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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	Screening Level	No. of Inputs	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Minimum Supply Voltage (Vsup)	Maximum Power Supply Current (ICC)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
CD4050BDE4	Texas Instruments	BUFFER	MILITARY	GULL WING	16	SOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1	TUBE	10	5/15	50 pF	SMALL OUTLINE	SOP16,.25	140 ns	18 Amp	Gates	1.27 mm	125 Cel		-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16	1	15 V	1.75 mm	3.9 mm	Not Qualified	5 V	.12 mA		e4	NOT SPECIFIED	260	9.9 mm	4000/14000/40000
CD4050BF3AS2283	Texas Instruments	BUFFER	MILITARY	THROUGH-HOLE	16	DIP	RECTANGULAR		CERAMIC, GLASS-SEALED		NO	6	CMOS		1		10			IN-LINE		140 ns			2.54 mm	125 Cel		-55 Cel	TIN LEAD	DUAL	R-GDIP-T16		15 V	5.08 mm	7.62 mm	Not Qualified	5 V			e0				4000/14000/40000
CD4050BF3AS2534	Texas Instruments	BUFFER	MILITARY	THROUGH-HOLE	16	DIP	RECTANGULAR		CERAMIC, GLASS-SEALED		NO	6	CMOS		1		10			IN-LINE		140 ns			2.54 mm	125 Cel		-55 Cel	TIN LEAD	DUAL	R-GDIP-T16		15 V	5.08 mm	7.62 mm	Not Qualified	5 V			e0				4000/14000/40000
CD4050BPWRG4	Texas Instruments	BUFFER	MILITARY	GULL WING	16	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1	TR	10	5/15	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	140 ns		Gates	.65 mm	125 Cel		-55 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	1	15 V	1.2 mm	4.4 mm	Not Qualified	5 V			e4	30	260	5 mm	4000/14000/40000
MC14050BDTG	Onsemi	BUFFER	MILITARY	GULL WING	16	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1	RAIL	5	5/15	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	140 ns		Gates	.65 mm	125 Cel		-55 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	1	18 V	1.2 mm	4.4 mm	Not Qualified	3 V			e4	30	260	5 mm	4000/14000/40000
MC74VHC1G50DTT1G	Onsemi	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	3.3	2/5.5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSOP5/6,.11,37	14.5 ns	8 Amp	Gates	.95 mm	125 Cel		-55 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G5	1	5.5 V	1.1 mm	1.5 mm	Not Qualified	2 V	.04 mA		e3	40	260	3 mm	AHC/VHC
MC74VHCT50ADTR2	Onsemi	BUFFER	MILITARY	GULL WING	14	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1	TR	3.3	5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	13 ns	8 Amp	Gates	.65 mm	125 Cel		-55 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1	5.5 V	1.2 mm	4.4 mm	Not Qualified	2 V			e4		260	5 mm	AHCT/VHCT
NC7SV17FHX	Onsemi	BUFFER	INDUSTRIAL	NO LEAD	6	VSON	SQUARE		PLASTIC/EPOXY	YES	YES	1	CMOS		1	TR	1.1	1.2/3.3	15 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	14.9 ns	2 Amp	Gates	.35 mm	85 Cel		-40 Cel	NICKEL PALLADIUM	DUAL	S-PDSO-N6	1	3.6 V	.55 mm	1 mm	Not Qualified	.9 V			e4	30	260	1 mm	AUP/ULP/V
NC7SV17L6X	Onsemi	BUFFER	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR		PLASTIC/EPOXY	YES	YES	1	CMOS		1	TR	1.1	1.2/3.3	15 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	14.9 ns	2 Amp	Gates	.5 mm	85 Cel		-40 Cel	GOLD NICKEL	DUAL	R-PDSO-N6	1	3.6 V	.55 mm	1 mm	Not Qualified	.9 V			e4	30	260	1.45 mm	AUP/ULP/V
