Part | RoHS | Manufacturer | Logic IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Schmitt Trigger | Surface Mount | No. of Functions | Technology | Screening Level | No. of Inputs | No. of Bits | Translation | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Load Capacitance (CL) | Package Style (Meter) | Package Equivalence Code | Propagation Delay (tpd) | Maximum I (ol) | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Output Characteristics | Minimum Operating Temperature | Terminal Finish | Terminal Position | Control Type | Minimum fmax | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Output Polarity | Minimum Supply Voltage (Vsup) | Maximum Power Supply Current (ICC) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Family |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
BUFFER |
INDUSTRIAL |
GULL WING |
6 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
1 |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP6,.08 |
8.6 ns |
.65 mm |
85 Cel |
OPEN-DRAIN |
-40 Cel |
DUAL |
R-PDSO-G6 |
5.5 V |
1.1 mm |
1.25 mm |
1.65 V |
NOT SPECIFIED |
NOT SPECIFIED |
2 mm |
LVC/LCX/Z |
||||||||||||||||||||
|
NXP Semiconductors |
BUFFER |
AUTOMOTIVE |
GULL WING |
6 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
2 |
CMOS |
1 |
TR |
5 |
5 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP6,.08 |
175 ns |
4 Amp |
Gates |
.65 mm |
125 Cel |
-40 Cel |
Tin (Sn) |
DUAL |
R-PDSO-G6 |
1 |
6 V |
1.1 mm |
1.25 mm |
Not Qualified |
2 V |
e3 |
30 |
260 |
2 mm |
HCT |
|||||||||||
|
NXP Semiconductors |
BUFFER |
AUTOMOTIVE |
GULL WING |
5 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
1 |
CMOS |
1 |
TR |
2.7 |
3.3 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP5/6,.08 |
11 ns |
24 Amp |
Gates |
.65 mm |
125 Cel |
-40 Cel |
Tin (Sn) |
DUAL |
R-PDSO-G5 |
1 |
5.5 V |
1.1 mm |
1.25 mm |
Not Qualified |
1.65 V |
e3 |
30 |
260 |
2.05 mm |
LVC/LCX/Z |
|||||||||||
|
Onsemi |
BUFFER |
INDUSTRIAL |
NO LEAD |
6 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
2 |
CMOS |
1 |
TR |
1.8 |
3.3 |
50 pF |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC6,.04,14 |
10.6 ns |
32 Amp |
Gates |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-N6 |
5.5 V |
.55 mm |
1 mm |
Not Qualified |
1.65 V |
100 mA |
e4 |
1.45 mm |
LVC/LCX/Z |
|||||||||||||
|
Onsemi |
BUFFER |
INDUSTRIAL |
GULL WING |
8 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
3 |
CMOS |
1 |
2.3 |
3.3 |
50 pF |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
TSSOP8,.12,20 |
8.8 ns |
24 Amp |
Gates |
.5 mm |
85 Cel |
-40 Cel |
NICKEL SILVER GOLD PALLADIUM |
DUAL |
R-PDSO-G8 |
1 |
5.5 V |
.9 mm |
2 mm |
Not Qualified |
1.65 V |
30 |
260 |
2.3 mm |
37WZ |
|||||||||||||
|
Texas Instruments |
BUFFER |
AUTOMOTIVE |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
6 |
CMOS |
1 |
TUBE |
1.8 |
3.3 |
50 pF |
SMALL OUTLINE |
SOP14,.25 |
5.6 ns |
24 Amp |
Gates |
1.27 mm |
125 Cel |
OPEN-DRAIN |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G14 |
1 |
5.5 V |
1.75 mm |
3.9 mm |
Not Qualified |
1.65 V |
.04 mA |
e4 |
NOT SPECIFIED |
260 |
8.65 mm |
LVC/LCX/Z |
|||||||||
|
Texas Instruments |
BUFFER |
AUTOMOTIVE |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
6 |
CMOS |
1 |
TR |
1.8 |
3.3 |
