Q100J

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

14

TSSOP

RECTANGULAR

PLASTIC/EPOXY

NO

YES

6

CMOS

AEC-Q100

1

TR

3.3

3.3

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP14,.25

6.5 ns

24 Amp

Gates

.65 mm

125 Cel

OPEN-DRAIN

-40 Cel

DUAL

R-PDSO-G14

5.5 V

1.1 mm

4.4 mm

Not Qualified

1.65 V

5 mm

LVC/LCX/Z

74LVC2G07GW-Q100

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

AEC-Q100

1

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8.4 ns

.65 mm

125 Cel

OPEN-DRAIN

-40 Cel

DUAL

R-PDSO-G6

5.5 V

1.1 mm

1.25 mm

1.65 V

2 mm

LVC/LCX/Z

74LX1G07CTR

STMicroelectronics

BUFFER

INDUSTRIAL

GULL WING

5

TSSOP

RECTANGULAR

PLASTIC/EPOXY

NO

YES

1

CMOS

1

TR

1.8

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP5/6,.08

8.3 ns

24 Amp

Gates

.65 mm

85 Cel

OPEN-DRAIN

-40 Cel

MATTE TIN

DUAL

R-PDSO-G5

5.5 V

1.1 mm

1.25 mm

Not Qualified

1.65 V

DUMMY VAL

e3

2 mm

TTL/H/L

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.