NL27WZ17DFT2	Onsemi	BUFFER	MILITARY	GULL WING	6	TSSOP	RECTANGULAR		PLASTIC/EPOXY	YES	YES	2	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	15.6 ns	24 Amp	Gates	.65 mm	125 Cel		-55 Cel	TIN LEAD	DUAL	R-PDSO-G6		5.5 V	1.1 mm	1.25 mm	Not Qualified	1.65 V			e0		235	2 mm	27WZ
SN74ALS1035N	Texas Instruments	BUFFER	COMMERCIAL	THROUGH-HOLE	14	DIP	RECTANGULAR		PLASTIC/EPOXY	NO	NO	6	TTL		1	TUBE	5	5	50 pF	IN-LINE	DIP14,.3	30 ns	24 Amp	Gates	2.54 mm	70 Cel	OPEN-COLLECTOR	0 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDIP-T14		5.5 V	5.08 mm	7.62 mm	Not Qualified	4.5 V	14 mA	IOH = 0.1MA @ VOH = 5.5V; IOL = 12MA @ VOL = 0.4V	e4	NOT SPECIFIED	NOT SPECIFIED	19.305 mm	ALS
SN74AUC2G34DCKRE4	Texas Instruments	BUFFER	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	2	CMOS		1	TR	1.2	1.2/2.5	15 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	3.4 ns	9 Amp	Gates	.65 mm	85 Cel	3-STATE	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G6	1	2.7 V	1.1 mm	1.25 mm	Not Qualified	.8 V	.01 mA		e4	NOT SPECIFIED	260	2 mm	AUC
SN74AUP1G17DBVR	Texas Instruments	BUFFER	INDUSTRIAL	GULL WING	5	LSSOP	RECTANGULAR		PLASTIC/EPOXY	YES	YES	1	CMOS		1	TR	1.2	1.2/3.3	30 pF	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSOP5/6,.11,37	19.8 ns	4 Amp	Gates	.95 mm	85 Cel	3-STATE	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G5	1	3.6 V	1.45 mm	1.6 mm	Not Qualified	.8 V	.0009 mA		e4	NOT SPECIFIED	260	2.9 mm	AUP/ULP/V
SN74AUP1G17YFPR	Texas Instruments	BUFFER	INDUSTRIAL	BALL	5	VFBGA	RECTANGULAR		PLASTIC/EPOXY	YES	YES	1	CMOS		1	TR	1.2	1.2/3.3	30 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA4,2X2,16	19.8 ns	4 Amp	Gates	.5 mm	85 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	R-PBGA-B5	1	3.6 V	.5 mm	.9 mm	Not Qualified	.8 V	.0009 mA		e1	NOT SPECIFIED	260	1.4 mm	AUP/ULP/V
SN74LV07ANS	Texas Instruments	BUFFER	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1	TUBE	2.5		50 pF	SMALL OUTLINE		18 ns	16 Amp		1.27 mm	85 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G14	1	5.5 V	2 mm	5.3 mm	Not Qualified	2 V	.02 mA		e4	NOT SPECIFIED	260	10.2 mm	LV/LV-A/LVX/H
SN74LV07APWTG4	Texas Instruments	BUFFER	AUTOMOTIVE	GULL WING	14	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1	TR	2.5	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	18 ns	16 Amp	Gates	.65 mm	125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1	5.5 V	1.2 mm	4.4 mm	Not Qualified	2 V	.02 mA		e4	30	260	5 mm	LV/LV-A/LVX/H
SN74LVC1G34DSFR	Texas Instruments	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE		PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	3.3	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	9.9 ns	32 Amp	Gates	.35 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	DUAL	S-PDSO-N6	1	5.5 V	.4 mm	1 mm	Not Qualified	1.65 V	.001 mA		e4	NOT SPECIFIED	260	1 mm	LVC/LCX/Z