50 pF |
SMALL OUTLINE |
SOP14,.25 |
5.6 ns |
24 Amp |
Gates |
1.27 mm |
125 Cel |
OPEN-DRAIN |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G14 |
1 |
5.5 V |
1.75 mm |
3.9 mm |
Not Qualified |
1.65 V |
e4 |
30 |
260 |
8.65 mm |
LVC/LCX/Z |
||||||||||
|
Texas Instruments |
BUFFER |
COMMERCIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
6 |
TTL |
1 |
TUBE |
5 |
5 |
50 pF |
SMALL OUTLINE |
SOP14,.25 |
30 ns |
40 Amp |
Gates |
1.27 mm |
70 Cel |
OPEN-COLLECTOR |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G14 |
1 |
5.25 V |
1.75 mm |
3.91 mm |
Not Qualified |
4.75 V |
41 mA |
e4 |
30 |
260 |
8.65 mm |
TTL/H/L |
|||||||||
|
Texas Instruments |
BUFFER |
AUTOMOTIVE |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
6 |
CMOS |
1 |
TUBE |
1.8 |
3.3 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP14,.25 |
5.6 ns |
24 Amp |
Gates |
.65 mm |
125 Cel |
OPEN-DRAIN |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G14 |
1 |
5.5 V |
1.2 mm |
4.4 mm |
Not Qualified |
1.65 V |
.04 mA |
e4 |
NOT SPECIFIED |
260 |
5 mm |
LVC/LCX/Z |
|||||||||
|
NXP Semiconductors |
BUFFER |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
6 |
CMOS |
1 |
TR |
1.8 |
3.3 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14,.1X.12,20 |
4.5 ns |
24 Amp |
Gates |
.5 mm |
125 Cel |
OPEN-DRAIN |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
R-PQCC-N14 |
1 |
5.5 V |
1 mm |
2.5 mm |
Not Qualified |
1.65 V |
e4 |
30 |
260 |
3 mm |
LVC/LCX/Z |
||||||||||
|
Onsemi |
BUFFER |
MILITARY |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
6 |
CMOS |
1 |
TR |
5 |
5/15 |
50 pF |
SMALL OUTLINE |
SOP16,.25 |
140 ns |
Gates |
1.27 mm |
125 Cel |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
1 |
18 V |
1.75 mm |
3.9 mm |
Not Qualified |
3 V |
e3 |
30 |
260 |
9.9 mm |
4000/14000/40000 |
||||||||||||
|
Texas Instruments |
BUFFER |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
6 |
TTL |
1 |
TUBE |
5 |
5 |
50 pF |
IN-LINE |
DIP14,.3 |
30 ns |
40 Amp |
Gates |
2.54 mm |
70 Cel |
OPEN-COLLECTOR |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T14 |
1 |
5.25 V |
5.08 mm |
6.35 mm |
Not Qualified |
4.75 V |
41 mA |
IOL = 40MA @ VOL = 0.7V; IOH = 0.25MA @ VOH = 30V |
e4 |
19.3 mm |
TTL/H/L |
||||||||||
|
Texas Instruments |
BUFFER |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
6 |
TTL |
1 |
TUBE |
5 |
15 pF |
IN-LINE |
DIP14,.3 |
30 ns |
40 Amp |
Gates |
2.54 mm |
70 Cel |
OPEN-COLLECTOR |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T14 |
5.25 V |
5.08 mm |
7.62 mm |
Not Qualified |
4.75 V |
45 mA |
e4 |
19.305 mm |
LS |
|||||||||||||
|
NXP Semiconductors |
BUFFER |
AUTOMOTIVE |
GULL WING |
5 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
1 |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
14 ns |
.65 mm |
125 Cel |
-40 Cel |
PURE TIN |
DUAL |
R-PDSO-G5 |
1 |
5.5 V |
1.1 mm |
1.25 mm |
1.65 V |
2.05 mm |
LVC/LCX/Z |
|||||||||||||||||||||
|
Texas Instruments |
BUFFER |
MILITARY |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
6 |
CMOS |
1 |
TR |
4.5 |
2/6 |
50 pF |
SMALL OUTLINE |
SOP16,.25 |
130 ns |
4 Amp |
Gates |
1.27 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
6 V |
1.75 mm |
3.9 mm |
Not Qualified |
2 V |
CMOS-TTL LEVEL TRANSLATOR |