SN74LVC1G34YZVR	Texas Instruments	BUFFER	INDUSTRIAL	BALL	4	VFBGA	SQUARE		UNSPECIFIED	NO	YES	1	CMOS		1	TR	3.3	3.3	50 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA4,2X2,20	9.9 ns	32 Amp	Gates	.5 mm	85 Cel	3-STATE	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	S-XBGA-B4	1	5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V	.001 mA		e1	NOT SPECIFIED	260	.9 mm	LVC/LCX/Z
SN74LVC3G07DCUTE4	Texas Instruments	BUFFER	INDUSTRIAL	GULL WING	8	VSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	TSSOP8,.12,20	7.8 ns	24 Amp	Gates	.5 mm	85 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8	1	5.5 V	.9 mm	2 mm	Not Qualified	1.65 V			e4	30	260	2.3 mm	LVC/LCX/Z
SN74LVC3G34DCTRE4	Texas Instruments	BUFFER	INDUSTRIAL	GULL WING	8	LSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	3.3	3.3	50 pF	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP8,.16	7.9 ns	24 Amp	Gates	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8	1	5.5 V	1.3 mm	2.8 mm	Not Qualified	1.65 V			e4	30	260	2.95 mm	LVC/LCX/Z
TC7SZ07FU,LJ(CB	Toshiba	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	1	CMOS		1		1.8		50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5,.08	12 ns	32 Amp		.65 mm	125 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-G5		5.5 V	1.1 mm	1.25 mm		1.65 V						2 mm	LVC/LCX/Z
TC7SZ17FU(T5L,JF,T	Toshiba	BUFFER	INDUSTRIAL	GULL WING	5	TSSOP	RECTANGULAR		PLASTIC/EPOXY		YES	1	CMOS		1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		15.6 ns			.65 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G5		5.5 V	1.1 mm	1.25 mm		1.65 V						2 mm	LVC/LCX/Z
74LVC3G34DC-Q100,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR		PLASTIC/EPOXY		YES	3	CMOS	AEC-Q100	1		3.3			SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH		10.8 ns			.5 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G8		5.5 V	1 mm	2 mm		1.65 V						2.3 mm	LVC/LCX/Z
SN74AUP1G07YZPR	Texas Instruments	BUFFER	INDUSTRIAL	BALL	5	VFBGA	RECTANGULAR		PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	1.1	1.2/3.3	30 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA5,2X3,20	14.7 ns	4 Amp	Gates	.5 mm	85 Cel	OPEN-DRAIN	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	R-PBGA-B5	1	3.6 V	.5 mm	.9 mm	Not Qualified	.8 V	.0009 mA		e1	NOT SPECIFIED	260	1.4 mm	AUP/ULP/V
74AXP1T34GWH	Nexperia	BUFFER	INDUSTRIAL	GULL WING	5	TSSOP	RECTANGULAR		PLASTIC/EPOXY		YES	1	CMOS		1		1.2			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		210 ns			.65 mm	85 Cel	3-STATE	-40 Cel	TIN	DUAL	R-PDSO-G5	1	2.75 V	1.1 mm	1.25 mm		.7 V			e3	30	260	2.05 mm	AXP
74AUP2G07GW,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	2	CMOS		1	TR	1.1	1.2/3.3	30 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	20.7 ns	1.7 Amp	Gates	.65 mm	125 Cel	OPEN-DRAIN	-40 Cel	Tin (Sn)	DUAL	R-PDSO-G6	1	3.6 V	1.1 mm	1.25 mm	Not Qualified	.8 V			e3	30	260	2 mm	AUP/ULP/V
74HC9115D,118	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	20	SOP	RECTANGULAR		PLASTIC/EPOXY	YES	YES	9	CMOS		1	TR	5	2/6	50 pF	SMALL OUTLINE	SOP20,.4	33 ns	4 Amp	Gates	1.27 mm	125 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20	1	6 V	2.65 mm	7.5 mm	Not Qualified	2 V			e4	30	260	12.8 mm	HC/UH
74AXP2T3407DCH	Nexperia	BUFFER	INDUSTRIAL	GULL WING	8	VSSOP	RECTANGULAR		PLASTIC/EPOXY		YES	2	CMOS		1		1.2			SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH		225 ns			.5 mm	85 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8	1	2.75 V	1 mm	2 mm		.7 V		SEATED HGT-NOM	e4	30	260	2.3 mm	AXP
74HC2G34GV,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR		PLASTIC/EPOXY		YES	2	CMOS		1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		125 ns			.95 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G6	1	6 V	1.1 mm	1.5 mm	Not Qualified	2 V			e3			2.8 mm	HC/UH
74LVC1G17QW5-7	Diodes Incorporated	BUFFER	AUTOMOTIVE	GULL WING	5	LSSOP	RECTANGULAR		PLASTIC/EPOXY	YES	YES	1	CMOS	AEC-Q100	1	TR, 7 INCH	1.8		50 pF	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSOP5/6,.11,37	14 ns	32 Amp		.95 mm	125 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-G5		5.5 V	1.4 mm	1.6 mm		1.65 V	.004 mA		e3		260	3 mm	LVC/LCX/Z
CD4050BCM	National Semiconductor	BUFFER	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1		5	5/15	50 pF	SMALL OUTLINE	SOP16,.25	110 ns		Gates	1.27 mm	85 Cel		-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G16		15 V	1.75 mm	3.9 mm	Not Qualified	3 V		IOH = 0.72MA @ VOH = 4.6V; IOL = 3.2MA @ VOL = 0.4V; WITH EXTENDED INPUT VOLTAGE	e0			9.9 mm	4000/14000/40000
NL17SZ16DFT2G	Onsemi	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	12 ns	24 Amp	Gates	.65 mm	125 Cel		-55 Cel	MATTE TIN	DUAL	R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm	Not Qualified	1.65 V	.01 mA		e3	30	260	2 mm	17SZ
TC74VHCV17FK(EL,K)	Toshiba	BUFFER
HEF4050BP	NXP Semiconductors	BUFFER	INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR		PLASTIC/EPOXY	NO	NO	6	CMOS		1		5	5/15	50 pF	IN-LINE	DIP16,.3	110 ns	.36 Amp	Gates	2.54 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T16		15 V	4.2 mm	7.62 mm	Not Qualified	3 V		CMOS-TTL LEVEL TRANSLATOR	e4			19.025 mm	4000/14000/40000
HEF4050BP,652	NXP Semiconductors	BUFFER	INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR		PLASTIC/EPOXY	NO	NO	6	CMOS		1	BULK	5	5/15	50 pF	IN-LINE	DIP16,.3	70 ns		Gates	2.54 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T16		15 V	4.7 mm	7.62 mm	Not Qualified	3 V		CMOS-TTL LEVEL TRANSLATOR	e4			21.6 mm	4000/14000/40000
74AUP1G17GM,132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR		PLASTIC/EPOXY	YES	YES	1	CMOS		1	TR	1.1	1.2/3.3	30 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	20.1 ns	1.7 Amp	Gates	.5 mm	125 Cel		-40 Cel	Tin (Sn)	DUAL	R-PDSO-N6	1	3.6 V	.5 mm	1 mm	Not Qualified	.8 V			e3	30	260	1.45 mm	AUP/ULP/V
74AUP1T50GWH	Nexperia	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR		PLASTIC/EPOXY	YES	YES	1	CMOS		1	TR, 7 INCH	3		30 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	11.9 ns			.65 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G5	1	3.6 V	1.1 mm	1.25 mm		2.3 V	.0035 mA		e3	30	260	2.05 mm	AUP/ULP/V
74LVC2G07FW4-7	Diodes Incorporated	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE		PLASTIC/EPOXY	NO	YES	2	CMOS		1	TR	3.3	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	8.4 ns	24 Amp	Gate	.35 mm	125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N6	1	5.5 V	.4 mm	1 mm	Not Qualified	1.65 V			e4	30	260	1 mm	LVC/LCX/Z