e4 |
30 |
260 |
9.9 mm |
HC/UH |
||||||||||
|
Onsemi |
BUFFER |
NO LEAD |
6 |
VSON |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
2 |
CMOS |
1 |
TR |
1.8 |
50 pF |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC6,.04,14 |
10.6 ns |
32 Amp |
.35 mm |
125 Cel |
-40 Cel |
DUAL |
S-PDSO-N6 |
5.5 V |
.55 mm |
1 mm |
1.65 V |
100 mA |
1 mm |
LVC/LCX/Z |
|||||||||||||||||||
|
Onsemi |
BUFFER |
NO LEAD |
6 |
VSOF |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
2 |
CMOS |
1 |
TR |
1.8 |
50 pF |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC6,.04,20 |
15.8 ns |
32 Amp |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-N6 |
5.5 V |
.55 mm |
1 mm |
1.65 V |
100 mA |
1.45 mm |
LVC/LCX/Z |
|||||||||||||||||||
|
Nexperia |
BUFFER |
AUTOMOTIVE |
GULL WING |
6 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
AEC-Q100 |
1 |
1.8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
10.8 ns |
.65 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G6 |
1 |
5.5 V |
1.1 mm |
1.25 mm |
1.65 V |
e3 |
30 |
260 |
2 mm |
LVC/LCX/Z |
||||||||||||||||||
|
NXP Semiconductors |
BUFFER |
AUTOMOTIVE |
GULL WING |
6 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
1 |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
175 ns |
.65 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G6 |
1 |
6 V |
1.1 mm |
1.25 mm |
Not Qualified |
2 V |
e3 |
2 mm |
HC/UH |
||||||||||||||||||||
|
Texas Instruments |
BUFFER |
AUTOMOTIVE |
GULL WING |
5 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
1.8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
20 ns |
12 Amp |
.65 mm |
125 Cel |
3-STATE |
-40 Cel |
Matte Tin (Sn) |
DUAL |
R-PDSO-G5 |
1 |
3.6 V |
1.1 mm |
1.25 mm |
1.65 V |
.0036 mA |
e3 |
30 |
260 |
2 mm |
7001 |
|||||||||||||||||
|
NXP Semiconductors |
BUFFER |
AUTOMOTIVE |
GULL WING |
5 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
2 |
CMOS |
1 |
TR |
1.2 |
1.2/3.3 |
30 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP5/6,.08 |
33.5 ns |
1.7 Amp |
Gates |
.65 mm |
125 Cel |
-40 Cel |
Tin (Sn) |
DUAL |
R-PDSO-G5 |
1 |
3.6 V |
1.1 mm |
1.25 mm |
Not Qualified |
1.1 V |
e3 |
30 |
260 |
2.05 mm |
AUP/ULP/V |
|||||||||||
|
Onsemi |
BUFFER |
INDUSTRIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
6 |
CMOS |
1 |
TR |
2.5 |
3.3 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP14,.25 |
4.4 ns |
24 Amp |
Gates |
.65 mm |
85 Cel |
OPEN-DRAIN |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G14 |
1 |
5.5 V |
1.2 mm |
4.4 mm |
Not Qualified |
2 V |
e4 |
30 |
260 |
5 mm |
LVC/LCX/Z |
||||||||||
|
Texas Instruments |
BUFFER |
INDUSTRIAL |
GULL WING |
8 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
3 |
CMOS |
1 |
TR |
3.3 |
3.3 |
50 pF |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
TSSOP8,.12,20 |
7.9 ns |
32 Amp |
Gates |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
5.5 V |
.9 mm |
2 mm |
Not Qualified |
1.65 V |
.01 mA |
e4 |
30 |
260 |
2.3 mm |
LVC/LCX/Z |
||||||||||
|
Texas Instruments |
BUFFER |
COMMERCIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
6 |
TTL |
1 |
TR |
5 |
5 |
50 pF |
SMALL OUTLINE |
SOP14,.3 |
30 ns |
40 Amp |
Gates |
1.27 mm |
70 Cel |
OPEN-COLLECTOR |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G14 |
1 |
5.25 V |
2 mm |
5.3 mm |
Not Qualified |
4.75 V |
41 mA |
e4 |
30 |
260 |
10.3 mm |
TTL/H/L |
|||||||||
|
Texas Instruments |
BUFFER |
AUTOMOTIVE |
GULL WING |
8 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
3 |
CMOS |
1 |
TR |
3.3 |
3.3 |
50 pF |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
TSSOP8,.12,20 |
7.9 ns |
32 Amp |
Gates |
.5 mm |
125 Cel |
-40 Cel |
Matte Tin (Sn) |
DUAL |
R-PDSO-G8 |
1 |
5.5 V |
.9 mm |
2 mm |
Not Qualified |
1.65 V |
.01 mA |
e3 |
NOT SPECIFIED |
260 |
2.3 mm |
LVC/LCX/Z |
||||||||||
|
Nexperia |
BUFFER |
GULL WING |
5 |
TSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
1 |
CMOS |
AEC-Q100 |
1 |
TR, 7 INCH |
5 |
30 pF |
SMALL OUTLINE, THIN PROFILE |
TSOP5/6,.11,37 |
12.8 ns |
.95 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G5 |
1 |
5.5 V |
1.1 mm |
1.5 mm |
1.6 V |
.01 mA |
e3 |
30 |
260 |
2.9 mm |
LV/LV-A/LVX/H |
||||||||||||||
NXP Semiconductors |
BUFFER |
AUTOMOTIVE |
GULL WING |
5 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
1 |
1.2 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
33.5 ns |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G5 |
3.6 V |
1.1 mm |
1.25 mm |
1.1 V |
2.05 mm |
AUP/ULP/V |
||||||||||||||||||||||||
|
Onsemi |
BUFFER |
INDUSTRIAL |
NO LEAD |
6 |
VSON |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
2 |
CMOS |
1 |
TR |
1.8 |
3.3 |
50 pF |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC6,.04,14 |
10.6 ns |
32 Amp |
Gates |
.35 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM |
DUAL |
S-PDSO-N6 |
1 |
5.5 V |
.55 mm |
1 mm |
Not Qualified |
1.65 V |
100 mA |
e4 |
30 |
260 |
1 mm |
LVC/LCX/Z |
||||||||||
|
Texas Instruments |
BUFFER |
AUTOMOTIVE |
GULL WING |
5 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
1 |
CMOS |
1 |
TR |
3.3 |
3.3 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP5/6,.08 |
9.9 ns |
32 Amp |
Gates |
.65 mm |
125 Cel |
3-STATE |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G5 |
1 |
5.5 V |
1.1 mm |
1.25 mm |
Not Qualified |
1.65 V |
.001 mA |
e4 |
NOT SPECIFIED |
260 |
2 mm |
LVC/LCX/Z |
|||||||||
|
NXP Semiconductors |
BUFFER |
AUTOMOTIVE |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
6 |
CMOS |
1 |
5 |
2/6 |
50 pF |
SMALL OUTLINE |
SOP16,.25 |
26 ns |
4 Amp |
Gates |
1.27 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G16 |
1 |
6 V |
Not Qualified |
2 V |
CMOS-TTL LEVEL TRANSLATOR |
e4 |
30 |
260 |
HC/UH |
||||||||||||||
|
Onsemi |
BUFFER |
MILITARY |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
6 |
CMOS |
1 |
RAIL |
5 |
5/15 |
50 pF |
SMALL OUTLINE |
SOP16,.25 |
140 ns |
Gates |
1.27 mm |
125 Cel |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
1 |
18 V |
1.75 mm |
3.9 mm |
Not Qualified |
3 V |
e3 |
30 |
260 |
9.9 mm |
4000/14000/40000 |
||||||||||||
|
Onsemi |
BUFFER |
GULL WING |
6 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
2 |
CMOS |
1 |
TR |
1.1 |
1.2/3.3 |
30 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP6,.08 |
18.6 ns |
18 Amp |
Gates |
.65 mm |
85 Cel |
OPEN-DRAIN |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G6 |
1 |
3.6 V |
1.1 mm |
1.25 mm |
Not Qualified |
.9 V |
.0009 mA |
e4 |
30 |
260 |
2 mm |
AUP/ULP/V |
||||||||||
|
Texas Instruments |
BUFFER |