74VHC9152FT	Toshiba	BUFFER	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR		PLASTIC/EPOXY		YES	9	CMOS		1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		17.6 ns			.65 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G20		5.5 V	1.2 mm	4.4 mm		2 V				NOT SPECIFIED	NOT SPECIFIED	6.5 mm	AHC/VHC/H/U/V
TC4050BF(EL,N,F)	Toshiba	BUFFER	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR		PLASTIC/EPOXY		YES	6	CMOS		1		5			SMALL OUTLINE		130 ns			1.27 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G16		18 V	1.9 mm	5.3 mm		3 V						10.3 mm	4000/14000/40000
5962R9663701VXC	Defense Logistics Agency	BUFFER	MILITARY	FLAT	16	DFP	RECTANGULAR	100k Rad(Si)	CERAMIC, METAL-SEALED COFIRED		YES	6	CMOS	MIL-PRF-38535 Class V	1		5			FLATPACK		189 ns				125 Cel		-55 Cel	GOLD	DUAL	R-CDFP-F16		18 V			Not Qualified	3 V			e4				4000/14000/40000
74AUP1G17GW,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR		PLASTIC/EPOXY	YES	YES	1	CMOS		1	TR	1.1	1.2/3.3	30 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	20.1 ns	1.7 Amp	Gates	.65 mm	125 Cel		-40 Cel	Tin (Sn)	DUAL	R-PDSO-G5	1	3.6 V	1.1 mm	1.25 mm	Not Qualified	.8 V			e3	30	260	2.05 mm	AUP/ULP/V
74AUP2G07GS,132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE		PLASTIC/EPOXY	NO	YES	2	CMOS		1	TR	1.1	1.2/3.3	30 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	20.7 ns	1.7 Amp	Gates	.35 mm	125 Cel	OPEN-DRAIN	-40 Cel	TIN	DUAL	S-PDSO-N6	1	3.6 V	.35 mm	1 mm	Not Qualified	.8 V			e3	30	260	1 mm	AUP/ULP/V
74HC4050D(BJ)	Toshiba	BUFFER		GULL WING	16	SOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1		4.5		150 pF	SMALL OUTLINE	SOP16,.24	175 ns	7.8 Amp		1.27 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G16		6 V	1.75 mm	3.9 mm		2 V						10.2 mm	HC/UH
74LVC1G07GM,115	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR		PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	1.8	3.3		SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	8.4 ns	24 Amp	Gates	.5 mm	125 Cel	OPEN-DRAIN	-40 Cel	Tin (Sn)	DUAL	R-PDSO-N6	1	5.5 V	.5 mm	1 mm	Not Qualified	1.65 V			e3	30	260	1.45 mm	LVC/LCX/Z
TC4050BP(F)	Toshiba	BUFFER	INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR		PLASTIC/EPOXY	NO	NO	6	CMOS		1			5/15	50 pF	IN-LINE	DIP16,.3	130 ns		Gates	2.54 mm	85 Cel		-40 Cel		DUAL	R-PDIP-T16		18 V			Not Qualified	3 V
TC74HC4050AFT(EL)	Toshiba	BUFFER	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1	TR	5	2/6	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	175 ns	6 Amp	Gates	.635 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G16		6 V			Not Qualified	2 V
5407DM	Fairchild Semiconductor	BUFFER	MILITARY	THROUGH-HOLE	14	DIP	RECTANGULAR		CERAMIC	NO	NO	6	TTL		1		5	5		IN-LINE	DIP14,.3		16 Amp	Gates	2.54 mm	125 Cel	OPEN-COLLECTOR	-55 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T14					Not Qualified		41 mA		e0				TTL/H/L

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.