AUTOMOTIVE |
GULL WING |
6 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
2 |
CMOS |
1 |
TR |
1.8 |
3.3 |
50 pF |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP6,.11,37 |
8.6 ns |
32 Amp |
Gate |
.95 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G6 |
1 |
5.5 V |
1.45 mm |
1.6 mm |
Not Qualified |
1.65 V |
.01 mA |
e4 |
NOT SPECIFIED |
260 |
2.9 mm |
LVC/LCX/Z |
||||||||||
|
Texas Instruments |
BUFFER |
COMMERCIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
6 |
TTL |
1 |
TR |
5 |
5 |
50 pF |
SMALL OUTLINE |
SOP14,.25 |
30 ns |
40 Amp |
Gates |
1.27 mm |
70 Cel |
OPEN-COLLECTOR |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G14 |
1 |
5.25 V |
1.75 mm |
3.91 mm |
Not Qualified |
4.75 V |
41 mA |
e4 |
30 |
260 |
8.65 mm |
TTL/H/L |
|||||||||
|
Texas Instruments |
BUFFER |
INDUSTRIAL |
NO LEAD |
5 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
1 |
CMOS |
1 |
TR |
1.2 |
1.2/3.3 |
30 pF |
SMALL OUTLINE, VERY THIN PROFILE |
FL6,.047,20 |
19.8 ns |
4 Amp |
Gates |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
DUAL |
R-PDSO-N5 |
1 |
3.6 V |
.6 mm |
1.2 mm |
Not Qualified |
.8 V |
.0009 mA |
e4 |
NOT SPECIFIED |
260 |
1.6 mm |
AUP/ULP/V |
|||||||||
|
Onsemi |
BUFFER |
INDUSTRIAL |
GULL WING |
5 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
1 |
CMOS |
1 |
TR |
1.2 |
1.2/3.3 |
15 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP5/6,.08 |
16.9 ns |
2 Amp |
Gates |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G5 |
1 |
3.6 V |
1.1 mm |
1.25 mm |
Not Qualified |
.9 V |
e3 |
30 |
260 |
2 mm |
HC/UH |
|||||||||||
|
Texas Instruments |
BUFFER |
COMMERCIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
6 |
TTL |
1 |
TR |
5 |
5 |
50 pF |
SMALL OUTLINE |
SOP14,.25 |
30 ns |
40 Amp |
Gate |
1.27 mm |
70 Cel |
OPEN-COLLECTOR |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G14 |
1 |
5.25 V |
1.75 mm |
3.91 mm |
Not Qualified |
4.75 V |
41 mA |
e4 |
30 |
260 |
8.65 mm |
TTL/H/L |
|||||||||
|
Onsemi |
BUFFER |
INDUSTRIAL |
GULL WING |
6 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
2 |
CMOS |
1 |
TR |
1.2 |
1.2/3.3 |
15 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP6,.08 |
17.9 ns |
4 Amp |
Gates |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G6 |
1 |
3.6 V |
1.1 mm |
1.25 mm |
Not Qualified |
.9 V |
e4 |
30 |
260 |
2 mm |
AUP/ULP/V |
|||||||||||
|
Onsemi |
BUFFER |
GULL WING |
8 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
3 |
CMOS |
1 |
TR |
1.85 |
50 pF |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
TSSOP8,.12,20 |
9.2 ns |
32 Amp |
.5 mm |
125 Cel |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
1 |
5.5 V |
.9 mm |
2 mm |
1.65 V |
100 mA |
e3 |
30 |
260 |
2.3 mm |
37WZ |
||||||||||||||
|
Texas Instruments |
BUFFER |
AUTOMOTIVE |
GULL WING |
8 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
3 |
CMOS |
1 |
TR |
1.8 |
3.3 |
50 pF |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
TSSOP8,.12,20 |
7.8 ns |
32 Amp |
Gates |
.5 mm |
125 Cel |
OPEN-DRAIN |
-40 Cel |
Matte Tin (Sn) |
DUAL |
R-PDSO-G8 |
1 |
5.5 V |
.9 mm |
2 mm |
Not Qualified |
1.65 V |
.01 mA |
e3 |
NOT SPECIFIED |
260 |
2.3 mm |
LVC/LCX/Z |
|||||||||
|
NXP Semiconductors |
BUFFER |
AUTOMOTIVE |
GULL WING |
5 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
1 |
CMOS |
1 |
TR |
1.1 |
1.2/3.3 |
30 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP5/6,.08 |
20.7 ns |
1.7 Amp |
Gates |
.65 mm |
125 Cel |
OPEN-DRAIN |
-40 Cel |
Tin (Sn) |
DUAL |
R-PDSO-G5 |
1 |
3.6 V |
1.1 mm |
1.25 mm |
Not Qualified |
.8 V |
e3 |
30 |
260 |
2 mm |
AUP/ULP/V |
||||||||||
|
Texas Instruments |
BUFFER |
MILITARY |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
6 |
CMOS |
1 |
TUBE |
4.5 |
2/6 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
130 ns |
4 Amp |
Gates |
.65 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
6 V |
1.2 mm |
4.4 mm |
Not Qualified |
2 V |
.04 mA |
CMOS-TTL LEVEL TRANSLATOR |
e4 |
30 |
260 |
5 mm |
HC |
|||||||||
Onsemi |
BUFFER |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
BUFFER |
COMMERCIAL |
GULL WING |
14 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
6 |
TTL |
1 |
TR |
5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP14,.3 |
30 ns |
40 Amp |
Gates |
.65 mm |
70 Cel |
OPEN-COLLECTOR |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G14 |
1 |
5.25 V |
2 mm |
5.3 mm |
Not Qualified |
4.75 V |
45 mA |
e4 |
30 |
260 |
6.2 mm |
LS |
|||||||||||
|
Texas Instruments |
BUFFER |
INDUSTRIAL |
BALL |
6 |
VFBGA |
RECTANGULAR |
UNSPECIFIED |
NO |
YES |
2 |
CMOS |
1 |
TR |
1.8 |
3.3 |
50 pF |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,20 |
8.6 ns |
32 Amp |
Gates |
.5 mm |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-XBGA-B6 |
1 |
5.5 V |
.5 mm |
.9 mm |
Not Qualified |
1.65 V |
.01 mA |
e1 |
NOT SPECIFIED |
260 |
1.4 mm |
LVC/LCX/Z |
||||||||||
|
Texas Instruments |
BUFFER |
AUTOMOTIVE |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
6 |
CMOS |
1 |
TR |
2.5 |
3.3 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP14,.25 |
18 ns |
16 Amp |
Gates |
.65 mm |
125 Cel |
OPEN-DRAIN |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G14 |
1 |
5.5 V |
1.2 mm |
4.4 mm |
Not Qualified |
2 V |
.02 mA |
e4 |
NOT SPECIFIED |
260 |
5 mm |
LV/LV-A/LVX/H |
|||||||||
|
Texas Instruments |
BUFFER |
AUTOMOTIVE |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
6 |
CMOS |
1 |
TR |
1.8 |
3.3 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP14,.25 |
5.6 ns |
24 Amp |
Gates |
.65 mm |
125 Cel |
OPEN-DRAIN |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G14 |
1 |
5.5 V |
1.2 mm |
4.4 mm |
Not Qualified |
1.65 V |
.04 mA |
e4 |
NOT SPECIFIED |
260 |
5 mm |
LVC/LCX/Z |
|||||||||
|
Texas Instruments |
BUFFER |
AUTOMOTIVE |
GULL WING |
8 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
3 |
CMOS |
1 |
TR |
1.8 |
3.3 |
50 pF |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
TSSOP8,.12,20 |
7.8 ns |
32 Amp |
Gates |
.5 mm |
125 Cel |
OPEN-DRAIN |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G8 |
1 |
5.5 V |
.9 mm |
2 mm |
Not Qualified |
1.65 V |
.01 mA |
e4 |
NOT SPECIFIED |
260 |
2.3 mm |
LVC/LCX/Z |
Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.
Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.
Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.
Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.
Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.
Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.